• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.36-39
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• 1997

In this paper, we described an approach to design of precision optical system for visual inspection of solder joint defects of SMC(surface mount components) on PCBs(Printed Circuit Board). The illumination system, consisting of three tiered LED lamps and one main camera and four side view camera, is implemented to generated iso-contour on the solder joint according to gradient of the soldered surface. We analyze LED design parameter such as incident angle, diameter of LED ring, and so on to acquire uniform illumination.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2004.05a
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• pp.286-289
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• 2004

본 연구는 U사의 SMD Wave Soldering 공정을 최적화하기 위해 납땜에 관련된 PCB의 여러 계수형 특성들을 종합하여 계량화한 후 분석한 사례이다. SMD Wave Soldering 공정은 PCB 불량의 80% 이상을 결정하는 중요 공정으로 SMD 작업 불량으로 인한 재작업 등 각종 문제점들을 내포하고 있다. 그러나 검사 결과 미납, 냉납, 과납, 쇼트 등의 발생 건수 형태의 계수형 데이터가 집계되어 이를 체계적으로 분석하여 공정을 개선하는데 어려움이 있어 불량 유형별로 보다 세분화된 평가표를 작성하여 먼저 데이터를 계량화한 후 이를 기초로 공정 개선을 실시하였다.

• Proceedings of the Korean Institute of Intelligent Systems Conference
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• 2004.04a
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• pp.571-575
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• 2004

인쇄회로기판(PCB)을 조립 또는 검사하는 장비의 작업 프로그램 작성을 위해서는, 납땜 패드의 위치와 크기에 대한 데이터가 필요하다. CAD 파일, 거버 파일 등을 사용하여 패드를 추출하는 방법이 많이 사용되고 있으나, 본 논문은 이미지 스캐너를 사용하여 추출하는 방법을 새로이 제안한다. 제안된 방법은 통계적 영상 처리를 적용하여, 기존의 일반적인 영상처리 방식보다 기판 별 패드 색상의 차이에 강인하다. 실제 PCB 에 대한 실험을 통하여 제안 방법의 성능을 검증한다. 제시된 방법은, CAD 파일과 거버 파일의 확보가 어려운 임가공 업체 등의 생산현장에서 사용될 수 있다.

• Proceedings of the Korea Institute of Convergence Signal Processing
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• 2005.11a
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• pp.369-372
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• 2005

산업체에서 사용되는 BLDC 모터 제어보드의 경우에는 대량 생산을 통하여 제작하며, 제작과정에서 발생한 불량 제어보드는 모터의 초기 기동실패와 고속회전시의 소음 및 화재 발생 등의 원인일뿐만이 아니라 이를 사용하여 응용제품을 생산하는 업체의 품질관리면에서 제어보드의 이상유무 확인이 반드시 필요하다. 일반적인 모터 제어보드의 이상 유무는 육안 및 소음에 의한 방법으로 모토의 기동실패나 고속 회전을 통한 소음등으로부터 경험에 의해 판단한다. 그러나 고속 회전시 발생되는 소음으로 모터 제어보드의 이상유무를 판단하게 되면 이상유무 판단에 필요한 시간이 길어져 대규모 생산과정에 적합하지 않을 뿐만아니라 작업자의 경험에 의존하게 됨으로써 생산성에 지장을 주게된다. 또한 검사시간을 줄이기 위하여, 저속 회전만으로 이상유무를 판단하고자 할 경우 소음정도가 약해 이상유무를 판단하기가 매우 어렵고 더욱더 숙련된 검사자를 필요로 하게 되므로 생산공정에 자동검사기의 도입이 필요하디. 본 논문은 BLDC 모터 제어기의 이상이 발생할 수 있는 경우를 고찰하고, 이러한 BLDC 모터 제어보드의 이상상태가 납땜불량 및 소자 파괴 의하여 입${\cdot}$출력이 비정상적으로 이루어 질 경우의 전류신호와 정상일 때의 전류신호를 비교분석한 후 이를 검출할 수 있는 아날로그 회로를 구현하고 실험을 통하여 검증을 하였다. 또한 이러한 BLDC모터 제어기의 검사기를 아날로그 회로로 구현할 경우의 주의점을 고찰한다.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.5
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• pp.9-18
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• 1998

The components with J-lead. which are more integrated and smaller than ones with Gull-wing. are rapidly being used in electronic board such as the PCB, for they have the advantage of occupying a small space compared to the other components. However, the development of inspection system for these new components is not so rapid as component development. Component-inspection with J-lead using vision system is difficult because they are hidden from camera optical axis. X-ray inspection, which has the advantage of inspecting the inside of solder state, is used to J-lead inspection. However. it is high cost and dangerous by leaking out X-ray compared to vision system. Therefore, in this paper, we design vision system suited to J-lead inspection and then propose algorithm which have flexibility in mount and rand error.

• Korean Journal of Clinical Laboratory Science
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• v.41 no.2
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• pp.67-75
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• 2009

In order to provide basic data for the prevention of adverse effects of lead on health, we examined lead levels in the blood of 30 handicapped workers employed in manufacturing electronic components in Seoul from 2002 to 2008. The average lead level in the blood of all the subjects was $4.79{\pm}4.32{\mu}g/dL$ in females, $2.64{\pm}2.31{\mu}g/dL$ in males, and $3.88{\pm}3.75{\mu}g/dL$ in total. Lead levels examined in this study were significantly lower than other investigators study have reported. The average lead level from personal exposure of the subjects was $1.44{\pm}0.91mg/m^3$ in the workplace. The relation between blood lead levels and personal exposure was a simple linear regression; it's equation was "Lead level in blood = 6.04 - 1.92 lead level by personal exposure".

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.1549-1552
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• 1997

In this paper, a optimal algorithm that can produce the FOV is proposed in terms of using the Kohonen's Self-Organizing Map(KSOM). A FOV, that stands for "Field Of View", means maximum area where a camera could be wholly seen and influences the total time of inspection of vision system. Therefore, we draw algorithm with a KSOM which aims to map an input space of N-dimensions into a one-or two-dimensional lattice of output layer neurons in order to optimize the number and location of FOV, instead of former sequentila method. Then, we show demonstratin through computer simulation using the real PCB data. PCB data.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.33B no.11
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• pp.53-61
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• 1996

In this paper, efficient techniques for solder joint inspection have been described. Using three layers of ring shaped LED's with different illumination angles, three frames of images are sequentially obtained. From these images the regions of interest (soldered regions) are segmented, and their characteristic features including the average gray level and the percentage of highlights - refereed to as 2D features - are extracted. Based on the backpropagation algorithm of neural networks, each solder joint is classified intor one of the pre-defined types. If the output value is not in the confidence interval, the distribution of tilt angles-referred to as 3D features - is claculated, and the solder joint is classified based on the bayes classfier. The second classifier requires more computation while providing more information and better performance. The proposed inspection system has been implemented and tested with various types of solder joints in SMDs. The experimental results have verified the validity of this scheme in terms of speed and recognition rate.

• 제어로봇시스템학회:학술대회논문집
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• 1996.10b
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• pp.109-112
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• 1996

The more integrated and smaller SMD are needed, new solder joints packaging technologies are developed in these days such as BGA(Ball Grid Array), Flip Chip, J-lead etc. But, it's unable to inspect solder joints in those devices by visual inspection methods, because they are hided by it's packages. To inspect those new SMD packages, an X-ray system for acquiring a cross-sectional image of a arbitrary plane is necessary. In this paper, an analysis for designing X-ray cross sectional imaging system is presented including the way for correcting the distortion of image intensifier. And we show computer simulation of that system with a simple PCB model to show it's usefulness in applying PCB solder joint inspection.

• 제어로봇시스템학회:학술대회논문집
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• 1996.10b
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• pp.117-120
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• 1996

In this paper, a new approach to acquire the cross-sentional image for automatic solder joint inspection of double-sided PCB using X-ray source is presented. We designed the apparatus with fixed X-ray source to realize the cross-sectional image by tunning object and detector synchronously. The cross-sectional images are captured at several view angle of X-ray source, the geometric image distortions caused by view angle and the shape of image intensifier are compensated. The precision variation of cross-sectional image by the change of view angle was investigated. Also we acquired the cross-sectional image to the solder joint of double-sided PCB and reconstructed the shape of solder joint.