• Title/Summary/Keyword: 납땜

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Design and Fabrication of the Digital Iron Using the Micro-processor (마이크로프로세서를 이용한 디지털 전기인두기의 설계 및 제작)

  • An, Yang-Ki;Yoon, Dong-Han
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.38 no.5
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    • pp.33-41
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    • 2001
  • The digital iron using ${\mu}$ processor is designed and compared experimentally with the conventional analog Iron. Designed digital iron shows two improved temperature control characteristics. First, the reduction of the difference error between the user setting temperature and the real temperature of the iron tip is examined. When the iron temperature is set to $200[^{\circ}C]$, $300[^{\circ}C]$, $400[^{\circ}C]$, $480[^{\circ}C]$ at the environmental temperatures of $-5[^{\circ}C]$ and $25[^{\circ}C]$, it is examined that the tip temperature is very stable and its error is within ${\pm}1.8[^{\circ}C]$. Second, it is conformed that the temperature fluctuation of the iron due to the soldering is reduced manifestly. When the temperature of iron tip is varied from $200[^{\circ}C]$ to $480[^{\circ}C]$ with 1[g] solder, the temperature errors of the analog iron are measured to be from $6[^{\circ}C]$ to $10[^{\circ}C]$. In case of designed digital iron, however, these errors are much smaller and they are from $2[^{\circ}C]$ to $5[^{\circ}C]$.

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A Study on the Microstructure and Adhesion Properties of Sn-3.5Ag/Alloy42 Lead-Frame Solder Joint (Sn-3.5Ag/Alloy42 리드프레임 땜납접합의 미세조직과 접합특성에 관한 연구)

  • Kim, Si-Jung;Bae, Gyu-Sik
    • Korean Journal of Materials Research
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    • v.9 no.9
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    • pp.926-931
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    • 1999
  • The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, $Ag_3Sn and Cu_6Sn_5$ phases in the matrix Sn and $1~2\mu\textrm{m}$ thick $Cu_6Sn_5$ phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5Agl Alloy42, only AgJSn phase of low density in the matrix Sn and $0.5~1.5\mu\textrm{m}$ thick $FeSn_2$, phase at the interface of solder/leadframe were formed. Comparing to Cu, Alloy42 showed wider area of spread and smaller contact angle, thus better wet­tability. But shear strength and ductility of Alloy 42 solder joints were only 33% and 75% of those of Cu, respectively After aging at $180^{\circ}C$ for 1 week, $\xi-Cu_3Sn$ layer on $\eta-Cu_6Sn_5$ layer was formed on Cu lead-frame, while coarsened cir­cular $Ag_3Sn$ phase in the matrix and thickened $FeSn_2$, at the interface were formed on Alloy42 lead- frame.

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The Effects of Thermal Degradation and Creep Damage on the Microstructure and Composition of the Carbides in the CrMo Steels for Power Plant (발전 설비용 CrMo강의 탄화물 구조와 조성 변화에 미치는 열화 및 크리프 손상의 영향)

  • Ju, Yeon-Jun;Hong, Gyeong-Tae;Lee, Hyeon-Ung;Sin, Dong-Hyeok;Kim, Je-Won
    • Korean Journal of Materials Research
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    • v.9 no.10
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    • pp.1018-1024
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    • 1999
  • The effects of operating temperature and stress on degradation of components in high temperature steam generator were investigated. Several 2.25CrlMo tubes which had operated over 20 years and an unused 9CrlMoVNb tube were tested. For the former samples, the amount of $\textrm{M}_{6}\textrm{C}$ carbide and its size are increased with the aging or operating time. The precipitation behavior of carbides ($\textrm{M}_{2}\textrm{O}$, $\textrm{M}_{6}\textrm{C}$) is changed with the operating temperature of the tubes. However, unused 9CrlMoVNb samples show a different carbide precipitation process due to high chromium, vanadium, and niobium contents. The amount of Cr-rich $\textrm{M}_{23}\textrm{C}_{6}$ carbide is significantly increased with aging time, but that of $\textrm{M}_{6}\textrm{C}$ type carbide is rarely changed with aging time at elevated temperatures.

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