• Proceedings of the Korean Society for Agricultural Machinery Conference
• /
• 2017.04a
• /
• pp.75-75
• /
• 2017

3륜 승용관리기는 4륜 승용관리기에 비하여 작업기를 복부에 장착함으로 작업의 정밀도, 편이성, 관측의 용이성 향상과 함께 지상고 제고, 차폭 조절, 조향 등의 성능 개선을 기할 수 있다. 국내에서는 3륜 승용관리기용 복부 장착 부속작업기가 거의 개발되어 있지 않으며, 특히 두류 재배에 있어서 일관기계화 작업을 위한 관리작업기의 개발이 매우 필요한 실정이다. 콩의 순 지르기 작업은 콩이 지나친 생육을 한 경우 미리 줄기의 윗부분을 제거하는 저심처리를 해주면 곁가지들의 왕성한 생육을 유도하여 많은 꼬투리를 얻고 쓰러짐도 줄어들어 수량을 높일 수 있다. 순 지르기 작업은 보통 낫이나 배부식 예취기를 이용하여 작업함으로 노동력이 많이 들고 작업부담이 심하여 개선이 필요한 실정이다. 따라서 본 연구는 3륜 승용관리기에 적합한 복부장착형의 순 지르기 작업기를 설계 제작하였다. 3륜 승용관리기용 순 지르기 작업기는 승용관리기의 복부 PTO에서의 구동력 전달을 위한 연결 조인트, 중간축, 기어 전동기구, 구동축으로 구성된 동력전달부, 2 조의 원판형 작업 날, 다양한 조간거리에 적응을 위한 조간조정 나사부, 3륜 승용관리기에의 부착을 위한 프레임 및 부착보조 작업기 이동용 바퀴장치 등으로 구성 설계 제작하였다. 원판형 칼날은 시판 중인 예취기의 외경 305 mm, 칼날 톱니 수 90개의 초경 비트 부착 날을 사용하였다. 작업 날의 승강높이는 150~540 mm 범위로 조절하도록 하였다. 조간거리의 조절범위는 수동나사에 의하여 660~860 mm 범위로 무단조절 할 수 있도록 하였다. 순 지르기 작업기는 3륜 승용 관리기 복부의 평행링크에 부착되므로 작업기의 이동 및 부착 편이를 위하여 이동용 바퀴를 설치하였다. 제작된 순 지르기 작업기의 크기는 길이${\times}$폭${\times}$높이가 $514{\times}1138{\times}810mm$, 중량은 약 100 kg으로 제작되었다.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.40 no.11
• /
• pp.979-986
• /
• 2016

The tripod shafts of constant-velocity joint are used in both the trains KTX and KTX-sanchon. It is an important component that connects the motor reduction unit and the axle reduction unit in a power bogie. The tripod shaft not only transmits drive and brake torque in the rotational direction, but also slides in the axial direction. If the drive system is loaded with an excessive torque, the fuse part of the shaft will be fractured firstly to protect the other important components. In this study, a rig was developed for conducting torsion tests on the tripod shaft, which is a type of mechanical fuse. The tripod shafts were subjected to torsional fracture test and torsional fatigue test on the rig. The weak zone of the tripod shaft was identified, and its fatigue life was predicted using finite element analysis (FEA). After analyzing the FEA results, design solutions were proposed to improve the strength and fatigue life of the tripod shaft. Furthermore, the deterioration trend and time for failure of the tripod shaft were verified using the hysteresis loops which had been changed with the advancement of the torsional fatigue test.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.2
• /
• pp.43-50
• /
• 2009

Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.18-18
• /
• 2007

지난 수년 동안 Sn-3.0Ag-0.5Cu 합금은 전자산업의 표준 무연솔더 조성으로 전자제품의 제작에 사용되어져 왔으며, 그 신뢰성도 충분히 검증되어 대표적인 무연 솔더 조성으로의 입지를 굳혀왔다. 그러나 전자제품의 mobile화에 따른 내충격 신뢰성에 대한 요구와 최근의 급격한 Ag 가격의 상승은 Ag 함량의 축소에 의한 원가절감을 요청하게 되었으며, 이에 따라 소량의 Ag를 함유하는 솔더 조성 개발에 대한 연구가 산업 현장을 중심으로 절실히 요청되고 있다. Sn-Ag-Cu의 3원계 함긍에서 Ag는 합금의 융점을 낮추고, 강도와 같은 합금의 기계적 특성을 증가시키는 한편, 모재에 대한 합금의 젖음성을 향상시키는데 필수적인 원소로 인식되고 있다. 따라서 Sn-Ag-Cu의 3원계 함금에서 Ag의 함량을 감소시키게 되면, 합금액 액상선 온도와 고상선 온도가 벌어져 pasty range(또는 mush zone)가 증가하게 되고, wettability도 감소하게 되어 솔더 합금으로서의 요구 특성을 많이 상실하게 된다. 또한 Ag 함량을 감소시키게 되면 합금의 elongation이 향상되면서 내 impact 수명이 향상되는 효과를 볼 수 있으나, 합금의 creep 특성 및 기계적인 강도는 감소하면서 열싸이클링 수명은 감소하는 경향을 나타내게 된다. 따라서 솔더 합금의 내 impact 수명과 열싸이클링 수명을 동시에 만족시키지 위해서는 Ag 함량을 최적화하기 위한 고려가 필요하며, 합금원소에 대한 연구가 요청된다고 하겠다. 한편 Ag의 함량을 3wt.% 이상으로 첨가할 경우에도 비교적 느린 응고 속도에서는 조대한 판상의 $Ag_3Sn$ 상을 형성하는 경향이 있어 외관 물량을 야기 시킬 가능성이 매우 커지는 현상도 보고되고 있다. 따라서 Ag의 첨가량을 최적화 하면서 솔더 재료로서의 특성을 계속적으로 유지하기 위해서는 제 4 원소의 함유가 필수적이라고 할 수 있다. 본 연구에서는 Sn-Ag-Cu계에 첨부하는 제 4원소로서 In을 선택하였다. 비록 In은 Ag보다 고가이기 때문에 산업적인 적용을 위한 솔더 합금 원소로는 거의 각광받지 못했으나, 본 연구의 결과로는 In은 매우 소량 첨가할 경우에도 Sn-Ag-Cu계 합금, 특히 소량의 Ag를 함유하는 Sn-Ag-Cu계 합금의 wettabilty와 기계적 특성 향상에 매우 효과적임을 알 수 있었다. 결론적으로 본 연구를 통해 구현된 Sn-Ag-Cu-In계 최적 솔더 조성의 경우 Sn-3.0Ag-0.5Cu의 표준 조성에 비하여 약 18%의 원자재 가격 절감을 도모할 수 있을 것으로 예상되는 한편. Sn-3.0Ag-0.5Cu에 유사하거나 우수한 wettability 특성을 나타내었고. Sn-1.0Ag-0.5Cu 또는 Sn-l.2Ag-0.5Cu-0.05Ni 조성보다는 월등히 우수한 wettability 특성을 나타내었다. 더구나 Sn-Ag-Cu-In계 최적 솔더 조성은 합금의 강도 저하는 최소화 시키면서 합금의 elongation은 극적으로 향상시켜 합금의 toughness 값이 매우 우수한 특성을 가짐을 알 수 있었다. 이렇게 우수한 toughness 값은 솔더 조인트의 대표적 신뢰성 요구 특성인 열싸이클링 수명과 내 impact 수명을 동시에 향상시킬 수 있을 것으로 예상된다. 요컨대 본 연구를 통해 구현된 Sn-Ag-Cu-In계 솔더 조성은 최적 솔더 조성에서 요구되는 4가지 인자, 즉, 저렴한 원재료 가격, 우수한 wettability 특성, 합금 자체의 높은 toughness, 안정하고 낮은 성장 속도의 계면 반응층 생성을 모두 만족시키는 특징을 가짐으로서 기존 무연솔더 조성의 새로운 대안으로 자리 잡을 것으로 기대된다.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.3
• /
• pp.17-26
• /
• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.

• Composites Research
• /
• v.28 no.4
• /
• pp.191-196
• /
• 2015

In this study, the static analysis and experiment were carried out on DCB specimens manufactured with aluminum foam in order to investigate the fracture toughness at the adhesive joint of the structure bonded with adhesive. In case of static analysis, all specimen models were shown to have the maximum reaction force when the forced displacement proceeded as much as 5 mm. The maximum reaction forces became 0.25 kN, 0.28 kN and 0.5 kN respectively in cases of specimen thicknesses of 35 mm, 45 mm and 55 mm. Two specimens in case of static experiment were selected to verify these analysis results. The maximum reaction forces were shown when the forced displacement proceeded as much as 5 to 6 mm. The maximum reaction forces became 0.22 kN and 0.3 kN respectively in cases of specimen thicknesses of 35 mm and 45 mm. By comparing the derived results, it could be shown that there was not much difference between the data of analyses and experiments. Therefore, It is inferred that the study data can be secured with only analysis by no extra experimental procedure. It is thought that the mechanical properties at the structure bonded of DCB with the type of mode III can be analyzed systematically.

• Journal of Korean Society of Forest Science
• /
• v.111 no.2
• /
• pp.287-301
• /
• 2022

This study aims to propose a crane-tip control method to intuitively control the end-effector vertically or horizontally for improving the crane work efficiency and to confirm the control performance. To verify the control performance based on experimental variables, a laboratory-scale crane was manufactured using an electric cylinder. Through a forward and reverse kinematics analysis, the crane was configured to output the position coordinates of the current crane-tip and the joint angle at each target point. Furthermore, a method of generating waypoints was used, and a dead band using lateral boundary offset (LBO) was set. Appropriate parameters were selected using bang-bang control, which confirmed that the number of waypoints and LBO radius were associated with positioning error, and the cylinder speed was related to the lead time. With increased number of waypoints and decreased LBO radius, the positioning error and the lead time also decreased as the cylinder speed decreased. Using the proportional control, when the cylinder velocity was changed at every control cycle, the lead time was greatly reduced; however, the actual control pattern was controlled by repeating over and undershoot in a large range. Therefore, proportional control was performed by additionally applying velocity gain that can relatively change the speed of each cylinder. Since the control performed with in a range of 10 mm, it was verified th at th e crane-tip control can be ach ieved with only th e proportional control to which the velocity gain was applied in a control cycle of 20 ms.

• Journal of the Society of Disaster Information
• /
• v.18 no.3
• /
• pp.542-549
• /
• 2022

Purpose: Pipes are widely used as applied devices in many industrial fields such as machinery, electronics, electricity, and plants, and are also widely used in safety-related fields such as firefighting and chemistry. With the diversification of products, the importance of technology in the piping field is also increasing. In particular, when changing the existing copper pipe to stainless steel, it is necessary to evaluate safety and flow characteristics through structural analysis or flow analysis. Method: This study investigated the structural stability of the 6.35 and 15.88 socket models, which are integrated insert type connectors developed by a company, using FEM. For structural analysis, HyperMesh as pre-processor, HYPER VIEW as post-processor, and LS-DYNA as solver were used. Result: In the case of 6.35 socket, the maximum stresses at hook, holder and hinge were 95.02MPa, 19.59MPa and 44.01MPa, respectively, and in case of 15.88 socket, it was 127.7 MPa, 40.09MPa and 45.23MPa, respectively. Conclusion: Comparing the stress distribution of the two socket models, the stress in the 15.88 socket, which has a relatively large outer diameter, appears to be large overall, but it is significantly lower than the yield stress of each material, indicating that there is no problem in structural safety in both models.