• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.35-41
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• 2022

In the era of Fifth-Generation (5G), technology requirements such as Artificial Intelligence (AI), Cloud computing, automatic vehicles, and smart manufacturing are increasing. For high efficiency of electronic devices, research on high-intensity circuits and packaging for miniaturized electronic components is important. A solder paste which consists of small solder powders is one of common solder for high density packaging, whereas an electroplated solder has limitation of uniformity of bump composition. Researches are underway to improve wettability through the addition of nanoparticles into a solder paste or the surface finish of a substrate, and to suppress the formation of IMC growth at the metal pad interface. This paper describes the principles of improving the wettability of solder paste and suppressing interfacial IMC growth by addition of nanoparticles.

• Tribology and Lubricants
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• v.28 no.2
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• pp.56-61
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• 2012

In order to investigate the possibility of Ni-Al based intermetallics coating onto aluminum substrate, the coating process for induction heating has been evaluated by microscopically analyzing the intermetallic layers coated at temperatures lower than the melting temperature of aluminum. The coating layers were divided into two parts with different microstructure along the depth. Hard $NiAl_3$ layer was found at lower parts of the coatings near the interface with aluminum substrate. This layer was formed by the diffusion of aluminum atoms from the substrate into the coating layer across the interface during the induction heating. Meanwhile, at the upper parts of the coating near the surface, a large amount of un-reacted Ni was still remained and surrounded by several Ni-Al based intermetallic compounds, such as $Ni_3Al$, NiAl and $Ni_2Al_3$ formed by the lattice diffusion.

• Journal of Korea Foundry Society
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• v.15 no.6
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• pp.596-603
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• 1995

${\gamma}-TiAl$ 금속간화합물에 크롬과 질소첨가의 영향을 관찰하기 위하여 첨가량에 따른 열처리 전후의 미세조직과 기계적 성질을 비교 분석하였다. 그 결과 질소첨가량이 증가할수록 결정립이 미세화되고 항복강도가 증가되었으며 크롬과 질소의 동시첨가의 경우가 이들의 효과가 현저하였다. 또한 이들 원소의 첨가로 $Ti_2AlN$이 제3상으로 생성되어 열처리시 ${\alpha}_2/{\gamma}$층상조직의 안정화를 보였으며 첨가량을 다량으로 하였을 때 결정립의 크기가 급격히 감소함에도 상온연성이 감소되는 것은 $Ti_2AlN$의 크기에 기인한 것으로 판단된다. 적정량의 크롬과 질소를 동시첨가하여 열처리시 상온연성 및 항복강도가 향상되었다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.265-269
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• 2003

Sn(또는 SnAg)/Ni(P)와 Sn/Cu 계의 열사이클동안 형성되는 금속간화합물에 의해 유기되는 응력의 변화를 in-situ로 관찰하였다. Sn(또는 SnAg)/Ni(11.7P) 박막은 계면반응으로 인해 $Ni_3P$와 $Ni_3Sn_4$ 상이 형성되고 이때 인장응력이 발생하였으며, 한편, Sn(또는 SnAg)/Ni(3P) 박막의 계면반응에 의해서는 동일한 $Ni_3P$와 $Ni_3Sn_4$ 상이 형성됨에도 불구하고 압축응력이 발생하였다. SmAg를 사용할 때 형성되는 $Ag_3Sn$이 응력에 미치는 영향은 거의 없었다. Sn/Cu 박막의 경우는 계면반응 초기에는 인장응력이 발생하였고 어느 정도 이상 반응이 진전됨에 따라 압축응력이 발생하였고 최종적으로 $Cu_3Sn$ 상이 형성되었다. 초기의 인장응력은 계면에서 원자들의 intermixing 베 의한 것이고 압축응력은 Sn 방향으로 일방향 성장하는 금속간화합물 형성에 기인한다.

• Tribology and Lubricants
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• v.27 no.1
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• pp.1-6
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• 2011

The possibility of Cu-Al-Ni intermetallic coating on the mild steel through the combustion synthesis has been investigated. In particular, the effect of the ball milling energy on the microstructure of the coating layer was examined to obtain the best coating condition. Experimental results show that Cu-Al-Ni powder compact was explosively synthesized and successfully coated with the steel matrix. It was revealed that the formation of $Cu_9Al_4$ intermetallic decreased with increase in the ball milling energy. This result supports that the high energy ball milling would be effective for obtaining the most suitable microstructure for Cu-Al-Ni coating layer. However, the excessive ball milling energy seems to decrease the bonding strength between the coating layer and the matrix.

• Journal of the Korean institute of surface engineering
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• v.22 no.1
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• pp.3-9
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• 1989

The intermetallic compount formation, growth rections, and growth kinetices as functions of the aging temperaturess, time, and the condition of substarte have invedtigted in the Sn/Cu and Sn/Ni bimetal couples. The η'-phase (Cu6Sn5) and $\delta$-phase (Ni3Sn4) were only found to grow at 20 and $70^{\circ}C$in the Sn/Cu and Sn/Ni bimetallic coples repectively. Above that temperatures, all other compounds were formed in sequence of high Sn content plase and the metastable Cu41Sn11 was formed at agend $200^{\circ}C$. The ectivation energy for the growth of intermetallic compounds was 14.7Kxal/mole in the Sn/Cu interface and 26.7Kcal/mole in the Sn/Ni interface.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.132-132
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• 2012

아연-마그네슘 합금은 기존의 대표적 강판 코팅 소재인 아연보다 뛰어난 내식성으로 인해 차세대 강판 코팅 소재로서 주목받고 있다. 그러나 이러한 아연-마그네슘 합금을 아연의 대체 소재로 사용하기 위해서는 내식성 이외에도 사용 환경에 적합한 일정 수준 이상의 기계적 특성이 반드시 필요하다. 따라서 본 연구에서는 마그네슘 함량을 달리하여 아연-마그네슘 합금을 제조하였으며, 이를 대상으로 경도, 압축강도 등의 특성 평가를 실시하여, 아연-마그네슘 합금의 기계적 특성에 미치는 금속간화합물의 영향을 분석하였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.11a
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• pp.144-145
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• 1994

• 한국전자현미경학회:학술대회논문집
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• 1997.11a
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• pp.39-40
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• 1997

• Journal of the Korean Society for Heat Treatment
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• v.20 no.6
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• pp.329-339
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• 2007