• Title/Summary/Keyword: 균열진전수명

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A Study on Fatigue Crack Growth Parameters for Fatigue Life Assessment based on Fracture Mechanics (파괴역학 기반 피로 수명 평가를 위한 피로 균열 진전 파라미터에 관한 연구)

  • Kim, Hyeon-Su;Park, Tae-Jong;Lee, Dong-Ju;Shin, Sang-Beom;Kim, Myung-Hyun
    • Journal of Welding and Joining
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    • v.35 no.1
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    • pp.61-67
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    • 2017
  • Recent studies on the fatigue assessment of high strength steel weld based on the fracture mechanics have frequently raised the problems related to the conservatism in the fatigue crack growth rate specified in the relevant design code. The purpose of this study is to evaluate the effect of the fatigue crack growth parameter on the fatigue life for the low carbon steel weld. In order to do it, the fatigue tests with the constant stress ratio were performed to evaluate the fatigue crack growth rate in the butt weld of SM490. And the fatigue crack growth parameters of the weld were evaluated in accordance with ASTM E647. From the comparative fatigue assessment results, it was found that the fatigue crack growth rate specified in the relevant design code was too conservative to estimate the residual fatigue life of welded structure. So, in order to get the more reliable results, it was recommended that the fatigue life estimation based on the fracture mechanics be performed with the fatigue crack growth parameter specified by test.

An Effect of Shot Velocity of Shot-peening on A Property of Growth Behavior of Fatigue Crack for Spring Steel (스프링강의 피로크랙진전 특성에 미치는 쇼트피닝 투사속도의 영향)

  • Park, Kyoung-Dong;No, Young-Sok
    • Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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    • 2002.10a
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    • pp.341-346
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    • 2002
  • In this study, an effect that compressive residual stress formed by shot-peening the surface of spring steel(JISG SUP-9) at each shot velocity(1800, 2200, 2600, 3000rpm) on the fatigue crack growth property and threshold stress intensity factor, ${\Delta}K_{th}$, was examined. Followings are the result (1) Compressive residual stress on surface of specimen was determined at each -601 MPa(1800rpm), -638 MPa(2200rpm), -587 MPa (2600rpm), -550 MPa(3000rpm) by shot velocity of shot peening and threshold stress intensity factor, ${\Delta}K_{th}$, fatigue crack growth rate, da/dN, on fatigue crack growth is obstructed by the compressive residual stress was determined at each $5.619\;MPa\sqrt{m}$(Un-peening), $8.319\;MPa\sqrt{m}$(1800rpm), $8.797\;MPa\sqrt{m}$(2200rpm), $7.835\;MPa\sqrt{m}$(2600rpm), $7.352\;MPa\sqrt{m}$(3000rpm) (2) Existing compressive residual stress by effect of shot velocity of shot-peening on relation of crack length. a, and number of cycle, N, was 2 times progressed in case of 2200rpm than specimen of Un-peening on fatigue life. And fatigue life was 1.6 times progressed incase of 3000rpm by Over peening. (3) Fatigue life of Material on Paris' law, $da/dN=C({\Delta}K)^m$, that effect of material constant, C, and fatigue crack growth exponent, m, was influenced by effect of. C and m.

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Effects of Surface Finishes on the Low Cycle Fatigue Characteristics of Sn-based Pb-free Solder Joints (금속패드가 Sn계 무연솔더의 저주기 피로저항성에 미치는 영향)

  • Lee, Kyu-O;Yoo, Jin
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.3
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    • pp.19-27
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    • 2003
  • Surface finishes of PCB laminates are important in the solder joint reliability of flip chip package because the types and thicknesses of intermetallic compound(IMC), and compositions and hardness of solders are affected by them. In this study, effects of surface finishes of PCB on the low cycle fatigue resistance of Sn-based lead-free solders; Sn-3.5Ag, Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag-XBi(X=2.5, 7.5) and Sn-0.7Cu were investigated for the Cu and Au/Ni surface finish treatments. Displacement controlled room temperature lap shear fatigue tests showed that fatigue resistance of Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag and Sn-0.7Cu alloys were more or less the same each other but much better than that of Bi containing alloys regardless of the surface finish layer used. In general, solder joints on the Au/Ni finish showed better fatigue resistance than those on the Cu finish. Cross-sectional fractography revealed microcracks nucleation inside of the interfacial IMC near the solder mask edge, more frequently on the Cu than the Au/Ni surface finish. Macro cracks followed the solder/IMC interface in the Bi containing alloys, while they propagated in the solder matrix in other alloys. It was ascribed to the Bi segregation at the solder/IMC interface and the solid solution hardening effect of Bi in the $\beta-Sn$ matrix.

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