• The Korean Journal of Pesticide Science
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• v.6 no.3
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• pp.175-182
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• 2002

This experiment was conducted to investigate the effects of acid rain in spraying copper hydroxide 77% wettable power(WP) on leaf surface morphology and crop injury of the garlic(Allium sativum L.). Leaf chlorosis, hooked leaves, wrinkled epidermal cells and increased stomata open of garlic were induced by foliar application of simulated acid rain(SAR). It was become to be severe in application of copper hydroxide solution after application of SAR, but those yield of garlic was not significantly different from the untreated control. Leaf chlorosis was sharply increased above 100 ppm of copper ions. Amount of solved copper ions in copper hydroxide solution was remarkably increased below pH 5.5 and the residue in garlic leaves was significantly increased by application of copper hydroxide solution after spraying SAR compared with application of copper hydroxide solution only. When calcium carbonate was applied together with copper hydroxide leaf chlorosis was less than copper hydroxide only.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.326-326
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• 2011

반도체 소자의 집적화/소형화에 따라, 낮은 비저항을 가진 구리(Cu)를 이용한 배선공정에 관한 연구가 활발하게 진행되고 있다. 구리배선 공정에 있어 전기 도금법이 다양하게 적용됨에 따라, 구리도금 박막 형성을 위해 사용되는 Cu seed 층의 상태는 배선으로 형성된 Cu박막 특성에 크게 영향을 미친다 [1-3]. 본 연구에서는 sputter 방식으로 증착된 Cu seed 층(Cu seed / Ti / Si) 위에 형성된 자연산화막을 제거하기 위하여 다양한 세정방법을 도입하여 비교 분석하였다. 계면활성제인 TS-40A를 비롯한 NH4OH 용액과 H2SO4 용액을 사용하여 Cu seed 층 위에 형성된 구리산화막을 제거함으로서 형성된 표면형상 및 표면상태를 조사분석 하였다. FE-SEM (Field Emission Scanning Electron Microscope)을 이용하여 표면 처리된 Cu seed층 표면의 형상 및 roughness 등을 측정하였고, XPS (X-ray Photoelectron Spectroscopy)를 이용하여 표면 처리된 Cu seed 표면의 화학구조 및 불순물 상태를 조사하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.87-88
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• 2007

무전해 구리 도금 공정에서 첨가제로 사용되는 HIQSA 화합물이 Damascene 공정을 이용한 60nm급 trench 패턴 내 무전해 구리 배선 형성 과정에 미치는 효과를 전기 화학적 기법과 광학적 기법을 이용하여 관찰하였다. HIQSA 농도별 open circuit potential의 변화를 관측한 결과, 3ppm 수준으로 첨가되었을 때, 무전해 도금 과정 중 가장 안정한 전위가 유지됨을 볼 수 있었다. 무전해 도금액 내 HIQSA 농도가 높아짐에 따라 구리 도금층의 두께는 지수적으로 감소하였으며, 표면의 결정 크기도 감소하였다. 60nm급 trench 내 무전해 구리 도금 시, 용액 내 침적 시간 60초가 무결함 superconformal copper filling을 얻기 위한 최적 시간이었다.

• Journal of the Korea Organic Resources Recycling Association
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• v.7 no.2
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• pp.25-34
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• 1999

The effects of copper on the anaerobic degradation of propionate were studied using anaerobic batch reactors. The apparent inhibitory effects of copper on the anaerobic degradation of propionate could be observed from behaviors of intermediates, ultimate methane yield(UMY) and specific methanogenic activity(SMA) There was little inhibition at the concentration of $2.5mg\;Cu^{2+}/L$. Beyond this concentration, the inhibitory effects increased with increasing dose of coppers. The 50% inhibition of UMY and SMA occurred at copper dosage of 33.8 and $24.1mg\;Cu^{2+}/gVSS$, respectively. The inhibitory effect based on the UMY was gradually reduced with the operation time dueprobably to the acclimation of microorganisms and/or binding of the added copper by ligands(and possibly ion exchange sites)contained on the cell membrane and extracellular polymer matrix whereas it based on the SMA might exclude the this phenomena. Therefore, the methodology for interpretation of inhibition data based on the SMA was more accurated than the UMY. There was no inhibitory effect in batch reactors supplemented with sulfate due to an antagonistic action of the sulfate reducing bacteria. Propionate degradation was initially retarded for copper inhibited samples but it gradually degraded afterward. Based on the mass removal considering take into account the propionate to acetate conversion, propionate degradation may appeal more affected than acetate. This result revealed that the hydrogenotrophic methanogens were the most affected by copper.

• Journal of the Korean Chemical Society
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• v.36 no.4
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• pp.477-484
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• 1992

Using semiempirical molecular orbital method, ASED-MO of extended Huckel Theory, we were investigated chemical bonds and electronic properties of Cu atom in a chain and a layer for Y123 and Y124 superconductors from VEP (valence electron population), DOS (density of state), and COOP (crystal orbital overlap population). In order to investigate environmental effects of Cu atom for Y123 and Y124 superconductors, we introduced charged cluster models with point charge and without point charge into our calculations. As a result of ASED-MO calculations, the Cu atom in the layer acts as electron acceptor and the Cu atom in the chain acts as electron donor for Y123 and Y124 superconductors. The oxidation state of Cu atom for Y123 and Y124 superconductors without point charge is higher in the chain than in the layer. The oxidation state of Cu atom in the layer for Y123 superconductor is higher than that in the layer for Y124 superconductor. The Cu atom in the layer and the chain for Y123 superconductor does not largely affect on the environmental effect. However, the Cu atom in the layer and the chain for Y124 superconductor does largely affect on it. Also, electron population and chemical bonding of Cu1-O4, Cu2-O4, and Cu1-Cu2 for Y123 superconductor are far different from Y124 superconductor.

• Resources Recycling
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• v.24 no.3
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• pp.3-10
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• 2015

A study has been made on the recovery & separation of cobalt and copper from organic acid leaching solution by solvent extraction. The experimental parameters such as the equilibrium pH, concentration of extractant and phase ratio were observed. Copper was extracted using LIX 84 and Cobalt was extracted using cyanex 272 and versatic acid 10. Experimental results showed that extraction percent of copper was 99% at above eq. pH 2.0 and then more than 90% of cobalt were extracted by cyanex 272 in eq. pH 6.0 and versatic acid 10 in eq. pH 7.5. Stripping of copper and cobalt from the loaded organic phases can be accomplished by sulfuric acid as a stripping reagent and 120 ~ 150 g/L of $H_2SO_4$ was effective for the stripping of copper and cobalt respectively. Finially, the basic optimal process for recovery of copper and cobalt from the bio-leaching solution was proposed.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.38.2-38.2
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• 2011

구리는 현재 반도체 배선으로 가장 많이 사용되는 재료이다. 배선기술이 발전함에 따라 배선두께가 얇아지게 되었고 배선간의 간격 또한 좁아지게 되었다. 간격의 감소는 RC delay 문제점을 야기하였고 이를 해결하기 위해 배선 사이에 Low-k물질을 채우는 노력이 지속되었다. 이상적으로 가장 낮은 유전율을 나타내는 물질은 공기 즉, 아무것도 채우지 않는 것이다. 하지만 이렇게 되면 기계적인 문제가 발생하는데 이를 해결하기 위해서 구리의 강도를 향상시켜야 한다. 강도를 높이려면 Hall-Petch 관계에 의해 결정립의 크기를 작게 만들어야 한다. 그렇지만 이는 곧 전기전도도의 감소를 나타내기 때문에 소자의 구동에 문제가 되어왔다. 이 문제를 해결하기 위해 펄스전해증착을 통한 나노사이즈의 쌍정구조를 가지는 구리의 개발이 진행되었다. 나노쌍정구리는 결정립이 정합면으로 이루어져 있는 쌍정구조로 이루어져 있어 전기전도도의 감소를 최소화하고 강도를 비약적으로 향상시킬 수 있을뿐더러 연신율도 높일 수 있다는 장점을 가지고 있다. 이렇게 고강도 저저항을 나타내는 나노쌍정구리는 Via filling, Through Silicon Via(TSV)에서의 칩간 연결 배선, 2차전지의 전극 등에 적용 가능성이 매우 높다. 이들은 주로 첨가제와 함께 전해증착을 통해 제작된다. 하지만 이러한 첨가제를 넣고 나노쌍정구리를 합성하기 위해 펄스전해증착을 시행할 경우, 나노 쌍정구리의 형성이 억제되고, Off-time이 존재하지 않는 일반 전해증착에서와는 다른 현상이 나타나게 된다. 이러한 이유로 본 연구에서는 현재 가장 많이 사용되고 있는 첨가제인 Poly (ethylene glycol) (PEG, 억제제)와 bis (3-sulfopropyl) disulfide (SPS, 가속제)을 사용하여 그 이유를 알아보고 첨가제를 사용하면서 나노쌍정구리의 밀도를 높일 수 있는 방안에 대해서 실험을 진행하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.205-205
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• 2013

플라즈마 밀도, 전자 온도, 쉬스 전압이 플라즈마 디웨팅으로 나노 분말 어레이를 제작할 때에 끼치는 영향을 연구하였다. 플라즈마 변수를 조절하여 기판에 입사하는 이온 충돌 에너지가 높은 조건에서는 디웨팅 시에 홀이 상대적으로 많이 생성이 되어 균일한 구리 나노 분말이 생성되었고, 반대의 경우에는 디웨팅 시 홀이 적게 생성되어 크고 작은 나노분말이 혼재해 있는 불균일한 구리 나노 분말 어레이가 형성되었다. 따라서 이온 충돌 에너지를 조절하면 구리 나노 분말의 균일도를 조절할 수 있다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.178-178
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• 2015

SAP 씨앗층용 구리필름에 대한 결정구조와 에칭속도의 상관관계를 알아보았다. 그 결과, 저지수 면보다는 고지수면이 우선적으로 성장되어 있는 구리피막이 높은 에칭속도를 나타내었다. 이와 같은 우선결정방위와 에칭속도의 관계를 결정구조적인 관점에서 해석하였다.

• Journal of fish pathology
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• v.27 no.1
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• pp.57-65
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• 2014

Copper ($CuSO_4$) has been widely used to control algae and pathogens in fish culture ponds. However, its toxic effects on fish depend not only on its concentration in water but also on water quality. The susceptibility of the rockfish, Sebastes schlegeli to copper was evaluated at three water-temperatures (WT; 18, 23 and $28^{\circ}C$) for 4 days. After the exposure of two copper concentrations (100 and $200{\mu}g/L$), a hematological effect was exerted on rockfish, by causing changes in red blood cell count and hematocrit value at $28^{\circ}C$. Total protein levels of the fish showed a tendency of co-increase with glucose depend on the WT, after copper exposure. However, the plasma calcium and magnesium levels were significantly increased at $200{\mu}g/L$ copper, regardless of the WT. Enzymes activities including ALT and LDH in serum were also significantly increased depend upon the copper treatment only. This indicates that inorganic components and enzymes activities were sensitive indexes to stress by toxicant such as copper. The cortisol levels were significantly elevated by both WT rising and copper treatment in serum of rock fish. In conclusion, these changes can be seen as an initial response to temperature stress and as a sustaining response to copper exposure. The present findings suggest that a simultaneous stress by temperature change and copper exposure could accelerate an alteration of hematological and plasma biological parameters in the rockfish.