• Korean Journal of Materials Research
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• v.7 no.3
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• pp.188-195
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• 1997

Copper ions were adsorbed on amorphous Si films by spincoating of Cu solutions and were employed as surface nucleation sites for low-temperature crystallization. The crystallization temperature can bc lo~vered down to $500^{\circ}C$ and rhe crystallization time can be shortened by Cu adsorption. The Cu-adsorbed amorphous films were crystallized by fractal growth with the shape of tree branches. The fractal size ranged from $30 to 300{\mu}m$, depending on the Cu solution concentration. The fractals consisted of f e a t h e r like elliptical grains with the size of $0.3~0.4{\mu}m$. which was comparable to that of the intrinsic films crystallized at $600^{\circ}C$. Both the nucleation activation energy and grotvth activation energy decreased as the Cu concentration in the solution increased. The results suggest thcit the adsorbed Cu increases preferred nucleation sites at the surface and enhmces crystallization by reducing thc activation energies of nucleation and growth.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1308-1312
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• 2011

CCFL(Cold Cathode Fluorescent Lamp)for BLU of LCD and special lighting has been widely utilized. The removal of oxide film formed on electrode of CCFL in manufacturing process is required. In this pape Plasma treatment was carried out to remove the oxide film. To ensure the optimum process, the analysis of sheet resistance, XRD, AFM and solder test was conducted. A minimum sheet resistance and the maximum percentage of the solder coverage ratio were measured in optimal process conditions such as plasma power consumption 600W and processing time of 70 seconds. As the plasma treatment is confirmed to be due to removal of copper oxide, this process is expected to be used as a treatment of electrode for CCFL.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.285-286
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• 2012

육각형 구조를 지닌 2차원의 물질인 그래핀은 우수한 전도도와 투과율로 투명전극의 신소재로 각광 받고 있다. 특히, 그래핀은 현재 투명전극으로 가장 많이 사용되고 있는 Indium Tin Oxide(ITO)로는 구현하기 힘든 Flexible display의 어플리케이션으로 사용하기 위한 목적으로 많은 기술 개발이 이루어지고 있다. 이러한 그래핀의 응용은 가장 먼저 그래핀의 생산이 안정적이고 원활히 이루어질 때 실질적으로 가능할 것이다. 하지만, 탄소로 이루어진 그래핀의 성장은 제한된 기판 위에서만 가능하기 때문에 성장이 이루어진 그래핀을 다른 기판에 전사시켜야하는 문제점이 있다. 그래핀 전사방법에는 직접전사, PMMA 전사, TRT 전사, 금속전사, 망전사, PDMS 전사 등 다양한 방법이 있다. 이 중에서 현재 가장 많이 사용되고 있는 전사방법으로는 직접전사, PMMA 전사, TRT 전사 방법이 있다. 직접전사의 경우 니켈위에 성장된 다층의 그래핀을 전사시킬 때 많이 사용되는 방법으로 니켈 에천트에 전사 시킬 그래핀을 띄워 니켈을 녹인 후 원하는 기판을 이용하여 전사하는 간단한 방법이다. 직접전사는 전사가 이루어진 후 그래핀에 남는 결함이 거의 존재 하지 않는 장점이 있지만 문제점은 단일층의 그래핀의 경우 니켈 에천트위에서 잘 보이지 않을 뿐 아니라 에천트에서 기판으로 전사할 때 너무 얇은 막으로 인해 다 찢어져버린다는 것이다. 이를 해결하기 위해 사용되는 전사 방법으로 TRT를 이용하여 구리위에 성장된 그래핀을 상온 시에는 점성을 가진 테이프를 이용해 부치고 구리에 천트에 구리를 녹인 후 원하는 기판위에 놓고 열을 가해 그래핀을 전사하는 방법이 있다. TRT 전사방법은 얇은 막의 그래핀을 찢어지지 않도록 지지해주어 대면적 기판위에도 전사 할 수 있는 장점이 있지만 전사 후 그래핀에 남아 있는 잔여물들이 많고(그림 1. (b)), 테이프를 이용한다는 점에서 그래핀의 얇은 막이 손상될 수 있는 단점이 있다. 그렇기 때문에 본 연구에서는 직접전사와 TRT전사의 문제점들인 전사 후 잔여물와 그래핀 단일층의 손상을 최소화할 수 있는 방법으로 PMMA전사를 가장 적합한 전사방법이라는 것을 라만 분석, 면 저항측정, 그래핀을 이용한 LED제작을 통해서 살펴 보았다. 먼저 라만 분석을 이용해 TRT전사 후 상당히 많은 빈 공간이 생김을 확인할 수 있었으며, 결과적으로 면 저항이 약 $1.5k{\Omega}$~$3M{\Omega}$까지 PMMA의 약 0.9~1.2 $k{\Omega}$와 비교했을 때 큰 차이가 있음을 확인할 수 있었다. 또한, 이후 각각의 전사방법으로 얻은 그래핀을 LED의 스프레딩 층으로 제작한 결과에서도 TRT전사방법보다 PMMA전사방법의 결과가 좋음을 알 수 있었다(그림 2).

• Journal of Sensor Science and Technology
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• v.6 no.2
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• pp.155-162
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• 1997

Zinc oxide(ZnO) thin films were deposited on r-plane sapphires from a solution containing zinc acetate. The films were obtained in a hot wall reactor by the pyrolysis of an aerosol produced by an ultrasonic generator. The crystallinity, surface morphology and composition of the films have been studied using the x-ray diffraction method(XRD) scanning electron microscopy(SEM) and Auger electron spectroscopy (AES) respectively. The influences of the substrate temperature on the crystallinity of the films were studied. Strongly (110) oriented ZnO films were obtained at a substrate temperature of $350^{\circ}C$. The resistivity was increased to above $3{\times}10^{6}{\Omega}{\cdot}cm$ with copper doping and vapor oxidation.

• Journal of Energy Engineering
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• v.12 no.2
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• pp.84-92
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• 2003

A one-dimensional thermal-hydraulic analysis computer program is developed for thermal sizing of a copper bonded steam generator. It is assumed that the conduction heat transfer of copper region between the hot side and the cold side tube is one-dimensional and its thermal resistance is derived as a function of a tube pitch. The flow regions of the water/steam side are divided into four regions: subcooled, saturated, film boiling, and super-heated. The number of tube selected ranges from 250 to 3500 and the pitch to tube diameter (P/D) ratios are 1.4, 1.6 and 1.8 for the parametric study calculation. The calculation results showed that when the number of tube was 2500, the length of the heating tube was about 12 m and the outside diameter of the steam generator was about 3 m. If the P/D ratio increases, the thermal resistance of copper component also increases, however the length of the heating tube is not so much increased.

• Journal of the Korean Vacuum Society
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• v.4 no.S1
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• pp.87-91
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• 1995

초고집적회로의 배선 금속으로 사용되는 알루미늄 합금은 치밀한 표면 산화막 때문에 화학증착법에 의하여 비어를 선택적으로 충전하기 힘들다. 본 연구에서는 기저층을 이용하여 비어에 선택적으로 화학증착함으로써 평탄화를 이루는 새로운 방법을 제안하였다. 알루미늄, 구리 등의 배선 금속, 팔라듐, 코발트 등의 금속, 기타 타이타늄 질화물 등의 기판에 대하여 화학증착 알루미늄의 특성과 실리콘 산화물간의 선택성을 평가하였으며 팔라듐, 코발트, 타이타늄 질화물 등을 기저층으로 사용한 경우에 낮은 비저항과 안정적인 선택적 비어 충전을 이룰 수 있었다.

• Journal of ILASS-Korea
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• v.25 no.2
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• pp.68-73
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• 2020

In the present study, experiments on the film boiling of liquid droplets on oxidized copper surface was conducted. The shape of pure water droplets was observed, and the evaporation rate of them was measured during the film boiling evaporation process. The droplet of initial volume 16 ~ 30 µl was applied onto the oxidized copper surface heated up to 300 ~ 500℃, then the shape of the droplet was analyzed during the film boiling evaporation. Experimental results showed that there was good correlation between dimensionless volume and dimensionless time. However, a significant difference in evaporation rate for small and large droplets discussed in previous study was not found.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.141-141
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• 2012

고종횡비 10:1 비아를 Si wafer 상에 형성하기 위해 $7{\mu}m$ 직경의 마스크로 포토작업하여 Cr층을 100nm 스퍼터링하여 PR(photo resistor) 대신의 에칭 barrier 막으로 사용하였다. 얼라인, 노광, 현상을 거쳐 Cr에칭, PR 제거후 ICP(inductively coupled plasma) 공정으로 Si deep etching하여 via 직경 $10.16{\mu}m$, 깊이 $102.5{\mu}m$의 고종횡비 비아를 형성하였다. 구리필링도금을 위해서 필수적인 seed layer는 단층 또는 다층의 금속막을 스퍼터링 법으로 형성하였다. 형성된 seed layer 단면을 FE-SEM(Field emission scanning electron microscope)으로 관찰하여 내부에 seed 층의 형성 유무를 확인하였다.

• Journal of ILASS-Korea
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• v.29 no.3
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• pp.134-139
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• 2024

An experimental study was conducted on the film boiling of nanofluid droplets at a surface temperature range of 300 to 500℃. The nanofluid was made by mixing pure water with copper oxide powder of diameter of 80 nm. The initial volume of the nanofluid droplet ranged from about 21 to 44 ㎕, and the volume, base diameter, and time were measured during the evaporation process. It was found that nanofluid droplets evaporate faster as the surface temperature increases. Also experimental results showed the droplets evaporate quickly at the beginning of evaporation, but as the volume of the droplets decreases, the evaporation rate gradually slows down, and this trend becomes stronger as the surface temperature increases. In addition, the evaporation rate of nanofluid droplets was slightly faster than that of pure water droplets, this was believed to be because the contact area of nanofluid droplets increased.

• Journal of the Korean Vacuum Society
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• v.13 no.2
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• pp.72-78
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• 2004

Cu seed layers deposited by magnetron sputtering onto tantalum nitride barrier films were treated with ECR plasma and then the copper films were electroplated and rapid thermal annealed in an argon or nitrogen atmosphere at various temperatures ranging from 200 to $500^{\circ}C$. Changes in the microstructure and physical properties of the copper films electroplated on the hydrogen ECR plasma cleaned copper seed layers were investigated using X-ray diffraction (XRD), electron back-scattered diffraction (EBSD), and atomic force microscopy (AFM) analyses. It was found that the copper film undergoes complete recrystallization during annealing at a temperature higher than $400^{\circ}C$. The resistivity of the Cu film tends to decrease and the degree of (111) preferred orientation tends to increase as the annealing temperature increases. Theoptimum annealing condition for obtaining the film with the lowest resistivity, the smoothest surface and the highest degree of the (111) preferred orientation is rapid thermal annealing in a nitrogen atmosphere at $400^{\circ}C$ for 120 s. The resistivity and the surface roughness of the electroplated copper film annealed under this condition are 1.98 $\mu$O-cm and 17.77 nm, respectively.