• Title/Summary/Keyword: 구리막

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Boiling Heat Transfer Coefficients of Nanofluids Containing Carbon Nanotubes up to Critical Heat Fluxes (탄소나노튜브 적용 나노유체의 임계 열유속까지의 비등 열전달계수)

  • Park, Ki-Jung;Lee, Yo-Han;Jung, Dong-Soo;Shim, Sang-Eun
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.7
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    • pp.665-676
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    • 2011
  • In this study, the nucleate pool boiling heat transfer coefficients (HTCs) and critical heat flux (CHF) for a smooth and square flat heater in a pool of pure water with and without carbon nanotubes (CNTs) dispersed at $60^{\circ}C$ were measured. Tested aqueous nanofluids were prepared using CNTs with volume concentrations of 0.0001%, 0.001%, and 0.01%. The CNTs were dispersed by chemically treating them with an acid in the absence of any polymers. The results showed that the pool boiling HTCs of the nanofluids are higher than those of pure water in the entire nucleate boiling regime. The acid-treated CNTs led to the deposition of a small amount of CNTs on the surface, and the CNTs themselves acted as heat-transfer-enhancing particles, owing to their very high thermal conductivity. There was a significant increase in the CHF- up to 150%-when compared to that of pure water containing CNTs with a volume concentration of 0.001%. This is attributed to the change in surface characteristics due to the deposition of a very thin layer of CNTs on the surface. This layer delays nucleate boiling and causes a reduction in the size of the large vapor canopy around the CHF. This results in a significant increase in the CHF.

Acquisition of Monochromatic X-ray Using Multilayer Mirror (다층박막 거울을 이용한 단색 엑스선 획득)

  • Chon, Kwon-Su
    • Journal of radiological science and technology
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    • v.33 no.3
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    • pp.179-184
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    • 2010
  • A hard X-ray microscope system for obtaining images of nano-spatial resolution has been widely studied and requires monochromatic X-ray. A multilayer mirror of 84% reflectivity was designed to acquire tungsten characteristic X-ray of 8.4 keV from the white beam generated from an X-ray tube, and the C/W multilayer mirror of $50{\times}50\;mm$ size and 5.65 nm d-spacing was fabricated by the ion-beam sputtering system. The C/W multilayer had a uniformity of 99.5%, and the structure of the multilayer mirror was verified by a TEM image. The obtainable x-ray reflectivity for the C/W multilayer mirror at 8.4 keV was estimated from measuring the X-ray reflectivity using the copper characteristic X-ray of 8.05 keV. Monochromatic X-ray of 8.4 keV was generated by combining a X-ray tube, and the reflectivity and monochromaticity were 77.1% and 0.21 keV, respectively. Monochromatic X-ray generated from the combination of an X-ray tube and an C/W multilayer mirror has enough potential to use X-ray source for hard X-ray microscope system of laboratory size. If the C/W multilayer mirror of d-spacing of a few nanometers can be fabricated, monochromatic X-ray corresponded to 17.5 keV, molybdenum characteristic X-ray, can be obtained and applied to mammography in the medical application.

Comparison of Lidar data and NGIS digital topographic map data for an efficient flood configuration (효율적인 홍수범람모의용 지형자료구축을 위한 Lidar자료와 NGIS 수치지형도 자료의 비교)

  • Kwon, Oh-Jun;Kim, Kye-Hyun;Song, Yong-Cheol;Min, Sook-Joo;Kim, Kyung-Soon
    • 한국지형공간정보학회:학술대회논문집
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    • 2004.10a
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    • pp.141-146
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    • 2004
  • 최근 들어 국내에서도 홍수에 의한 재산과 인명피해를 최소화하기 위해 지역특성에 알맞은 홍수지도를 제작 중에 있으며, 주로 LiDAR를 이용하여 홍수지도 지형자료를 구축하고 있다. 그러나 이에 많은 시간과 비용이 소요되기 때문에 이미 전국적으로 구축된 수치지형도를 이용한 홍수지도 지형자료 구축의 가능성과 타당성을 검증의 필요성이 제기되고 있다. 이에 따라 본 연구에서는 수치지형도를 이용한 홍수지도제작시 가장 핵심이 되는 정확한 지형자료구축을 위해서 Breakline처리기법과 하천종횡단자료 연계방안을 중심으로 구리시 일부지역을 대상으로 DEM을 시범제작 하였다. 수치지형도와 LiDAR를 이용하여 구축한 DEM을 검수점을 통한 RMSE오차를 이용하여 수직위치정확도를 비교분석하였다. 분석을 위하여 선행연구(홍수지도제작, 2002)에서 검수점으로 사용한 9점과 제방부분의 실측한 9점을 본 연구의 검수점으로 사용하였다. 비교 결과 RMSE가 수치지형도 DEM의 경우 ${\pm}2.658m$이고, LiDAR DEM의 경우 ${\pm}3.430m$로 나타났다. 두 자료 모두 알려진 오차범위보다 훨씬 높은 오차가 발생함을 알 수 있었다. 향후 수치지형도를 이용한 효율적인 홍수지도 지형자료 구축을 위해서는 수치지형도의 신속하고 지속적인 갱신이 필요할 것이며, 현재 도시지역에만 구축되어 있는 1:1,000 수치지형도를 주변 하천지역까지 확대해서 구축해야 할 필요성이 있을 것으로 사료된다. 아울러 도입초기단계의 LiDAR 측량기술의 보급과 관련모델의 기술의 발달로 인하여 정확도 높은 DEM이 요구된다면 고밀도의 방대한 양의 LiDAR 자료로 DEM을 구축하는 것이 바람직하다고 사료된다.및 이용대책을 수립하는 데 활용될 수 있다., $1,000-2,000{\mu}g\;g^{-1}$), 나머지 177종 식물은 살초활성을 나타내지 않았다. 높은 살초활성을 나타낸 식물로부터 분리되는 천연활성물질들은 향후 새로운 제초제 개발을 위한 모화합물 제공, 상호대립억제 작용성을 갖는 작물 품종 개발 혹은 개량에의 활용, 그리고 친환경 유기농업용 잡초방제에의 활용이 기대된다.내(皮膚上皮組織內)의 Langerhans cell내(內)의 Birbeck granule에 비(比)해 수적(數的)으로 현저히 감소(減少)되어 있었다. 그러나 Thy-1 양성(陽性) dendritic cell에서 볼 수 있는 dense-core 과립(顆粒)은 별변화(別變化)없이 쉽게 관찰(觀察)될 수 있었다. 조직배양(組織培養)을 한 견(犬)의 keratinocyte에 대(對)해 사람 pemphigus vulgaris의 항체(抗體)로 반응(反應)시킨 후 protein-A gold(15 nm)로 표식(標識)시킨 바 제일 바깥 상층(上層)의 keratinocyte에 있어서 세포막표면(細胞膜表面)을 따라 표식(標識)되어 세포막항원(細胞膜抗元)을 나타내었으며, 이와 같은 소견(所見)으로 미루어 정상피부(正常皮膚) 중층편평상피세포(重層扁平上皮細胞)에서도 동일(同一)한 소견(所見)을 관찰(觀察)할 수 있다고 본다.al remnants, Resorption of fetus로 관찰된 것이다. Fetal death는 수정후 $14{\sim}18$일까지의 사망으로써 Maceration of fetus로 관찰되는 것이다. 통계학적 분석은 각 Group의 착상 을과 자궁 내 사망 율을 산출할 때에는 각 임신마우스에 따라 발생빈도가 크

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Surface Modification of Li Metal Electrode with PDMS/GO Composite Thin Film: Controlled Growth of Li Layer and Improved Performance of Lithium Metal Battery (LMB) (PDMS/GO 복합체 박막의 리튬 금속 표면 개질: 리튬전극의 성장 제어 및 리튬금속전지(LMB) 성능 향상)

  • Lee, Sanghyun;Seok, Dohyeong;Jeong, Yohan;Sohn, Hiesang
    • Membrane Journal
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    • v.30 no.1
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    • pp.38-45
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    • 2020
  • Although Lithium metal battery (LMB) has a very large theoretical capacity, it has a critical problem such as formation of dendrite which causes short circuit and short cycle life of the LMB. In this study, PDMS/GO composite with evenly dispersed graphene oxide (GO) nanosheets in poly (dimethylsiloxane) (PDMS) was synthesized and coated into a thin film, resulting in the effect that can physically suppress the formation of dendrite. However, PDMS has low ion conductivity, so that we attained improved ion conductivity of PDMS/GO thin film by etching technic using 5wt% hydrofluoric acid (HF), to facilitate the movement of lithium (Li) ions by forming the channel of Li ions. The morphology of the PDMS/GO thin film was observed to confirm using SEM. When the PDMS/GO thin film was utilized to lithium metal battery system, the columbic efficiency was maintained at 87.4% on average until the 100th cycles. In addition, voltage profiles indicated reduced overpotential in comparison to the electrode without thin film.

A Study on the Removal of Cu Impurity on Si Substrate and Mechanism Using Remote Hydrogen Plasma (리모트 수소 플라즈마를 이용한 Si 기판 위의 Cu 불순물 제거)

  • Lee, Jong-Mu;Jeon, Hyeong-Tak;Park, Myeong-Gu;An, Tae-Hang
    • Korean Journal of Materials Research
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    • v.6 no.8
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    • pp.817-824
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    • 1996
  • Removal of Cu impurities on Si substrates using remote H-plasma was investigated. Si substrates were intentionally contaminated by 1ppm ${CuCI}_{2}$, standard chemical solution. To determine the optimal process condition, remote H-plasma cleaning was conducted varying the parameters of rf power, cleaning time and remoteness(the distance between the center of plasma and the surface of Si substrate). After remote H-plasma cleaning was conducted, Si surfaces were analysed by TXRF(total x-ray reflection fluorescence) and AFM(atomic force microscope). The concentration of Cu impurity was reduced by more than a factor of 10 and its RMS roughness was improved by more than 30% after remote H-plasma cleaning. TXRF analysis results show that remote H-plasma cleaning is effective in eliminating Cu impurity on Si surface when it is performed under the optimal process condition. AFM analysis results also verifies that remote H-plasma cleaning makes no damage to the Si surface. The deposition mechanism of Cu impurity may be explained by the redox potential(oxidation-reduction reaction potential) theory. Based on the XPS analysis results we could draw a conclusion that Cu impurities on the Si substrate are removed together with the oxide by a "lift-off" mechanism when the chemical oxide( which forms when Cu ions are adsorbed on the Si surface) is etched off by reactive hydrogen atoms.gen atoms.

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(CyOz)-SiHx 전구체로 중착된 저유전상수 유동박막의 산소 분압에 따른 특성 연구

  • Lee, Chae-Min;O, Hyo-Jin;Kim, Hun-Bae;Park, Ji-Su;Park, Dae-Won;Jeong, Dong-Geun;Kim, Dae-Gyeong;Chae, Hui-Yeop
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.344-344
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    • 2013
  • 칩의 크기가 감소함에 따라 RC (Resistance, Capacitance) 지연, 전력소비증가 및 신호잡음 등이 문제가 되어왔다. RC지연 문제는 배선에 알루미늄 보다 비저항이 낮은 구리를 사용하고 절연막으로 유전상수가 낮은 물질을 사용하여 개선될 수 있다. 이와 같은 맥락에서 점차 저유전상수 박막의 필요성은 증가하고 있다. 그러므로 이를 개선하기 위해 저 유전상수 값을 가지는 물질을 개발 혹은, UV나 플라즈마 그리고 열을 이용하여 처리하는 연구가 절실히 요구되고 있으며, 현재 많은 연구가 진행되고 있다. 이 논문에서 저유전박막은 HDP-CVD (High Density Plasma Chemical Vapor Deposition) 시스템에서 (CyOz)-SiHx와 O2의 비율을 각각 변화시키면서 증착 되었다. (CyOz)-SiHx와 O2의 비율은 60/150, 60/180, 60/210, 60/240로 증가하면서 증착하였다. 그리고 surface profilometer을 이용하여 박막의 증착율을 측정하고 LCR meter를 이용하여 정전용량을 측정하여 유전상수 값을 얻었다. 박막의 화학적 조성과 구조는 FTIR (Fourier Transform Infrared Spectroscopy)로 측정하였다. 박막의 유동 특성은 SEM (Scanning electron microscope) 이미지로 살펴보았다.

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V-Based Self-Forming Layers as Cu Diffusion Barrier on Low-k Samples

  • Park, Jae-Hyeong;Mun, Dae-Yong;Han, Dong-Seok;Gang, Yu-Jin;Sin, So-Ra;Park, Jong-Wan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.409-409
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    • 2013
  • 최근, 집적 소자의 미세화에 따라 늘어난 배선 신호 지연 및 상호 간섭, 그리고 소비 전력의 증가는 초고집적 소자 성능 개선에 한계를 가져온다. 이에 따라 기존의 알루미늄(Al)/실리콘 절연 산화막은 구리(Cu)/저유전율 박막(low-k)으로 대체되고 있고, 이는 소자 성능 개선에 큰 영향을 미친다. 그러나 Cu는 Si과 low-k 내부로 확산이 빠르게 일어나 소자의 비저항을 높이고, 누설 전류를 일으키는 등 소자의 성능을 저하시킬 수 있는 문제점을 가지고 있다. 이러한 Cu의 확산을 막기 위하여 Ta, TaN 등과 같은 확산방지막에 대한 연구가 활발히 진행되어 왔으나, 배선 공정의 집적화와 low-k 대체에 따른 공정 및 신뢰성 문제로 인해 새로운 확산방지막의 개발이 필요하게 되었다. 이를 위해, 본 연구에서는 Cu-V 합금을 사용하여 low-k 기판 위에 확산방지막을 자가 형성 시키는 공정에 대한 연구를 진행하였다. 다양한 low-k 기판에서 열처리조건에 따른 Cu-V 합금의 특성을 확인하기 위해 4-point probe를 통한 비저항 평가와 XRD (X-ray diffraction) 분석이 이뤄졌다. 또한, TEM (transmission electron microscope)을 이용하여 $300^{\circ}C$에서 1 시간 동안 열처리를 거쳐 자가형성된 V-based interlayer가 low-k와 Cu의 계면에서 균일하게 형성된 것을 확인하였다. 형성된 V-based interlayer의 barrier 특성을 평가하고자 Cu-V합금/low-k/Si 구조와 Cu/low-k/Si 구조의 leakage current를 비교 분석하였다. Cu/low-k/Si 구조는 비교적 낮은 온도에서 leakage current가 급격히 증가하는 양상을 보였으나, Cu-V 합금/low-k/Si 구조는 $550^{\circ}C$의 thermal stress 에서도 leakage current의 변화가 거의 없었다. 이러한 결과를 바탕으로 열처리를 통해 자가형성된 V-based interlayer의 Cu/low-k 간 확산방지막으로서 가능성을 검증하였다.

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A comparative study of electrical properties of arachidic acid LB films in the Al/LB/Al and Au/LB/Au electrode structure (Al/LB/Al, Au/LB/Au 전극 구조에서 arachidic acid LB막의 전기적 특성에 관한 비교 연구)

  • 오세중;김정수
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.44 no.10
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    • pp.1311-1316
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    • 1995
  • The electrical properties of the Langmuir-Blodgett (LB) films layered with arachidic acid were studied at the room temperature. The sample was formed with 2 different structure ; One was Al/LB/Al and the other was Au/LB/Au. The precise structure of Al/LB/Al was considered as Al/Al$_{2}$O$_{3}$/LB/Al, because the natural oxide layer was formed on surface of lower Al electrode. The electrical conductivity of Al/Al$_{2}$O$_{3}$/LB/Al structure was determined the value of 3.5 * 10$^{-14}$ S/cm from the measurement of current-voltage (I-V) characteristics. The sample with the structure of Au/LB/Au was made to eliminate the influence of oxide layer in the electrical properties of the LB films. The short circuit current was observed in this sample from the I-V characteristics. To verify the reason of short circuit current generation, copper decoration method was employed to the 15 layers of LB films deposited on the Al and Au electrode each. The defects were shown on the films deposited with Au electrode. This results means that the defects on the LB films which layered with the Au electrode were contributed to the short circuit current. Several films (15, 31, 51, 71L) were deposited on the Au electrode and measured the size of defects with the copper decoration method. The size of defects becomes smaller as the film layer was increased. We conclude that the existence of defects affects the short circuit current generation.

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Electroless Plated Copper Thin Film for Metallization on Printed Circuit Board : Neutral Process (인쇄회로기판상의 금속 배선을 위한 구리 도금막 형성 : 무전해 중성공정)

  • Cho, Yang-Rae;Lee, Youn-Seoung;Rha, Sa-Kyun
    • Korean Journal of Materials Research
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    • v.23 no.11
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    • pp.661-665
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    • 2013
  • We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

A study on Manufacture of EMI Composite Powder by the Electroless Ni Plating Method (무전해 니켈도금방법을 이용한 EMI 복합분말제조에 관한 연구)

  • Joung, I.;Yoon, S.R.;Han, S.N.;Na, J.H.;Kim, C.W.
    • Korean Journal of Materials Research
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    • v.8 no.5
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    • pp.444-449
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    • 1998
  • There are various shielding materials that have been considered; the use of a metallic plate or the layering of a conductive material on a plastic surface and the insertion of filler in plastics. All of these methods have shown their merits and weakness. Therefore, many studies have concentrated on developing materials that effectively cut down EMI without increase in weights of housing materials. In these respects, this study has focused on investigations of the shielding effect of materials that have electroless nickel plating on the lamella structured micro particles surface with low specific gravity. When a film of electroless nickel were plated on a micro particle surfaces and then mixed with paint, the electromagnetic shielding effects were measured as 63dB. Although these effects were less than that 90dB of the copper plate, trials in a series of 6 times increased the shielding effect by IOdB and is applicable to wide range of EMI shielding.

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