• Journal of Dental Rehabilitation and Applied Science
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• v.18 no.2
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• pp.73-80
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• 2002

치과용 임플란트의 세라믹 지대주를 위해 개발된 지르코니아 함유 세라믹 시편의 생체 적합성을 평가하기 위하여 시험관내 세포 독성을 검사를 시행하였다. L929 섬유모세포를 $37^{\circ}C$, 90% 습도, 5% CO2 및 95% 공기의 조건을 유지하는 세포 배양기에서 배양하여 실험에 사용하였다. 배양 2일, 4일, 6일 마다 시편을 넣은 배양 접시 내의 전체 세포 수와 생존 세포 수를 세어 세포 증식과 세포 생존율 검사를 시행하였다. millipore filter test를 이용하여 succinate dehydrogenase 효소 활성을 검사하였으며, 세포막 투과성의 변화를 관찰하기 위해 agar overlay test를 시행하였다. 음성 대조군은 시편을 사용하지 않았으며, 양성 대조군은 시편과 같은 크기의 구리를 사용하여, 다음과 같은 결과를 얻었다. 1. 세포 증식과 세포 생존율 검사에서는 지르코니아 함유 세라믹을 넣은 실험군과 음성 대조군 모두에서 시간이 경과함에 따라 세포가 증식하는 양상을 보였다. 세포 생존율 검사에서도 실험군과 음성 대조군이 유사한 결과를 나타내었다. 2. millipore filter test에서는 실험 시편 모두에서 염색 정도의 변화가 없이 음성 대조군과 동일한 결과를 나타냈다. 반면에 구리 시편을 넣은 양성 대조군에서는 중등도의 세포 독성을 나타냈다. 3. agar overlay test에서도 시편을 넣지 않은 음성 대조군에서는 세포 성장에 변화가 나타나지 않았으며, 실험군에서도 시편 주위로 탈색이 관찰되지 않아서 음성대조군과 같은 결과를 나타냈다. 양성 대조군에서는 심한 세포 독성을 나타내었다. 4. 실험결과, 치과용 임플란트의 세라믹 지대주를 위해 개발된 지르코니아 함유 세라믹 시편은 시험관내 세포 독성을 나타내지 않았다.

• Journal of the Korean Vacuum Society
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• v.7 no.2
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• pp.118-126
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• 1998

A study to improve filling of semiconductor contact holes by enhancement of the directionality of the source beams has been undertaken. The collimation of source beams was improved by the ionized cluster beam deposition technique with modification of the cell geometry. The collimation tested with neutral beam was excellent. But, the Cu flims were grown in a columnar mode due to the lack of surface mobilit of the impinged clusters. A shadow effect also caused cleavage and consequent discontinuity at the steos as films grow. By applying acceleration voltage, the columnar growth in a contact hole of 0.5 $\mu$m diameter and 1 $\mu$m height disappeared and considerable coverage at the side wall of the contacts as well as perfect bottom coverage were observed. These are all due to the assistants of the accelerated ionized clusters with high kinetic energy. Thus we demonstrated that the ICB deposition technique can be used to completely fill sub-half-micron contact holes with high aspect ratio.

• Journal of the Korean Orthopaedic Association
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• v.56 no.4
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• pp.294-304
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• 2021

Ankylosing spondylitis causes ankylosis of the spine due to ossification of the articular cartilage and ligaments around the vertebral body as well as the sacroiliac joint. This pathophysiology limits joint movement and, in many cases, causes pain and deformity of the spine. If this disease is left untreated, it ultimately causes ankylosis and ossification of the whole-body joints. The symptoms generally develop before age 30 years, and the gradual progression of the disease adversely affects the physical function, professional ability, and quality of life. This increases the likelihood of developing psychiatric disorders, such as depression. The authors are aware of this severity and introduce recent trends and studies to prevent surgical treatment with various medications before systemic ossification. This paper presents various surgical treatments and complications in patients who were unable to prevent progression and underwent surgical treatment.

• Korean Chemical Engineering Research
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• v.45 no.6
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• pp.633-637
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• 2007

Electroless plating of Co-alloy thin films as capping layers for Cu interconnection has been investigated using alkali-free precursors such as $(NH_4)_2Co(SO_4)_2{\cdot}6H_2O$, $(NH_4)_2WO_4$, $(NH_4)H_2PO_4$, etc. The characteristics of the Co-alloy thin films were discussed by analyses of the effects of pH, Co-precursor concentration, and deposition temperature on the thickness and surface morphology of the films. The thickness of the Co-alloy thin films increased with increasing pH, Co-precursor concentration, and deposition temperature, similarly to the results of electroless plating of Co-alloy thin films using alkali-containing chemicals. The SEM images of the surface of the Co-alloy thin films showed that the proper ranges of pH and deposition temperature were 8.5~9.5 and $75{\sim}85^{\circ}C$, respectively. This work found a feasibility that Co-alloy thin films as capping layers for Cu interconnection could be electroless plated using alkali-free chemicals.

• The Korean Journal of Zoology
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• v.28 no.3
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• pp.137-150
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• 1985

The dorsal skin of Rana temporaria dybowskii Guenther was examined under electron microscope. The results of the fine structures in the xanthophores, iridophores and melanophores were as follows: Xanthophores: Xanthophores were filled with pterinosomes and carotenoid vesicles. Type I pterinosomes had a clear limiting membrane. Type II pterinosomes had the inner fibrous structures. Tyep III pterinosomes were characterized by a few superficial lamellae and type IV pterinosomes by multiple concentric lamellae. Especially typical type II and type III pterinosomes were evenly distributed in the cytoplasm. Iridophores: Iridophores were situated between a xanthophore and a melanophore in the outer part of the dermis just below the basement membrane. Iridophores were filled with reflective platelets, each of which is rectangular and convex lens-like in shape. These platelets were closely contiguous and leave no interspace between them. Endoplasmic reticulum and a few mitochondria were observed in the supranuclear cytoplasm. Melanophores: Dermal melanophores contained numerous melanosomes. The dendritic precesses of the melanophore containing the melanin granules extented up the lateral sides of the iridophore. Epidermal melanophores were filled with melanin granules which appered as the same electron density. A few melanin granules were observed in a cornified surface cell.

• Korean Journal of Soil Science and Fertilizer
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• v.43 no.6
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• pp.872-879
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• 2010

Layered copper hydroxides [LCHs, $Cu_2(OH)_3{\cdot}NO_3$] has the agricultural potentials as a fungicide because of its high crystallinity, excellent anion exchange capacity, and its regular layered particle size. The study, for the first time, has synthesized LCHs in highly concentrated solution and evaluated its physicochemical properties including the crystallinity and suspension stability. Optimal synthetic condition of LCHs was determined by crystallinity and stability of suspension as follow; 1) concentrations of $Cu(NO_3)_2$ and NaOH solutions were 3.0 M respectively, 2) reaction temperature and solution pH were $25^{\circ}C$ and 6.0, respectively, and 3) aging time after reaction was 2hr. Crystallinity of LCHs enhanced with increase in pH up to 9.0. Whereas, stability of suspension was decrease by increase in crystal size. Especially, increase in reaction temperature decreased stability of suspension. XRD patterns and SEM images exhibited that LCHs had regular layered particle size with 0.2~0.8 ${\mu}m$ and high crystallinity in optimal synthetic condition. The particle size was increased with increase in reaction temperature and pH. These results showed that LCHs synthesized in highly concentrated solution exhibited high stability of suspension as well as high crystallinity suitable to their potential as a fungicide.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.67-72
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• 2012

In recent days, the wire width of IC is narrowed and the degree of integration of IC is increased to obtain the higher capacity of the devices in electronic industry. And then the surface quality of FCCL(Flexible Copper Clad Laminate) became increasingly important. Surface defects on FCCL are bump, scratch, dent and so on. In particular, bumps cause low reliability of the products. Even though there are bumps on the surface, if leveling characteristic of plating solution is good, it does not develop significant bump. In this study, the leveling characteristics of additives are investigated. The objective of study is to improve the leveling characteristic and reduce the surface step through additives and plating conditions. The additives in the electrodeposition bath are critical to obtain flat surface and free of defects. In order to form flat copper surface, accelerator, suppressor and leveler are added to the stock solution. The reason for the addition of leveler is planarization surface and inhibition of the formation of micro-bump. Levelers (SO(Safranin O), MV(Methylene Violet), AB(Alcian Blue), JGB(Janus Green B), DB(Diazine Black) and PVP(Polyvinyl Pyrrolidone) are used in copper plating solution to enhance the morphology of electroplated copper. In this study, the nucleation and growth behavior of copper with variation of additives are studied. The leveling characteristics are analyzed on artificially fabricated Ni bumps.

• The Journal of the Acoustical Society of Korea
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• v.30 no.4
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• pp.215-222
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• 2011

In order to obtain high resolution images, a focusing ultrasonic transducer operated in very high frequency (VHF) range was fabricated and its characteristics were evaluated. A 9-${\mu}m$ thick PVDF film with only one metalized surface for electric ground was adhered to a CCP (Copper-clad polyimide) film by using epoxy. It was pressed by a metal ball to form a concave surface and its rear side was filled with the epoxy. The radius of curvature and the f-number of the fabricated transducer are 7.5 mm and 1.7, respectively. The pulse-echo measurement results from a target located at the focal point showed that the frequency bandwidth was 35.0 MHz and the insertion loss near the peak frequency of approximately 40 MHz was about 60 dB. Those values agreed well with the simulation results by the KLM equivalent circuit analysis including the effect of the epoxy bonding layer. When the image of thin copper lines by the 35 MHz transducer of the UBM (Ultrasonic Backscattering Microscope) system was compared with the image by the transducer fabricated in this study, the fabricated transducer was observed that the axial resolution was improved although the lateral resolution was degraded.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.407-407
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• 2012

화학기상증착법(CVD; Chemical Vapor deposition)으로 h-BN을 증착하여 성장 시간에 따른 표면의 특성 및 결정성을 연구하였다. 암모니아 보레인(BH3NH3)을 보론 나이트라이드(Boron Nitride) 박막의 전구물질로 이용하였으며, $70{\sim}120^{\circ}C$로 열을 가하여 열분해하였다. $25{\mu}m$ 두께의 구리 기판을 챔버에 넣어서 Low pressure (~25 mTorr) 상태가 되도록 한다. 25 mTorr 이하의 압력에서 수소 가스 (0.2~1sccm)를 넣고 $20^{\circ}C$/min로 가열한 후 약 한 시간 후에 $990{\sim}1,000^{\circ}C$가 된다. 그 후 Cu foil의 표면을 부드럽게 하고, 산화막을 제거하기 위해 $990^{\circ}C$에서 40 분간 열처리(annealing)한다. 그 후 암모니아 보레인에서 분해된 보라진 가스(borazine; B3H6N3)로 h-BN을 합성한다. 성장 시간이 길수록 더 많은 부분이 보론 나이트라이드에 의해 덮인다는 것을 관찰하였고, 성장 시 주입하는 수소의 양(0.2~5 sccm)과 알곤(0~15 sccm)의 혼합 비율에 따라 보론 나이트라이드의 domain size가 변화함을 알 수 있었다. 그 각각의 차이를 주사 전자현미경(SEM; Scanning Electron Microscopy)을 통해 확인하고, 결정성을 라만 분광(Raman spectroscopy), 광전자 분광(XPS; X-ray photoelectron spectroscopy)으로 비교 분석하였다.

• Electrical & Electronic Materials
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• v.9 no.3
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• pp.291-297
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• 1996

The surface properties of AI(Si, Cu) alloy film after plasma etching using the chemistries of chlorinated and fluorinated gases with varying the etching time have been investigated using X-ray Photoelectron Spectroscopy. Impurities of C, Cl, F and O etc are observed on the etched AI(Si, Cu) films. After 95% etching, aluminum and silicon show metallic states and oxidized (partially chlorinated) states, copper shows Cu metallic states and Cu-Cl$_{x}$(x$_{x}$ (x$_{x}$ (1