• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2007.06a
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• pp.157-163
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• 2007

최근의 반도체 장비와 디스플레이 장비는 구분이 가지 않을 정도로 상호 복합 하이브리드 장비로 급진전되고 있다. 이들 장비의 부품 중에서 인터페이스를 제외한 기타 부품은 최첨단 최신형 신소재로 제작되어 최고의 부가가치를 누리며 전세계의 경제의 중심 축에 있지만, 반면에 의외로 스텐레스 스틸로 만든 헨드폰 본체가 모터롤라에서 제작되어 대 히트를 치는 것처럼 구형 소재의 표면 개선은 신소재 개발 못지 않게 아직도 응용 면에서 중요한 의미가 있다. 이에 이 연구에서는 값이 상대적으로 매우 저렴한 소재인 탄소강을 선정하여 TiN 피막 제조하고 그 특성을 알아보기 위해 SEM 측정과 서로 다른 세 종류의 경도계를 이용하여 경도값을 측정하였다. 결과적으로 모재 자체가 연성인 관계로 표면 강도가 크게 개선되지는 않지만 고급화된 색상과 높은 광택을 나타내었다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.149-150
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• 2007

현재 널리 적용되고 있는 유기에폭시 도장의 경우에는 부식환경을 차단하는 등의 일반적인 차원에는 상당히 우수하나, 열이나 빛에 의한 열화 및 부식 문제와 환경오염 등의 문제를 가지고 있다. 이를 해결하기위한 방법으로 순수 무기계의 액상 규산질을 바인더로 사용한 도료의 제작을 시도하였으며, 열화성능평가시험을 통해 그 적용가능성에 대해 검토하였다. 실험결과 환경친화적인 -Si-O-Si- 결합의 1액형 무기 규산질 도료의 제작이 가능하였으며 향후 여러 가지 성능 중 특히 내식성, 내산성 및 광택성 등의 보완연구가 선해오디어야 할 것으로 사료된다.

• Applied Chemistry for Engineering
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• v.17 no.2
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• pp.150-157
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• 2006

The alternate plating method was suggested by a tin-cobalt alloy plating process which has excellent mechanical characteristics and also favorable to environment. Tin-cobalt alloy plating has many advantages such as nontoxicity, variable color-tone, and no post-treatment process. In this study, the plating conditions such as temperature, pH, current density, plating time, and amount of additive (glycine) were determined in the tin-cobalt alloy plating process through Hull-cell test and surface analysis. As the result of Hull-cell analysis, brightness became superior as the amount of glycine increased. It was found that the optimum alloy ratio was 0.03 M of $SnCl_{2}{\cdot}2H_{2}O$ and 0.05 M of $CoSO_{4}{\cdot}7H_{2}O$ at $50^{\circ}C$, pH 8.5, and $0.5A/dm^2$. The optimum amount of additive was 15 g/L of glycine and 0.1 g/L of organic acid. Then, the solution including glycine was recommended as an optimum plating solution for a chromium plating process.

• Journal of the Korean Applied Science and Technology
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• v.38 no.1
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• pp.9-18
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• 2021

This study was aimed to investigate the effects of hair dyeing and changes of hair quality by the application of indigo dye. Methods: Indigo dye was used after water bath. After application of the dye to healthy and bleached hair samples, they were treated with heat and remained naturally by different times. Each sample was measured before and after the application and compared for the analysis. To investigate the effects of dyeing, L⁎, a⁎, and b⁎ values and bleaching degree were measured using by color-difference meter. To understand the changes of hair quality, absorbance and gloss were measured using by tensile strength and methylene blue. Results: Upon the results of dyeing, all the samples showed the significant dyeing effects before and after the application in terms of L⁎, a⁎, and b⁎ values. With respect to the bleaching effects, it showed the greatest change on Day 1 and did not show any changes from Day 3. For the measurement of tensile strength, mean values of all the samples were increased. However, the results were not significant, statistically, demonstrating no change of hair quality. No statistically significant results were found in the samples except healthy 7L(3) sample upon the absorbance results using methylene blue. Gloss of samples was changed upon the statistical analysis results. Conclusion: Indigo dye showed the hair dyeing effects, significantly, while gloss was changed and tensile strength and absorbance were not changed in terms of hair quality. Further studies are required on the processing with a variety of dyes and on the measurements for reliability and objectivity.

• Korean Journal of Breeding Science
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• v.41 no.4
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• pp.510-514
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• 2009

Cymbidium is one of the largest genus in the orchid family and a number of hybrids have been bred in the world. During mass-propagating the Cymbidium "Dongyang" using the meristem culture technology, a useful leaf mutant was selected from the protocom like bodies. The new Cymbidium variety by in vitro mutangesis from "Dongyang" was named as 'Daegook' in 1998. Compared to Dongyang, "Daegook" mutant has white or yellow stripes along the margin of leaves and flowers. The plant length of "Daegook" was shorter than "Dongyang" and the mean length and width of leaf in "Daegook" was 40 cm and 1.6 cm, respectively. The new variety, "Daegook", is expected to be a popular Cymbidium variety among consumer as a ornamental orchid mutant for pot culture by its fine and unique stripes and growth characters.

• Conservation Science in Museum
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• v.15
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• pp.56-65
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• 2014

The face of the Seated Stone Buddha ^{Korean Treasure No.84} of Sinboksa Templesite in Gangneung was contaminated with a glossy resin, spoiling its beauty. The contaminants covered the face, the forehead of the urna, to the bottom of the jaw. FT-IR analysis on a sample of the contaminants identified the substance as cyanoacrylate instant adhesive, which can normally be melted with acetone and removed with a swab. However, given that the surface of the statue was severely weathered from prolonged open-air exposure, alternative removal procedures were considered, to minimize the possibility of physical damage. After research, two removal procedures were utilized: one procedure involving poultices, which had been used to remove graffiti from the Samjeondobi Stele, and one procedure involving steam sterilization, which has been used to remove resin from pottery and porcelain. When both the poultices and steam sterilization were applied together, the resin was removed within twenty-four hours, without physical work using a swab.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.1-7
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• 2004

Tin plating on component finishes may grow whiskers under certain conditions, which may cause failures in electronics equipment. To protect the environment, 'lead-free' among component finishes is being promoted worldwide. This paper presents the evaluation results of whiskers on two kinds of lead-free plating materials at the plating temperature and under the reliability test. The rising plating temperature caused increasing the size of plating grain and shorting the growth of whisker. The whisker was grown under the temperature cycling the bent type in matt Sn plating and striated type in malt Sn-Bi. The whisker growth in Sn-Bi plating was shorter than that in Sn plating. In FeNi42 leadframe, the $7.0{\~}10.0{\mu}m$ diameter and the $25.0{\~}45.0{\mu}m$ long whisker was grown under 300 cycles. In the 300 cycles of Cu leadframe, only the nodule(nuclear state) grew on the surface, and in the 600 cycles, a $3.0{\~}4.0{\mu}m$ short whisker grew. After 600 cycles, the ${\~}0.34{\mu}m$ thin $Ni_3Sn_4$ formed on the Sn-plated FeNi42. However, we observed the amount of $0.76{\~}1.14{\mu}m$ thick $Cu_6Sn_5$ and ${\~}0.27{\mu}m$ thin $Cu_3Sn$ intermetallics were observed between the Sn and Cu interfaces. Therefore, the main growth factor of a whisker is the intermetallic compound in the Cu leadframe, and the coefficient of thermal expansion mismatch in FeNi42.

• Proceedings of the Optical Society of Korea Conference
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• 2009.02a
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• pp.507-508
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• 2009

We have proposed and demonstrated noncontact refractometer incorporating a fiber bundle. The fiber bundle is composed of a TEC(thermally expended core) fiber and hundreds multimode fibers. The fiber is designed in such a way that the detected reflected optical power from a liquid is constant against the distance between fiber bundle and liquid surface. Low differactive characteristic of TEC fiber make it possible to increase the available distance between the fiber bundle and liquid surface, The obtained sensitivity, optical intensity variation by change of refractive index of liquid is 0.4.

• Proceedings of the Korean Printing Society Conference
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• 2001.06a
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• pp.91-91
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• 2001

환경문제에 대해 오래 전부터 관심을 가져온 선진국은 잉크의 수성화에 주력하여 왔으며, 그 결과 이미 수용성 소재의 양산체재에 들어가 수성 원료 사업을 대형화하는 추세에 있다. 이에 한화석유화학 중앙연구소에선 스티렌/아크릴계 수용성 High Solid 수지를 개발하여, 수성 잉크용 분산제, Resin Fortified Emulsion (RFE), UV Resist 잉크, 수성코팅제, 바닥광택제 등에 적요하기 위한 응용기술을 개발하였다. 본 연구는 수성 잉크의 주요 구성 성분인 grinding vehicle. let-down vehicle로 사용되는 수용성 High Solid 수지 (SAA 수지) 및 이를 이용한 에멀젼 수지의 합성과 수성 잉크로의 응용에 대한 것이다. SAA(HCC Soluryl Resin) 수지는 구조적으로 Styrene, Alpha-methyl Styrene, crylic Acid의 삼원공중합체이며 약 70%의 소수성 물질과 30%의 친수성 물질이 Random 하게 중합되어 있으며 약 5000∼15000정도의 낮은 분자량을 가진 물질로, 고고형분에서도 낮은 점도를 유지하기 위하여 분자량과 좁은 분자량과 좁은 분자량을 가지는 수지를 연속벌크중합방법으로 합성하였다. 또한 이를 고분자 유화제로서 사용하여 수지보강 에멀젼수지 (RFE 수지, HCC Soluryl Emulsion) 를 제조하는데 사용하였으며, SAA수지 및 RFE수지를 수성잉크용 분산제, 잉크 바인더용으로 적용하였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.90.1-90.1
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• 2012

1934년 J. R. Winkler에 의해 처음으로 개발된 pulse current 도금은 연속적인 직류 단속을 이용한 전기도금으로써 종래의 연속적인 직류(direct current) 전기 도금이 가지는 다공성 및 거친 도금 등의 한계를 극복하기 위해 연구되고 있다. 최근 전기 전자 산업의 급속한 발달과 함께 Au, Pd, Rh 등의 귀금속 도금에 있어서 Pulse 도금은 광택, 다공도, 내부 응력, 불순물 및 수소 함유량의 감소와 같은 특성 향상을 가질 수 있으며 기존 DC 전기 도금의 문제점 해결책으로서 많은 연구가 이루어지고 있다. 하지만 현재까지 Pulse 도금의 정확한 기구(mechanism)에 대한 명확한 정립이 되어 있지 않아 모든 도금계에 적용할 수 있는 standard pattern이 없는 실정이다. 본 연구에서는 귀금속 도금 중 Ag pulse 도금에 있어서 Peak current density, duty cycle, time이 Ag 도금의 표면 형상, 두께, 열전도율에 미치는 영향에 대해 연구하였다.