• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2012.05a
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• pp.63-64
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• 2012

A pyrotechnic actuated device (PAD) is a component that delivers high power in remote environments by combustion of a self-contained energy source. Historically, the design of these devices has been largely empirical and considered to be an art. In this study, an overview for developing an analytical model is introduced that efficiently evaluates performance of PAD. The model is integrated by three parts of different disciplines that are coupled in sequence with each other. First is the solid explosive burning to form product gas within an actuator and transport to an expansion chamber. Second is the insertion of initially tapered piston into a small hole by gas pressure in the chamber. Third is the shear cutting of the diaphragm from the piston to enable gas flow into the conduit. Some results of preliminary study for each of three parts are introduced in the presentation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.1
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• pp.8-18
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• 2000

We presented a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. As the frequency of RF system devices increases, the effect of its electrical parasitics in the wireless communication system requires new structure of RF circuit modules because of its needs to be considered of electrical performance for minimization and module mobility. RF circuit modules with BGA packages can provide some advantages such as minimization, shorter circuit routing, and noise improvement by reducing electrical noise affected to analog and digital mixed circuits, etc. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and measured electrical parameters with a TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3${\times}$3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, and self inductance 146pH, whose values were reduced to 34% and 47% of the value of QFP package structure. S11 parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55GHz and the loss of 0.26dB. Routing length of the substrate was reduced to 39.8mm. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.