• Journal of Ocean Engineering and Technology
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• v.9 no.2
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• pp.98-111
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• 1995

High temperature low cycle fatigue shows that cycle-dependent crack growth owing to cyclic plastic deformation occurred simultaneosly with time-dependent crack growth owing to intergranular deformation. Consequently, to estimate crack growth rate uniquely, many to investigators have proposed various kinds of parameters and theories but these could not produce satisfactory results. Therefore the goal of this study is focused on prediction of crack growth rate using predominant damage rule, linear cumulative damage rule and transitional parameter ${\Delta}J_c/{\Delta}J_f$. On the basis of these sinusoidal loading waveform at 600$^{\circ}C$ and 700$^{\circ}C$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.3
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• pp.193-198
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• 2017

Alloy 617 is one of the primary candidate materials to be used in a very high temperature reactor (VHTR) system as an intermediate heat exchanger (IHX). To investigate the low cycle fatigue behavior of Alloy 617 weldments at a high temperature of $850^{\circ}C$, fully reversed strain-controlled fatigue tests were conducted with the total strain values ranging from 0.6~1.5％. The weldment specimens were machined using the weld pads fabricated with a single V-grove configuration by gas tungsten arc welding (GTAW) process. The fatigue life is reduced as the total strain range increases. For all testing conditions, the cyclic stress response behavior of the Alloy 617 weldments exhibited the initial cyclic strain hardening phenomenon during the initial small number of cycles. Furthermore, the overall fatigue cracking and the propagation or cracks showed a transgranular failure mode.

• Aerospace Engineering and Technology
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• v.9 no.2
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• pp.90-97
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• 2010

A study about the fatigue life of copper alloy which is used in inner jacket of regenerative cooling chamber of liquid rocket engine has been performed. Mechanical properties of the material and fatigue life have been taken from tensile tests and low-cycle fatigue tests at room temperature and several elevated temperatures. Original universal slopes method, modified universal slopes method, Mitchell's method, Baumel and Seeger's method, and Ong's method have been used for predicting the fatigue data. It was found that the novel life prediction method should be developed for the copper alloys since almost all data have not been predicted well with the widely used methods.

• Journal of Ocean Engineering and Technology
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• v.6 no.1
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• pp.122-130
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• 1992

The effect of loading waveform on elevated temperature low-cycle fatigue crack growth behavior in a SUS 304 stainless steel have been investigated under symmetrical trangular (fast-fast), trapezoidal and asymmetrical(fast-slow, slow-fast) waveforms at 650.deg. C. It was found that the crack growth rate in fast-slow loading waveform appeared to be higher a little and the crack growth rate in slow-fast loading waveform much higer than that in fast-fast loading waveform, and difference in crack growth rate between fast-show and slow-fast waveforms nearly didn't appear in the region of da/dN>10/sup -2/ The crack growth rate in the trapezoidal loading waveform with t/sub h/=500sec appeared to be faster than that in slow(500sec)-fast(1sec). In addition, parameter modified J-integral could be considered as useful parameter for fatigue crack growth rate in all waveforms. The result obtained are as follow. da/dN=4.91*10/sup -3/ (.DELTA. J/sub c/)/sup 0.565/.

• Journal of Welding and Joining
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• v.13 no.4
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• pp.7-13
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• 1995

마이크로솔더링에 의한 전자기기는, 사회기능의 중추가 되는 컴퓨터, 통신 기기, 항공기 인공위성 등의 제어계를 구성하므로, 그 접속부에 대한 높은 신뢰성의 요구는 그 무엇보다 중요하다. 전자기기에 있어서의 솔더 접속부는 집과 기판의 전기 적.기계적 접속의 역할을 하고 있으며, 따라서 개개의 접속부의 파단은 전체의 불량 으로 연결된다. 실제 전자콤포넌트와 그 시스템의 단선 등의 사고에 있어서 자주 발생 하는 사고중의 하나가 솔더접속부의 단선에 의한 것이며, 그 단선중에서도 가장 보편 적이며 또한 대단히 심각한 문제로서 주목을 받고 있는 것이 솔더접속부의 열피로파단 이다. 전자기기를 사용할 때, 스위치의 on-off에 의한 power cycle과 환경의 온도변화 에 기인하는 반복열 사이클은 솔더접속부의 피로를 일으키게 되고, 결국에는 사용중에 파단을 초래하게 된다. 이러한 온도변화의 범위는 약 -55.deg. - 150.deg.C로 예상할 수 있으며, 여기서 최고온도인 150.deg.C는 Pb-Sn 공정합금의 경우 0.9Tm.p.이상의 고온에 해당한다. 이 피로는 등온적으로 또는 열사이클중에 발생하기도 한다. 솔더접 속부의 열피로수명은 대부분의 공업재료에서 나타나는 저사이클피로거동과 유사하게 발생하며, 솔더 접속부에 인가되는 열변형/응력(thermal strain/stress)의 크기에 크게 의존하는 것으로 알려져 있다. 솔더는 서로 다른 열팽창계수를 갖는 칩과 회로 기관의 두종류의 재료를 접속하기 때문에, 상기한 바와 같은 반복열사이클에 의하여 발생하는 열변형/응력이 접속부의 피로.파단을 야기시킨다. 이러한 솔더접속부에 대한 주기적인 응력/변형의 인가는 접속부에 내.외적으로 현저한 변화를 야기시키게 되고, 열피로로 연결되며 결국에는 시스템의 전기적 단선을 초래하게 된다. 또한 열피로파단 현상는 변형/응력의 크기 뿐 만아니라 솔더합금자체의 야금학적인 물성에도 크게 의존 하며, 내적.외적인 열변화에 의한 야금학적인 특성변화도 크게 영향을 미친다. 솔더 접속부의 신뢰성에 대한 연구는, 그 중요성에 비추어 볼 때, 지금까지 수많은 연구가 행하여져 왔다. 그러나 신뢰성과 관련된 열피로파단현상에 대한 야금학적인 면에서의 연구는 비교적 적은 편이다. 따라서 본 해설에서는 전자기기의 마이크로 솔더접속부 에서 발생하는 열피로파단현상에 대한 야금학적인 면에 중점을 두어 서술하고자 한다.

• Transactions of the Korean Society of Mechanical Engineers
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• v.9 no.2
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• pp.140-149
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• 1985

Fully reversed push-pull low cycle fatigue tests under strain control of trapezoid cyclic mode have been conducted in air at temperature of 550.deg. C and with frequency of 0.5 cpm on the domestic stainless steel STS 316 after solution treatment for 1 hour at 1100.deg. C. As an experimental equipment for high temperature fatigue tests, an electric servo-hydraulic fatigue machine(Instron model 1350) was used. This paper presents the effects of creep hold time and plastic strain range on push-pull high temperature low cycle fatigue life and fracture behavior. The fracture surfaces were observed by means of the scanning electron microscope. The results are as follows. (1) The fatigue life decreases with increase of the plastic strain range equal hold time and also decreases as the hold time is getting longer. (2) The frequency modified damage function can predict fatigue life by incorporating a variation of Coffin's frequency modified approach into damage function. (3) The ratios of creep damage and fatigue damage can be calculated by using he linear accumulation damage concept and the ratio of creep damage increases as the hold time is getting longer. (4) At the creep hold time of 5 minutes and the strain range of 2.0%, the fracture mode was intergranular fracture and striations were hardly observed. In this case, the intergranular cracking was originated in void type('.gamma.' type) cracking.