• Polymer(Korea)
• /
• v.33 no.1
• /
• pp.1-6
• /
• 2009

We report the template-based synthesis of well-dispersed CdS nanoparticles (NPs) in the interior of poly (2-acetamidoacrylic acid) (PAAA) hydrogel as a novel type of nanocomposite without particle aggregation via ion exchange in a aqueous system. As revealed by the TEM image analysis, the mean crystallite diameter of CdS NPs embedded in hydrogel composite was 4.5 nm, and the composite did not suffer any observable change after 6 months. Desorption/decomposition of CdS/PAAA hydrogel composite was studied by evolved gas analysis-gas chromatography-mass spectrometry (EGA-GC-MS), and thermogravimetric analysis (TGA) methods. From the TGA data, the thermal stability of the composite system increased by ca. 100 $^\circ$C and the content of CdS NPs in a dry composite gel was over 70 wt%. In addition, the chemical pathway was proposed for the entire decomposition process.

• Polymer(Korea)
• /
• v.30 no.4
• /
• pp.362-366
• /
• 2006

It was found by polarized FTIR spectroscopic studies that pentacene molecules are arranged with their molecular axes perpendicular to the substrate surface when pentacene films are deposited on a polyimide alignment layer. The ring plane in a pentacene molecule is arranged parallel to the rubbing direction of the polyimide alignment film while no specific arrangement of vertically deposited pentacene molecules was found for the film without rubbing. The pentacene band at $1296cm^{-1}$ which has a transition dipole moment parallel to the ring plane is much stronger in a polarized IR spectrum of parallel to the rubbing direction, whereas the band at $908cm^{-1}$ whose transition dipole align normal to the ring plane shows much stronger intensity in a spectrum of perpendicular to the rubbing direction. These findings indicate that orientation of polyimide chains affects the arrangement of pentacene molecules when they are deposited on a polyimide alignment film.

• Polymer(Korea)
• /
• v.37 no.3
• /
• pp.373-378
• /
• 2013

The interfacial adhesion strength is very important in $SiO_x$ deposited PC film for the barrier enhanced polycarbonate (PC) flexible substrate. In this study, PC films were treated by undercoating, UV/$O_3$ and low temperature plasma and then the effect of physical and chemical surface modifications on the interfacial adhesion strength between PC film and $SiO_x$ barrier layer were studied. It was found that untreated PC film shows significantly low interfacial adhesion strength due to the smooth surface and low surface free energy of PC. Low temperature plasma treatments resulted in the increase of both surface roughness and surface free energy due to etching and the appearance of polar molecules on the PC surface. However, UV/$O_3$ treatment only shows the increase of surface free energy by developed polar molecules on the surface. These surface modifications caused the enhancement of surface interfacial strength between PC film and $SiO_x$ barrier. In the case of undercoating, it was found that the increase of surface interfacial strength was achieved by adhesion between various acrylic acid on acrylate coated surface and $SiO_x$ without increase of polar surface energy. In addition, the barrier property is also improved by organic-inorganic hybrid multilayer structure.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.21 no.12
• /
• pp.261-267
• /
• 2020

The demand for faster, lighter, and thinner portable electronic devices has brought about a change in semiconductor packaging technology. In response, a stacked chip-scale package(SCSP) is used widely in the assembly industry. One of the key materials for SCSP is a die-attach film (DAF). Excellent flowability is needed for DAF for successful die attachment without voids. For DAF with high flowability, two-step curing is often required to reduce a cure crack, but one-step curing is needed to reduce the processing time. In this study, DAF composition was categorized into three groups: cure (epoxy resins), soft (rubbers), hard (phenoxy resin, silica) component. The effect of the composition on a cure crack was examined when one-step curing was applied. The die-attach void and flowability were also assessed. The cure crack decreased as the amount of hard components decreased. Die-attach voids also decreased as the amount of hard components decreased. Moreover, the decrease in cure component became important when the amount of hard component was small. The flowability was evaluated using high-temperature storage modulus and bleed-out. A decrease in the amount of hard components was critical for the low storage modulus at 100℃. An increase in cure component and a decrease in hard component were important for the high bleed-out at 120℃(BL-120).

• Applied Chemistry for Engineering
• /
• v.24 no.5
• /
• pp.443-455
• /
• 2013

Electrochemical studies on charge transfer reactions across the interface between two immiscible electrolyte solutions (ITIES) have greatly attracted researcher's attentions due to their wide applicability in research fields such as ion sensing and biosensing, modeling of biomembranes, pharmacokinetics, phase-transfer catalysis, fuel generation and solar energy conversion. In particular, there have been extensive efforts made on developing sensing platforms for ionic species and biomolecules via gelifying one of the liquid phases to improve mechanical stability in addition to creating microscale interfaces to reduce ohmic loss. In this review, we will mainly discuss on the basic principles, applications and future aspects of various sensing platforms utilizing ion transfer reactions across the ITIES. The ITIES is classified into four types : (i) a conventional liquid/liquid interface, (ii) a micropipette supported liquid/liquid interface, (iii) a single microhole or an array of microholes supported liquid/ liquid interface on a thin polymer film, and (iv) a microhole array liquid/liquid interface on a silicon membrane. Research efforts on developing ion selective sensors for water pollutants as well as biomolecule sensors will be highlighted based on the use of direct and assisted ion transfer reactions across these different ITIES configurations.

• Journal of the Microelectronics and Packaging Society
• /
• v.12 no.2 s.35
• /
• pp.155-159
• /
• 2005

In this report, Polymer light emitting diodes (PLEDs) with an ITO/PEDOT:PSS/MEH-PPV/Al structure were prepared by spin coating method on the glass substrate patterned ITO (indium tin oxide), using PEDOT:PSS(poly(3,4=ethylenedioxythiophene):poly(styrene sulfolnate)) as the hole transfer material and MEH-PPV(poly(2-methoxy-5-(2-ethyhexoxy)-1,4-phenylenvinylene)) having a different concentration (0.1, 0.3, 0.5, 0.7, 0.9, 1.5 wt$\%$) as the emitting material. The electrical and optical properties of the prepared PLED samples were investigated. The good electrical and optical properties were observed for the PLED samples with a MEH-PPV concentration ranging from 0.5 to $0.9 wt\%$. However, the current and luminance values for PLED sample with $1.5 wt\%$ of MEH-PPV decreased greatly. The maximum luminance and light efficiency for the PLEDs with concentration of $0.5 wt\%$ MEH-PPV were $409 cd/m^2$ and 4.90 Im/W at 9 V, respectively. The emission spectrums were found to be $560{\~}585 nm$ in wavelength showing orange color.

• Polymer(Korea)
• /
• v.36 no.3
• /
• pp.275-280
• /
• 2012

Poly(amic acid)s were successfully synthesized from 1,4-bis(4-aminophenoxy)benzene (1,4-APB) or 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (HFBAPP) with pyromellitic dianhydride (PMDA), 3,3'-4,4'-benzopenonetetracarboxylic dianhydride (BPDA) and $p$-phenylenediamine ($p$-PDA) and then they were effectively converted into polyimide films by thermal imidization. The chemical structure and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FTIR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer, dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The moisture absorption, thermal and mechanical properties of polyimide films decreased with increasing the amount of 1,4-APB and HFBAPP. The polyimide films using HFBAPP showed lower properties than that of 1,4-APB at the same ratio, but it displayed better thermal properties and lower moisture absorption at the similar coefficient of thermal expansion (CTE) with a copper. On the basis of our finding, it is concluded that 4-component polyimide films could be utilized for base films for flexible copper clad laminates (FCCL) of flexible printed circuit boards.

• Polymer(Korea)
• /
• v.38 no.5
• /
• pp.640-644
• /
• 2014

As a process of plat panel display production, slot coating is widely used for the coating of photoresist on a wide glass substrate. A uniform coating thickness is important, and the coating uniformity is divided into nozzle and machine directions. The machine and nozzle directions coating uniformities are influenced by the operation condition of coater and flow uniformity inside the die, respectively. Non-uniform coating during steady coating process occurs according to those factors, however, non-uniform coating along the machine and nozzle directions has been observed at the beginning of coating by unsteady flow. In this study, steady and unsteady state flow simulations have been performed and compared with experiment to examine the causes of non-uniform coating. Computational results exhibited that it took a time to get a uniform pressure distribution at whole inside the die, and during this period of time edge regions showed lower exit velocity compared with center region. Subsequently edge regions had thinner coated layers than center region. However edge regions showed higher exit velocity than center region after steady state, and this made edge regions had thicker coated layer than center region.

• Polymer(Korea)
• /
• v.38 no.6
• /
• pp.752-759
• /
• 2014

Crosslinked polyimides (PIs) were synthesized by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFDB) with various ratios of the cross-linkable, end-capping agent cis-1,2,3,6-tetrahydrophthalic anhydride (CDBA) via ring-opening metathesis polymerization. Residual stress behaviors were investigated in-situ during thermal imidization of the crosslinked PI precursors using a thin film stress analyzer (TFSA) by wafer bending method. The thermal properties were investigated via differential scanning calorimetry (DSC), thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). The optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis) and spectrophotometry. All properties were interpreted with respect to their morphology of crosslinked networks. With increasing the amounts of the end-capping agent, the residual stress decreased from 27.9 to -1.3 MPa, exhibited ultra-low stress and high thermal properties. The minimized residual stress and enhanced thermal properties of the crosslinked PI makes them potential candidates for versatile high-density multi-layer structure applications.

• Polymer(Korea)
• /
• v.31 no.2
• /
• pp.148-152
• /
• 2007

The prototype of color fitters for the liquid crystal displays (LCD) using cholesteric liquid crystal monomers was produced. Cholesteric liquid crystal is characterized by the unique optical features of selective reflection, which is due to the helical twisting structures of LCs comparable to the wavelength of the incident light under certain conditions of substrate treatment. In the results of the experiment, cholesteric films for red, green, and blue light reflections respectively were produced and the viewing angle dependence of these films were investigated. Reflective light of red and green films shifted to shorter wavelength regions as viewing angle becomes greater, but blue one shifted very little. Periodic micrometer-sized half-spherical photoresist formed by thermal reflow method after photo-lithography was patterned on glass substrates. The viewing angle dependence of reflective light colors of red, green, and blue films on the patterned substrates compared with those on no patterned substrates was investigated. We could confirm the dependences were much smaller on the patterned substrates by bare eyes and Lab-color coordination methods qualitatively.