• Journal of the Korean Recycled Construction Resources Institute
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• v.10 no.3
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• pp.227-234
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• 2022

In this study, the rheological properties of cement paste composites applied with carbon-based nano-materials were experimental analyzed. Flow table and rheological properties, compressive strength were measured in the cement paste using graphene oxide asqueous solution and carbon nanotube aqueous solution. When carbon nano-materials was mixed in an aqueous solution, flow decreased and plastic viscosity and shear stress were increased. In particular, graphene oxide rapidly increased the plastic viscosity and shear stress. In the case of carbon nanotube aqueous solution, when less than 0.2 % was mixed, the increase rate was low compared to graphene oxide. This is because the specific surface area of graphene, which is in the form of a plate, is large. The compressive strength showed a small amount in strength increase when graphene mix, and CNT had a strength about 112 % of OPC. Carbon-based nanomaterials, is considered that CNT are suitable more to be used construction materials. However, extra studies on the surfactant to be used for mixing proportion and dispersion will be needed.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.1
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• pp.35-41
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of micro-electronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder bump and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6/Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• Composites Research
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• v.30 no.3
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• pp.193-201
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• 2017

Molecular dynamics simulation and the Mori-Tanaka micromechanics study are performed to investigate the effect of the covalent grafting between CNT and polyester on the mechanical behavior and load transfer of nanocomposites. The transversely isotropic stress-strain curves are determined through the tension and shear simulations according to the covalent grafting. Also, isotropic properties of randomly dispersed nanocomposites are obtained by orientation averaging the transversely isotropic stiffness matrix. By addressing the grafting, the transverse Young's modulus and shear moduli of the nanocomposites are improved, while the longitudinal Young's modulus decreases due to the degradation of the grafted CNT.

• Composites Research
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• v.31 no.5
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• pp.282-287
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• 2018

In this paper, we explore interfacial properties of the mineralized CNTs when they are employed as reinforcing fillers in a polymer nanocomposite using molecular dynamics (MD) simulations. Recently, several studies on mineralizing carbon nanotubes (CNTs) with an aid of nitrogen doping to CNTs have been reported. However, there is a lack of studies on the reinforcing effects of the mineralized CNTs when it is employed as a filler of nanocomposites. Silica ($SiO_2$) is used as a mineral material and poly (methyl metacrylate) (PMMA) is used as a polymer matrix. Pull-out simulations are conducted to obtain the interfacial energy and the interfacial shear stress. It was found that the silica mineralized CNTs have higher interfacial interaction with the polymer matrix. In the future, by examining various thermomechanical properties of the mineralized-CNT-filler/polymer nanocomposites, we will search for potential applications of the novel reinforcing filler.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.39-46
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• 2021

The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.

• Journal of the Korea Concrete Institute
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• v.26 no.1
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• pp.79-86
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• 2014

In this paper, a stress transfer mechanism between near surface-mounted (NSM) fiber reinforced polymer (FRP) plate and concrete was investigated and a reliable analytical procedure for it was presented by using bilinear bond-slip model simulating the bond behavior of NSM FRP plate. As a result, critical values in the bi-linear model such as maximum shear strength, slip at that time and failure slip at the initiation of softening de-bonding were suggested for being used in the differential equation considering he interfacial characteristic between NSM FRP and concrete. Also, it was found that the bond-slip behavior could be suitably redicted by using the proposed procedure even in the case of various bond lengths from the comparison with bond test result.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.11
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• pp.1035-1042
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• 2005

In the present study, the principle of minimum energy is employed to configure the shape of rivulet flowing down an inclined surface. The profile of laminar rivulet is determined by numerical integration. The maximum center thickness, which corresponds to the minimum thickness of falling film, is found to exist regardless of liquid flow rate and is compared with the analytical and experimental data. At small liquid flow rate the center thickness of rivulet and its width increase almost linearly with flow rate. Once the center thickness of rivulet becomes very close to its maximum value, its growth rate retards abruptly. However the width of rivulet increases proportionally to the liquid flow rate and most part of its free surface is as flat as that of stable film. The growth rate of rivulet thickness with respect to liquid flow rate becomes larger at bigger contact angle. The width of rivulet increases rapidly with its flow rate especially at small contact angle, As the liquid-vapor interfacial shear stress increases, the center thickness of rivulet decreases with its flow rate, which is remarkable at small contact angle. However the effect of interfacial shear stress on the width of rivulet is almost negligible.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.41-48
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• 2018

The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using $90^{\circ}$ peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than $5J/m^2$, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and $90^{\circ}$ peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.29-37
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• 2021

The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

• Composites Research
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• v.29 no.2
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• pp.79-84
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• 2016

An adhesive can be used to connect two different materials in structures. In comparing with other connecting methods, such as bolt, rivet, and hot melting, the adhesive does not need to use them. It leads to reduce the weight and decrease the stress concentration along the connecting line. This work studied the comparison of mechanical and interfacial properties of commonly-used two adhesives, acrylic type and bisphenol-A epoxy type. Tensile and flexural strength of neat adhesives were also compared. Lap shear test of two adhesives was deduced from the measurement of tensile and fatigue tests. After testing, the failure patterns of adhesive surfaces were observed by a microscope. Tensile strength and mechanical fatigue resistance at using bisphenol-A epoxy adhesive were better than acrylic adhesive. Also adding CNT reinforcement in epoxy adhesive can anticipate mechanical improvement.