• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.96-96
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• 2011

ZnO는 실온에서 3.37 eV의 큰 밴드갭 에너지와 60 meV의 높은 exciton binding energy를 가지고 있어 광소자를 만드는데 큰 관심을 얻고 있다. 또한 최근에는 ZnO를 기반으로 한 동종접합 전광소자를 만드는데 성공하였다. 그러나 소자의 성능을 높이기 위해 여러 가지 개선할 사항이 있다. 그 중에 하나는 캐리어를 잘 주입 시키기 위한 금속-반도체 접합을 구현하는 것이다. 이러한 문제를 개선하기 위해서는 ZnO 기반으로 한 낮은 비저항을 가진 소자가 필요하다. 일반적으로 n-type ZnO Ohmic 접합에서 쓰이는 금속은 Ti/Au, Ta/Au, Al/Au 등이 있다. 실험방법은 c-plane 사파이어 기판 위에 펄스 레이저 증착 방법으로 3시간 동안 $500^{\circ}C$ 환경에서 ZnO 박막을 성장하고, 표면을 고르게 하기 위해 $1000^{\circ}C$에서 1분 동안 열처리를 진행하였다. 샘플 위에 photo-resist 코팅을 한 다음 transfer length method(TLM)를 이용하기 위해 포토리소그래피 장비를 통하여 샘플을 노광하였다. 그 위에 Ti/Au (30 nm/80 nm)를 E-beam/thermal evaporation으로 증착 하였다. 이는 일반적인 반도체 공정과 Lift-off방식을 이용하여 패터닝 하였다. 샘플을 열처리하는 것은 금속과 반도체의 접촉 접착과 전기적인 성질을 개선하고 응력과 계면 결함을 감소시키기 때문에 샘플을 100, 200, 300, 400, $500^{\circ}C$에서 각각 열처리하였다. 저항을 구하기 위해 각각 열처리된 샘플과 as-deposited의 전류, 전압 특성을 측정하고, 이러한 실험 방법으로 n-type ZnO의 Ohmic 접합을 구현하는 것이 목표이다.

• Proceedings of the KAIS Fall Conference
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• 2005.05a
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• pp.173-176
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• 2005

고분자 OLED는 저분자 OLED에 비하여 공정이 간단하고 대화면, Plastic 기판을 사용하여 All organic display로의 구현이 있다는 많은 장점을 가지고 있지만 소자의 신뢰성과 안정성에 문제를 갖고 있어 현재까지 저분자 OLED에 비하여 기술 수준이 미약하다. 그러나 차세대 디스플레이의 실현을 위하여 많은 대학과 기업연구소에서 많은 연구가 진행중이다. 본 논문에서는 ITO/PEDOT:PSS/MEH-PPV/Al 구조를 갖는 고분자 OLED를 제작하고 발광메커니즘에 대한 고찰과 계면특성 및 전기$\cdot$광학적 특성을 조사하였다. 정공수송물질인 PEDOT:PSS은 박막의 표면상태를 부드럽게하고 ITO와 MEH-PPV 사이의 접착을 좋게하며 ITO 로부터 정공을 원활하게 MEH-PPV로 전달하여 효율을 향상시킨다. 제작된 소자는 발광효율을 극대화시키기 위하여 정공수송층인 PEDOT:PSS을 첨가시킨 다층구조로서 각각의 박막을 열처리 및 MEH-PPV의 농도를 0.1, 0.3, 0.5, 0.7, 0.9, 1.5wt$\%$로 변화시켜 농도별 표면상태와 전기$\cdot$광학적 특성을 관찰하여 고효율 OLED소자 제작에 가장 적합한 MEH-PPV의 농도에 대하여 고찰하였다.

• Korean Journal of Materials Research
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• v.17 no.2
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• pp.61-67
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• 2007

The magnetron reactive sputtering was adopted to deposit CuO buffer layers on the polyimide surfaces for increasing the adhesion strength between Cu thin films and polyimide, varying $O_2$ gas flow rate from 1 to 5 sccm. The CuO oxide was formed through all the $O_2$ gas flow rates of 1 to 5 sccm, showing the highest value at the 3 sccm $O_2$ gas flow rate. The XPS analysis revealed that the $Cu_2O$ oxide was also formed with a significant ratio during the reactive sputtering. The adhesion strength is mainly dependent on the amount of CuO in the buffer layers, which can react with C-O-C or C-N bonds on the polyimide surfaces. The adhesion strength of the multi-layered Cu/buffer layer/polyimide specimen decreased linearly as the heating temperature increased to $300^{\circ}C$, even though there showd no significant change in the chemical state at the polyimide interface. This result is attributed to the decrease in surface roughness of deposited copper oxide on the polyimide, when it is heated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.05b
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• pp.11-14
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• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. The modifications produced on the silicone surface by oxygen plasma were accessed using ATR-FTIR, contact angle and AFM. Adhesion was obtained from T-peel tests of semiconductive layer having different treatment durations. In addition, ac breakdown test was carried out for elucidating the change of electrical property with duration of plasma treatment. From the results, the treatment in the oxygen plasma produced a noticeable increase in surface energy, which can be mainly ascribed to the the creation of O-H and C=O. It is observed that adhesion performance was determined by not surface energy but roughness level of silicone surface. It is found that ac dielectric strength was increased with improving the adhesion between the semiconductive and insulating interface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.78-81
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• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. Surface structure and adhesion of semiconductive silicon rubber by surface asperity was obtained from SEM and T-peel test. In addition, ac breakdown test was carried out for elucidating the change of electrical property by roughness treatment. From the results, Adhesive strength of semiconductive-insulation interface was increased with surface asperity. Dielectric breakdown strength by surface asperity decreased than initial Specimen, but increased from Sand Paper #1200. According to the adhesional strength data unevenness and void formed on the silicone rubber interface expand the surface area and result in improvement of adhesion. Before treatment Sand Paper #1200, dielectric breakdown strength was decreased by unevenness and void which are causing to have electric field mitigation small. After the treatment, the effect of adhesion increased dielectric breakdown strength. It is found that ac dielectric breakdown strength was increased with improving the adhesion between the semiconductive and insulating interface.

• Applied Chemistry for Engineering
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• v.9 no.5
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• pp.715-718
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• 1998

In this work, bisphenol type vinyl ester was impregnated into the three-dimensional glass fabrics fabricated from different thickness changes. Their mechanical properties of the specimens have been investigated by three-point bending and flatwise compression tests. Also, interlaminar shear strength (ILSS) has been determined through short-beam test for the evaluation of interfacial adhesion at interfaces between fibers and matrix of the composites. The effect of thickness changes in three-dimensional glass fabric-reinforced composites have been described in this work.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.19-23
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• 2015

In this study, two types of Au/TiW bump samples were fabricated by the electroplating process onto Al/Si and SiN/Si wafers for the COG (Chip On Glass) packaging. TiW was used as the UBM (Under Bump Metallurgy) material of the Au bump and it was deposited by a sputtering method under the sputtering powers ranges from 500 to 5000 Watt. We investigated the delamination phenomenas for the prepared samples as a function of the input sputtering powers. The stable interfacial adhesion condition was found to be 1500 Watt in sputtering power. In addition, the SAICAS (Surface And Interfacial Cutting Analysis System) measurement was used to find the adhesion strength of Au bumps for the prepared samples. TiW UBM films were deposited at the 1500 Watt sputtering power. As a results, there was a similar adhesion strengths between TiW/Au interfacial films on Al/Si and SiN/Si wafers. However, the adhesion strength of TiW UBM sputtering films on Al and SiN under films were 2.2 times differences, indicating 0.475 kN/m for Al/Si wafer and 0.093 kN/m for SiN/Si wafer, respectively.

• Composites Research
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• v.29 no.2
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• pp.79-84
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• 2016

An adhesive can be used to connect two different materials in structures. In comparing with other connecting methods, such as bolt, rivet, and hot melting, the adhesive does not need to use them. It leads to reduce the weight and decrease the stress concentration along the connecting line. This work studied the comparison of mechanical and interfacial properties of commonly-used two adhesives, acrylic type and bisphenol-A epoxy type. Tensile and flexural strength of neat adhesives were also compared. Lap shear test of two adhesives was deduced from the measurement of tensile and fatigue tests. After testing, the failure patterns of adhesive surfaces were observed by a microscope. Tensile strength and mechanical fatigue resistance at using bisphenol-A epoxy adhesive were better than acrylic adhesive. Also adding CNT reinforcement in epoxy adhesive can anticipate mechanical improvement.

• Journal of the Korean Society for Nondestructive Testing
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• v.30 no.5
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• pp.411-422
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• 2010

Self-sensing on micro-failure, dispersion degree and relating properties, of carbon nanotube(CNT)/epoxy composites, were investigated using wettability, electro-micromechanical technique with acoustic emission(AE). Specimens were prepared from neat epoxy as well as composites with untreated and acid-treated CNT. Degree of dispersion was evaluated comparatively by measuring volumetric electrical resistivity and its standard deviation. Apparent modulus containing the stress transfer was higher for acid-treated CNT composite than for the untreated case. Applied cyclic loading responded well for a single carbon fiber/CNT-epoxy composite by the change in contact resistivity. The interfacial shear strength between a single carbon fiber and CNT-epoxy, determined in a fiber pullout test, was lower than that between a single carbon fiber and neat epoxy. Regarding on micro-damage sensing using electrical resistivity measurement with AE, the stepwise increment in electrical resistivity was observed for a single carbon fiber/CNT -epoxy composite. On the other hand, electrical resistivity increased infinitely right after the first carbon fiber breaks for a single carbon fiber/neat epoxy composite. The occurrence of AE events of added CNT composites was much higher than the neat epoxy case, due to micro failure at the interfaces by added CNTs.

• Korean Journal of Materials Research
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• v.9 no.3
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• pp.288-294
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• 1999

In the flip chip interconnection using solder bump, the Under Bump Metallurgy (UBM) is required to perform multiple functions in its conversion of an aluminum bond pad to a solderable surface. In this study, various UBM systems such as $Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 5\mu\textrm{m}, Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}, al 1\mu\textrm{m}/Ni 0.2\mu\textrm{m} / Cu 1\mu\textrm{m} and Al 1\mu\textrm{m}/Pd 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}$ for flip chip interconnection using the low melting point eutectic 63Sn-37Pb solder were investigated and compared to their metallurgical properties. $100\mu\textrm{m}$ size bumps were prepared for using an electroplating process. The effects of the number of reflows and aging time on the growth of intermetallic compounds(IMC) were investigated. $Cu_6Sn_5$ and $Cu_3Sn$ IMC were abserved after aging treatment in the UBM system with thick coper $(Al 1\mu\textrm{m}/Ti 0.2\mu\textrm{m}/Cu 5\mu\textrm{m})$. However only the $Cu_6Sn_5$ was detected in the UBM system with $1\mu\textrm{m}$ thick copper even after 2 reflow and 7 day aging at $150^{\circ}C$. Complete Cu consumption by Cu-Sn IMC growth gives rise to a direct contact between solder inner layer such as Ti, Ni and Pd, and hence to possibly cause reactions between two of them. In this study, however, only for the Pd case, IMC of PdSn. was observed by Cu consumption. UBM interfacial reactions with s이der affected the adhesion strength ot s이der balls after s이der reflow and annealing treatment.