• Cement Symposium
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• no.23
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• pp.220-225
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• 1995

• Applied Chemistry for Engineering
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• v.7 no.5
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• pp.963-969
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• 1996

Cure characteristics of DGEBA(diglycidyl ether of bisphenol A)/dicy(dicyandiamide) system containing diuron(3-(3,4-dichloro phenyl) -1,1-dimethylurea) as an accelerator was investigated. The system has shelf life of six months because dicy is insoluble in liquid/solid resins at room temperature. It is generally known that dicy is an adequate curing agent for one component adhesive due to its highly latent property. With increasing the amount of added dicy, reaction heat of DGEBA/dicy system increased and degree of conversion was not varied. For DGEBA/dicy/diuron system, cure temperature decreased about $40^{\circ}C$ and cure reaction became fast by the addition of diuron which activates dicy. $T_g$ of the mixed resin decreased with the amount of accelerator. which was interpreated with molecular structure forming loose chain. Cure kinetics of DGEBA/dicy and DGEBA/dicy/diuron system were explained using Kamal's autocatalytic reaction model. The effect of acceleration was confirmed with that reaction model.

• Applied Chemistry for Engineering
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• v.5 no.6
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• pp.1030-1035
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• 1994

Curing behavior and glass transition temperatures of epoxy resins into which reactive diluents were added to control processability were investigated. Heat of cure generated of the epoxy resin was reduced with butyl glycidyl ether(BGE) and phenyl glycidyl ether(PGE) contents. $T_g$ of the resin was decreased with the amount of reactive diluents and it was attributed to increased molecular weight between crosslink points. Cure kinetics of the resins was studied employing autocatalytic reaction model and found that reaction constants decreased as the contents of reactive diluent was increased.

• Korean Journal of Materials Research
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• v.2 no.4
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• pp.257-262
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• 1992

The cure kinetics of a diglycidyl ether of bisphenol A (DGEBA) with 4, 4'-methylene dianiline (MDA) added succinonitrile was studied through the dynamic run method by applying the data to the Kissinger equation which analyses the effect of the heating rate on the temperature at maximum reaction rate using Differential Scanning Calorimetry (DSC) analyzer in the range of 3$0^{\circ}C$-35$0^{\circ}C$. In the DGEBA/MDA system with SN, the activation energy ($E_a$) and the pre-exponential factor (A) were calculated. From these results, the rate constants (k) were obtained according to the different SN contents.

• Proceedings of the Korean Nuclear Society Conference
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• 1996.05c
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• pp.501-506
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• 1996

원자력발전소의 2차 냉각계통 제염 공정인 EPRI/SGOG 공정에서는 EDTA를 제염제로 사용하고 있다. EDTA는 수용액 상에서는 20$0^{\circ}C$까지 안정하며 제염후 존재하는 유리 EDTA (EDTA-2NH$_4$)는 시멘트 수화반응에 의해 생성되는 Ca이온과 결합하여 EDTA-Ca 착이온이 형성된다. 따라서 CSH(Calcium Silicate Hydrate)겔의 형성을 억제함으로써 시멘트 경화반응을 지연시킨다. 현재 우리나라에서는 EDTA가 함유한 제염폐액의 처리방법의 미결정으로 인하여 자체 저장하고 있으나 고화체의 최종 처분조건을 만족하며 감용률을 최대화 할 수 있는 처리방법이 필요하다. 본 연구에서는 유리 EDTA가 소석회의 발생을 억제시켜 경화반응에 영향을 주는 점을 고려하여 유리 EDTA 용액에 소석회로 전처리 하여 시멘트 고화한 고화체의 물성시험을 수행하였다. 연구결과 EDTA와 소석회 반응 몰비가 1이 되게 전처리할 경우 시멘트에 대한 물의 배합비는 27%이상이 되어야 하며, 유리 EDTA 함량이 20wt%인 용액에서 폐액/시멘트/소석회비가 33.4/65/1.6일때 최대의 감용률을 나타내는 건전한 고화체의 조성비를 얻었다.

• Korean Journal of Materials Research
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• v.9 no.5
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• pp.467-472
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• 1999

The isothermal cure behavior of diglycidyl ether of bisphenol A(DGEBA) 4,4'-methylene dianiline(MDA) system with various contents of neopentyl glycol(NPG) has been analyzed by differential scanning calorimetry(DSC). TO increase the cure rate of DGEBA/MDA system, NPG was introduced as an accelerator. Regardless of the NPG content, the shape of the conversion curves showed sigmoid indication that DGEBA/MDA/NPG system followed autocatalytic cure reaction. The cure reaction of DGEBA/MDA system increased with the increment of NPG content and it was due to the catalytic role of hydroxyl groups of NPG.

• Applied Chemistry for Engineering
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• v.10 no.7
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• pp.1046-1051
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• 1999

Cure behavior and thermal stability of the different ratio of diglycidylether of bisphenol A(DGEBA)/trimethylolpropane triglycidylether(TMP) epoxy blends initiated by 1 wt % N-benzylpyrazinium hexafluoroantimonate (BPH) as a cationic latent catalyst were studied using DSC and TGA, respectively. Latent properties were performed by measurement of the conversion as a function of temperature using dynamic DSC. Dynamic DSC thermograms of DGEBA/TMP blends revealed that the weak peak was formed by complex formation between the hydroxyl groups in DGEBA and BPH, and between epoxides and BPH in low temperature ranges. The strong peak was considered as an exothermic reaction by the formation of three-dimensional network in high temperature ranges. Isothermal DSC revealed that the reaction rate of the blends was found to be higher than that of the neat TMP. The thermal stabilities in the cured resins were increased with increasing the DGEBA content. These results could be interpreted in terms of the stable aromatic structure, existence of hydroxyl group and high molecular weight of DGEBA.

• Journal of Conservation Science
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• v.32 no.2
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• pp.223-234
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• 2016

Two-component epoxy resin is widely used in the cultural heritage restoration field. However according to mixing ratio of resin and hardener, curing property, mechanical strength and chemical structure differ which have possibility to effect the stability of cultural heritage. Result of questionnaire survey shows hands-on workers in the conservation field tend to mix the epoxy resin with his or her eye measurement when the using amount is small or mix additional hardener to shorten the pot life of epoxy resin. This research aims to analyze the curing property, mechanical strength and chemical structure of rapid curing type epoxy resin and medium curing type one depending on relative ratio of 0.25~4 of hardener to resin. When the amount of hardener was 0.5~2 times more than the resin, exothermic heat and curing speed were both increased. In case of included hardener to resin was lower than official ratio, mechanical strength (tensile shear strength, tensile strength and compressive strength) became higher along with active cross-linking bonding of the epoxy resin. Medium curing type epoxy relatively had lower exothermic heat and slower reaction during curing process. It was observed to be put to definite point of mechanical strength under lower content of hardener than official ratio. While, hardener ratio more than twice the resin slowed down the curing greatly and lowered the adhesion strength also. In conclusion, under the lower mixing rate of hardener than official ratio would show relatively fast reaction with similar mechanical strength. Over the official ratio on the other hand, material property drops rapidly. Accordingly, mixing ratio of epoxy resin is expected to be influential to the stability of cultural heritage.

• Elastomers and Composites
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• v.42 no.1
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• pp.47-54
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• 2007

Reaction kinetics of polyurethane elastomers (PU) were studied using dynamic DSC and TGA for three PU samples of general purpose (Sample A), high temperature cross-likable CASE purpose with MOCA (Sample B), and RT cross-likable CASE purpose grade (Sample C). From DSC results, sample with MOCA(Sample B) showed lower shift of peak temperature, while showing broader thermograms than those of general purpose grade (Sample A). On the other hand, RT cross-linkable PU grade (Sample C) showed an interesting double mode reaction patterns, i.e., a lower temperature reaction at about $70\;^{\circ}C$, and a higher temperature reaction in the range of $140{\sim}170\;^{\circ}C$, indicating that it requires 2-step reaction process in order to complete the reaction. Once the cross-linking reaction completed, however, TGA results showed that all the samples would be considered to have similar chemical structures, showing similar decomposition processes. Sample C, especially, had showed decomposition properties of both Sample A and Sample B. Formation activation energies calculated from Kissinger method showed 10.39, 65.85, 36.52(Low $T_p$) and 18.21(High $T_p$) kcal/mol, while decomposition activation energies were 31.94, 30.84, 24.16 kcal/mol, respectively.

• Polymer(Korea)
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• v.24 no.6
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• pp.837-844
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• 2000

The cure behavior of commercial epoxy molding compounds (EMC) commonly used for IC package was studied at constant cure temperatures as well as at constant heating rates using differential scanning calorimetry (DSC), rheometer, and dielectric analyzer (DEA). The cure kinetics were obtained using autocatalytic reaction model according to the Ryan Dutta method after assuming m+n equal to 2. The prediction of reaction rates by the model equation corresponded well to experimental data at all temperatures except for 10$0^{\circ}C$. The phase transitions such as gelation and vitrification occurred during network formation. At each isothermal cure temperature, $T_{g}$ was measured in accordance with cure time, and the vitrification point was attained when $T_{g}$ was equal to $T_{cure}$. The temperature dependence of gel points and vitrification points showed good agreement with Arrhenius relation. DEA using parallel plate electrode was effective for the monitoring of EMC cure. we knew that if the resin systems are materials of comparable quality, $_{gel}$$T_{g}$ is constant regardless of accelerator concentration in TTT (Time-Temperature-Transformation) diagram.