• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.97-100
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• 2004

In recent years, a demand for micro-structure machining is increasing by the development of information and optics industries. Micro machining technology is in general well known in the field of lithograghy. However, the requirement of producing micro machine and/or micro mechanism with metal materials will be increased since a variety of workpiece configurations can be easily made. In this paper, ultra precision machine is developed to obtain micro groove and mirror surface using single crystal diamond tool. According to the cutting experiment, no burr was found at the edge of V-grooves, and the surface roughness of copper is about 1～3nm Ra. It is verified that ultra precision machine is effective to high precision machining.

• Journal of Astronomy and Space Sciences
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• v.22 no.1
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• pp.13-20
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• 2005

Bound abrasive grinding is used for the initial fabrication phase of the precision aspheric mirrors for both space and ground based astronomical telescopes. We developed a new grinding optimization process that determines the input grinding variables for the target surface roughness, checks the grinding error magnitude in resulting surface roughnesses, and minimizes the required machining time. Using the machining data collected from the previous grinding runs and subsequently fed into the multivariable regression engine, the process has the evolving controllability that suggests the optimum set of grinding variables for each target surface roughness. The process model was then used for ten grinding experiments that resulted in the grinding accuracy of $=-0.906{\pm}3.38(\sigma)\;nm(Ra)$ for the target surface roughnesses of Zerodur substrate ranging from 96.1 nm (Ra) to 65.0 nm (Ra) The results imply that the quantitative process optimization technique developed in this study minimizes the machining time and offers the nanometric surface roughness controllability superior to the traditional, qualitative, craftsman based grinding process for the astronomical optical surfaces.

• Korean Journal of Materials Research
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• v.6 no.1
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• pp.12-21
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• 1996

AI-1wt%Si합금을 대상으로하여 가열주형을 이용한 수평식연속주조법에 의해 경면에면서 일방향고조직을 가진 주괴를 얻기위한 주조조건을 조사하였으며, 일방향응고된 주괴를 이용하여 신선가공하였을 경우의 다이스배열과 작업조건, 연속주조조건과 신선가공시의 단선율과의 관계를 검토하였다. 그 결과, 직경 8mm 및 4mm 주괴 모두 공정 Si상이 비교적 균일하게 분포되어 있음을 확인할 수 있었고, 이들 주괴를 중간소둔없이 20$\mu\textrm{m}$까지의 초극세선가공이 가능했다. 본 연구에서 실시한 극세선의 신선가공중에 발생한 단선은 신선가공중의 작업조건의 불충분에 기인하는 것으로 사료되었다. 따라서, 본 연구에서 얻어진 일방향응고주괴는 극세선제조에 매우 우수한 원소재임을 보여주었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.265-265
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• 2004

최근 IT산업으로 대표되는 광통신 및 광신호 전달에 이용되는 광 반사경 및 렌즈어레이, 광가이드 판넬(BLU, FLU)등 광부품의 수요가 급증하고 있고, 이의 생산을 위한 다양한 제조공정이 연구 개발되고 있다 근년까지 이러한 마이크로 광부품의 제조방법은 포토리소그래피, 에칭기술을 베이스로 한 MEMS 기술, PDMS를 이용한 복재기술에 크게 의존하고 있다. 기계적 가공법으로는 오래전부터 초정밀 경면 선삭이나 연삭에 의한 마이크로 렌즈와 미세 패턴의 금형가공이 이루어져 왔다.(중략)

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.3
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• pp.13-18
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• 2012

We investigated the cell activity of controlled titanium surface using various grinding methods including ELID (Electrolytic In-Process Dressing) grinding method. The influence of titanium surface condition by each grinding process on the cell activity was evaluated by ALP activity of MSC(Mesenchymal Stem Cells). The ALP activity of controlled surface by ELID grinding process using # 2000 wheel was higher than that of other titanium surface. The morphological, chemical properties of machined surface by grinding method was observed using various analytical method.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.10 no.5
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• pp.350-355
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• 2000

The fabrication of sapphire wafer in C plane has been developed by horizontal Bridgeman method and GaN based semiconductor epitaxial growth has been carried out in metal organic chemical vapour deposition. The single crystalline ingot of sapphire has been utilized for 2 inch sapphire wafers and wafer slicing and lapping machines were designed. These several steps of lapping processes provided the mirror-like surface of sapphire wafer. The measurements of the surface flatness and the roughness were carried out by the atomic force microscope. The GaN thin film growth on the developed wafer was confirmed the wafer quality and applicability to blue light emitting devices.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.4 no.3
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• pp.25-30
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• 1995

A new finishing process, magnetic-electrolytic-abrasive polishing(MEAP), combining Lorentz' force effect in the traditional electrolytic finishing process was developed to realize the high efficiency as well as high surface quality of finishing . The paper describes the theoretical basis about the modification of electrolytic ions motion by the magnetic field. The effect of magnetic field on the electrolytic process was discussed was and analyzed from the result of model test.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.04a
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• pp.60-65
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• 1992

A hypereutectic Aluminum-Silicon Alloyis widely used in the parts of automobile because of high-resistance and good strength. In this study, the cutting of a hypereutectic A1-Si alloy (A390) for extraction of Si particle was experimentally investigatec. By proper selection of cutting tool material and optimization of cutting conditions economical machining of this alloy is achieved. The surface roughness relate closely with the feed rate and cutting speed.

• Journal of the Korean Vacuum Society
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• v.10 no.3
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• pp.361-367
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• 2001

Recently, Chemical Mechanical Polishing(CMP) has become a leading planarization technique as a method for silicon wafer planarization that can meet the more stringent lithographic requirement of planarity for the future submicron device manufacturing. The SOI(Silicon On Insulator) wafer has received considerable attention as bulk-alternative wafer to improve the performance of semiconductor devices. In this paper, the objective of study is to investigate Material Removal Rate(MRR) and surface micro-roughness effects of slurry and pad in the CMP process. When particle size of slurry is increased, Material Removal rate increase. Surface micro-roughness is greater influenced by pad than by particle size of slurry. As a result of AM measurement, surface micro-roughness was improved from 27 $\AA$ Rms to 0.64 $\AA$Rms.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.629-632
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• 2005

ELID(ELectrolytic In-process Dressing) grinding is an excellent technique for mirror grinding of various advanced metallic or nonmetallic materials. A polishing process is also required for elimination of scratches present on ELID grinded surfaces. MAP(Magnetic Assisted Polishing) has been used as a polishing method due to its high polishing efficiency and to its resulting in a superior surface quality. This study describes an effective fabrication method combining ELID and MAP of nano-precision mirror grinding for glass-lens molding mould, such as WC-Co, which are extensively used in precision tooling material. And for the optics glass-ceramic named Zerodure, which is extensively used in precision optics components too. The experimental results show that the combined method is very effective in reducing the time required for final polishing. The best surface roughness of the polished glass-ceramic was within 1.7nm Ra in this study.