• 대한기계학회논문집B
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• 제25권10호
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• pp.1337-1345
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• 2001

Numerical investigation is made to study the effects of thermosolutal convection on the formation of macrosegregation in a Pb-Sn alloy solidification process in a two dimensional confined rectangluar mold. The basic equations are sovled using the Contrinum Model theory with the SIMPE algorithm during the solidification process. In addition, to track the liquid-solid interface with time variations, the moving boundary condition was adopted and moving irregular interface shapes were treated with the time-dependent, boundary-fitted coordinate system. As the temperature reduces from the liquidus to the solidus, the liquid concentration of Sn, the lighter constituent, increases. Then the buoyancy-driven flow due to temperature and liquid composition gradients occurs in the mushy region and forms the complicated macrosegregation maps. belated to this phenomena, effects on the macrosegregation formation depending on the cooling condition and gravity values are examined.

• 한국결정성장학회지
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• 제4권2호
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• pp.169-177
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• 1994

결정성장된 시편의 농도분포를 제어하기 위해서는 초기융액의 농도를 균일하게 하여야 한다. 용질농도가 초기융액에 있어서 균일하지 않다면, 성장된 시편에 예측한 것과 다른 거시편석이 발생할 수 있다. 위 쪽의 온도가 높은 온도 구배를 갖고 아래로부터 응고를 진행시키는 Bridgman 방법으로 Al-Cu 합금을 성장시키는 경우, 성장된 시편의 어용질 농도분포가 초기응고 부분이 높고 을고가 진행됨에 따라 감소하는 경향을 갖는 것으로 관찰되었다. 이런 현사은 주괴가 녹으면서 도가니와 주괴의 틈으로 스며나온 Cu의 농도가 높은 융액이 주괴가 완전히 녹은 후의 대류에 의해 아래부분에 축적됨으로 발생했다. Al-Mg 합금의 경우 도가니와 주괴의 틈으로 스며나온 Mg의 농도가 높은 융액이 주괴가 완전히 녹은 후의 대류에 의해 떠오르면서 용질 농도분포가 성장중에 최소값을 가지는 것으로 나타났다. 이러한 거시편석을 억제하기 위하여, 균질화 처리 또는 도가니와 주괴의 틈을 없게 함으로 균일한 농도의 초기유액을 얻었다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집B
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• pp.37-44
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• 2000

Numerical investigation is made to study the effects of natural convection on the formation of macrosegregation of a Pb-Sn alloy solidification process in a 2-D confined rectangle mold. The governing equations are calculated using previous continuum models with SIMPLE algorithm doring the solidification process. In addition. to track the solid-liquid interface with time variations. the moving boundary condition Is adopted and irregular interface shapes are treated with Boundary-Fitted Coordinate system. As the temperature reduce from the liquidus to the solidus, the liquid concentration of Sn. the lighter constituent, increases. Then the buoyancy-driven flow due to temperature and liquid composition gradients, called thermosolutal convection or double diffusion, occurs in the mushy region and forms the complicated macrosegregation maps. Related to this phnomena, effects on the macrosegregation formation depending on the cooling condition and gravity values are described.

• 한국주조공학회지
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• 제17권1호
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• pp.76-84
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• 1997

An investigation of the effects of transverse magnetic field on melt convection and macrosegregation in vertical Bridgman growth of Te doped InSb was carried out by means of microstructure observation, the measurement of Te distribution by Hall measurement, electrical resistivity measurement and X-ray analysis. Prior to the experiments, interface stability, convective instability and suppression of convection by magnetic field were examined. A thermosolutal convection in the Te doped InSb melt occurred in the examined growth condition without magnetic field. The effective distribution coefficient, $K_{eff}$, was about 0.35 without magnetic field, 0.45 with magnetic field of 2kG, and 0.7 at 4kG. It was found that the stronger the applied magnetic field was, the more the convection was suppressed.

• 한국재료학회지
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• 제25권9호
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• pp.435-441
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• 2015

The ${\gamma}/{\gamma}^{\prime}$ two-phases, commonly known as a eutectic structure, are observed in the ${\gamma}$ interdendritic region of a Ni-base superalloy. However, the growth behavior of the ${\gamma}/{\gamma}^{\prime}$ two-phases, whether it is of eutectic or peritectic nature, has not been decidedly established. Directional solidifications were, thus, performed with the planar interface at a low growth rate of $0.5{\mu}m/s$ in order to promote macro segregation. Directional solidification started with the ${\gamma}$ planar interface and the ${\gamma}^{\prime}$ phase nucleated on the ${\gamma}$ planar interface at the solidification fraction of 0.75. The ${\gamma}/{\gamma}^{\prime}$ two-phases showed the ${\gamma}^{\prime}$ rod structure as major phase and the ${\gamma}$ minor phase between ${\gamma}^{\prime}$ rods, and the volume fraction of the ${\gamma}$ phase changed continuously with an increasing solidification fraction. The two-phase ${\gamma}/{\gamma}^{\prime}$ is seen as the coupled peritectic.

• 한국주조공학회지
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• 제39권1호
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• pp.7-13
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• 2019

Few studies of large blooms over 700 mm thick among those used for the forging of raw materials have been reported. The cooling rate difference between the surface and the center of a large bloom is large, and the degradation of the mechanical properties is likely in cases involving excessively coarse precipitates resulted from the slow cooling rate of a large bloom after casting. Therefore, a schematic investigation of the growth behaviors of precipitates while varying their locations in blooms is necessary. The dissolution behaviors of precipitates were investigated by simulating a reheating process during which the bloom is heated to a high temperature. The segregation behavior of the as-cast large bloom was also investigated. Reheating specimens were obtained after an isothermal heat treatment at $1150^{\circ}C$ with various holding times to simulate the reheating process, with the samples undergoing a subsequent water quenching step. The precipitates were extracted using an electrolytic extractor and a particle size analysis was conducted with the aid of SEM, EDS, and TEM. In the present work, Al oxide, MnS and Nb carbide were mainly observed.

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.19-27
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• 2003

플립칩 전자패키지에서 칩과 기판(PCB)를 연결할 때, 통상적으로 칩쪽은 금속패드/UBM 처리를 기판 쪽은 표면처리를 한 후 솔더로 연결하는데, 이 때 사용되는 UBM이나 표면처리에 따라, 칩/솔더, PCB/솔더에 생성되는 금속간 화합물의 종류와 두께 및 솔더의 조성이 변하게 되어 궁극적으로 솔더 접합부의 기계적 신뢰성에 영향을 주게 된다. 본 연구에서는 Cu와 Au/Ni의 두가지 금속 패드가 무연솔더의 저주기 피로특성에 어떠한 영향을 미치는 지에 대해 고찰해 보았다. 저주기 피로 실험은 Cu나 Au/Ni이 표면처리 된 기판에 무연솔더 (Sn-3.5Ag, Sn-3.5Ag-1.5Cu, Sn-3.5Ag-XBi(X=2.5, 7.5), Sn-0.7Cu)를 리플로하여 총변위를 변화시키면서 상온에서 시행하였다. 기판의 표면처리에 관계없이 Sn-3.5Ag, Sn-3.5Ag-XCu(X-0.75, 1.5), Sn-0.7Cu 합금이 Sn-3.5Ag-7.5Bi 합금보다 피로저항성이 현격히 좋았으며, Au/Ni 표면처리한 솔더 접합부가 Cu 처리한 경우보다 피로저항성이 뛰어난 것으로 나타났다. 파괴 후 단면을 조사한 결과 계면에 형성된 금속간 화합물 내에 미세균열이 발견되었는데, Cu 표면처리를 사용한 경우 더 많은 미세균열이 생성된 것을 볼 수 있었다. Sn-3.5Ag, Sn-3.5Ag-Cu(X=0.75, 1.5), Sn-0.7Cu 합금의 경우 금속간 화합물 내에 생기는 미세 균열이 거시 균열로 성장하지 않고 파단은 항상 솔더 내부로 일어난 반면. Bi를 함유한 솔더의 경우, 기판의 표면처리에 상관없이 금속간 화합물/솔더 계면으로 균열이 생성 진전되어 다른 솔더합금에 비해 열악한 피로저항성을 나타내는 것으로 보인다. 이것은 Bi의 금속간화 합물/솔더 입계 편석이나 Bi 합금이 다른 합금에 비해 높은 경도값을 가지는 것에 인한 것으로 보여 진다.