• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.10
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• pp.1337-1345
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• 2001

Numerical investigation is made to study the effects of thermosolutal convection on the formation of macrosegregation in a Pb-Sn alloy solidification process in a two dimensional confined rectangluar mold. The basic equations are sovled using the Contrinum Model theory with the SIMPE algorithm during the solidification process. In addition, to track the liquid-solid interface with time variations, the moving boundary condition was adopted and moving irregular interface shapes were treated with the time-dependent, boundary-fitted coordinate system. As the temperature reduces from the liquidus to the solidus, the liquid concentration of Sn, the lighter constituent, increases. Then the buoyancy-driven flow due to temperature and liquid composition gradients occurs in the mushy region and forms the complicated macrosegregation maps. belated to this phenomena, effects on the macrosegregation formation depending on the cooling condition and gravity values are examined.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.2
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• pp.169-177
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• 1994

Dilute Al-Cu and Al-Mg alloys were solidified unidirectionally upward by Bridgman method. It is necessary that solute concentration of initial melt is uniform to be able to control the concentration of crystal. When solute concentration is not uniform, it can cause unusual macro-segregation in grown solid. A non-steady state solidification was observed where the solute concentration in the grown solid decreased with the progress of solidification, when a dilute Al-Cu melt with positive axial temeprature gradient was solidified. This was caused by leaking out of Cu-rich melt into the gap between ingot and crucible during melt-down and its sedimentation after complete melting. In the case of Al-Mg alloy, the solute concentration has a minimum in the middle of grown specimen because Mg-rich melt flowed down the gap between ingot and crucible and floated after complete melting. Uniform initial melt concentration can be achieved by the homogenization of the ingot or by the absence of the gap between ingot and crucible.

• Proceedings of the KSME Conference
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• 2000.04b
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• pp.37-44
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• 2000

Numerical investigation is made to study the effects of natural convection on the formation of macrosegregation of a Pb-Sn alloy solidification process in a 2-D confined rectangle mold. The governing equations are calculated using previous continuum models with SIMPLE algorithm doring the solidification process. In addition. to track the solid-liquid interface with time variations. the moving boundary condition Is adopted and irregular interface shapes are treated with Boundary-Fitted Coordinate system. As the temperature reduce from the liquidus to the solidus, the liquid concentration of Sn. the lighter constituent, increases. Then the buoyancy-driven flow due to temperature and liquid composition gradients, called thermosolutal convection or double diffusion, occurs in the mushy region and forms the complicated macrosegregation maps. Related to this phnomena, effects on the macrosegregation formation depending on the cooling condition and gravity values are described.

• Journal of Korea Foundry Society
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• v.17 no.1
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• pp.76-84
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• 1997

An investigation of the effects of transverse magnetic field on melt convection and macrosegregation in vertical Bridgman growth of Te doped InSb was carried out by means of microstructure observation, the measurement of Te distribution by Hall measurement, electrical resistivity measurement and X-ray analysis. Prior to the experiments, interface stability, convective instability and suppression of convection by magnetic field were examined. A thermosolutal convection in the Te doped InSb melt occurred in the examined growth condition without magnetic field. The effective distribution coefficient, $K_{eff}$, was about 0.35 without magnetic field, 0.45 with magnetic field of 2kG, and 0.7 at 4kG. It was found that the stronger the applied magnetic field was, the more the convection was suppressed.

• Korean Journal of Materials Research
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• v.25 no.9
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• pp.435-441
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• 2015

The ${\gamma}/{\gamma}^{\prime}$ two-phases, commonly known as a eutectic structure, are observed in the ${\gamma}$ interdendritic region of a Ni-base superalloy. However, the growth behavior of the ${\gamma}/{\gamma}^{\prime}$ two-phases, whether it is of eutectic or peritectic nature, has not been decidedly established. Directional solidifications were, thus, performed with the planar interface at a low growth rate of $0.5{\mu}m/s$ in order to promote macro segregation. Directional solidification started with the ${\gamma}$ planar interface and the ${\gamma}^{\prime}$ phase nucleated on the ${\gamma}$ planar interface at the solidification fraction of 0.75. The ${\gamma}/{\gamma}^{\prime}$ two-phases showed the ${\gamma}^{\prime}$ rod structure as major phase and the ${\gamma}$ minor phase between ${\gamma}^{\prime}$ rods, and the volume fraction of the ${\gamma}$ phase changed continuously with an increasing solidification fraction. The two-phase ${\gamma}/{\gamma}^{\prime}$ is seen as the coupled peritectic.

• Journal of Korea Foundry Society
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• v.39 no.1
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• pp.7-13
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• 2019

Few studies of large blooms over 700 mm thick among those used for the forging of raw materials have been reported. The cooling rate difference between the surface and the center of a large bloom is large, and the degradation of the mechanical properties is likely in cases involving excessively coarse precipitates resulted from the slow cooling rate of a large bloom after casting. Therefore, a schematic investigation of the growth behaviors of precipitates while varying their locations in blooms is necessary. The dissolution behaviors of precipitates were investigated by simulating a reheating process during which the bloom is heated to a high temperature. The segregation behavior of the as-cast large bloom was also investigated. Reheating specimens were obtained after an isothermal heat treatment at $1150^{\circ}C$ with various holding times to simulate the reheating process, with the samples undergoing a subsequent water quenching step. The precipitates were extracted using an electrolytic extractor and a particle size analysis was conducted with the aid of SEM, EDS, and TEM. In the present work, Al oxide, MnS and Nb carbide were mainly observed.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.19-27
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• 2003

Surface finishes of PCB laminates are important in the solder joint reliability of flip chip package because the types and thicknesses of intermetallic compound(IMC), and compositions and hardness of solders are affected by them. In this study, effects of surface finishes of PCB on the low cycle fatigue resistance of Sn-based lead-free solders; Sn-3.5Ag, Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag-XBi(X=2.5, 7.5) and Sn-0.7Cu were investigated for the Cu and Au/Ni surface finish treatments. Displacement controlled room temperature lap shear fatigue tests showed that fatigue resistance of Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag and Sn-0.7Cu alloys were more or less the same each other but much better than that of Bi containing alloys regardless of the surface finish layer used. In general, solder joints on the Au/Ni finish showed better fatigue resistance than those on the Cu finish. Cross-sectional fractography revealed microcracks nucleation inside of the interfacial IMC near the solder mask edge, more frequently on the Cu than the Au/Ni surface finish. Macro cracks followed the solder/IMC interface in the Bi containing alloys, while they propagated in the solder matrix in other alloys. It was ascribed to the Bi segregation at the solder/IMC interface and the solid solution hardening effect of Bi in the $\beta-Sn$ matrix.