• Fire Science and Engineering
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• v.31 no.6
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• pp.74-82
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• 2017

Fires in buildings built using sandwich panels are difficult to extinguish, and the damage caused by the fire spreading through the inner core material is extensive. Sandwich panels consist of a nonflammable material on both sides of an insulation material. The types of insulation material include organic and inorganic insulation materials, but the former are used in more than 80% of the case. Organic insulation is economically advantageous compared to inorganic insulation, but it is vulnerable to fire. Therefore, the damage caused by sandwich panel fires is higher than that for general fires. In the case of the noxious gas analyzer test, the panel is tested with three round holes having a diameter of 25 mm, in order to determine the risk of the core material, but the cone calorimeter test is carried out using a sandwich panel. In this study, the cone calorimeter test was conducted to examine the fire risk of the composite material when heated on a nonflammable surface, exposed to the core material through a hole, and heated directly the core material. The type of organic insulation employed was flame retardant EPS (Expanded Polystyrene), and the test specimens were tested in three types of sandwich panel, a perforated sandwich panel and single core material. The purpose of this study is to propose a method of measuring the fire risk of the core materials of composite materials using the cone calorimeter test.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.57-64
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• 2007

New Chip-on-glass technology to attach an Si chip directly on the glass substrate of LCD panel was studied with local heating method of the Si chip by using thin film heater fabricated on the Si chip. Square-shaped Cu thin film heater with the width of $150\;{\mu}m$, thickness of $0.8\;{\mu}m$, and total length of 12.15 mm was sputter-deposited on the $5\;mm{\times}5\;mm$ Si chip. With applying current of 0.9A for 60 sec to the Cu thin film heater, COG bonding of a Si chip to a glass substrate was successfully accomplished with reflowing the Sn-3.5Ag solder bumps on the Si chip.

• Journal of the Society of Disaster Information
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• v.19 no.2
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• pp.262-269
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• 2023

Purpose: In this study,fire-resistance test were executed to evaluate the effectiveness of the fireproof panel attached to the PSC slab in tunnel. Method: For the fire resistance test, the RWS curve was applied and the furnace of the KICT was used. Result: As a result of the experiment, the maximum temperature measured on the concrete surface of the PSC slab with the fireproof panel was 321.8℃, which was lower than the damage limit temperature of 380℃ for concrete. Also, at the t=25mm, the maximum temperature was 35.2℃, which was lower than the damage temperature of steel, 250℃. The use of precast fire resistance panel(t=30mm) improves fire resistance of PSC structures. Conclusion: As a result of the test, a reinforcement method for attached a fireproof panel in case of fire in a tunnel or an underground roadway is provided to protect a structure from fire. In the future, it is necessary to perform the static performance test of the slab to which the fireproof panel is attached, and to confirm the adhesion performance of the fireproof panel by performing the pull-off test and the fatigue test.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2017.05a
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• pp.942-944
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• 2017

High-speed vehicles are subjected to complex loads, such as acoustic pressure from the engine at launch and aerodynamic heating and aerodynamic pressure during flight. A thermal protection system panel is required to protect internal systems such as the fuel tank of the vehicle from the external environment. This study defines analytical models for heat transfer and thermal structure characteristics of the thermal protection system panel. Furthermore, the study performed parameters analysis to achieve the thermal structural integrity and to make it lighter.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.315-321
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• 2005

Chip-on-glass technology to attach IC chip directly on the glass substrate of flat panel display was studied by using induction heating body in AC magnetic field. With applying magnetic field of 230 Oe at 14 kHz, the temperature of an induction heating body made with Cu electrodeposited film of 5 mm${\times}$5 mm size and $600{\mu}m$ thickness reached to $250^{\circ}C$ within 60 seconds. However, the temperature of the glass substrate was maintained below $100^{\circ}C$ at a distance larger than 2 mm from the Cu induction heating body. COG bonding was successfully accomplished with reflow of Sn-3.5Ag solder bumps by applying magnetic field of 230 Oe at 14 kHz for 120 seconds to a Cu induction heating body of 5mm${\times}$5mm size and $600{\mu}m$ thickness.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1178-1183
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• 2004

Temperature distribution and heating characteristic of the panel heater for infrared heating have been investigated. The temperature variation with time is firstly measured with the thermocouple to figure out the response time of the heater to the power input. The heater reaches faster to the steady state in comparison to the ceramic heater. The infrared thermal imaging system is utilized to investigate the temperature distribution over the heater surface. The measured thermal images show that the thermal boundary layer induced by the free convection near the heater surface affects the temperature distribution on the surface. The images also show the fairly good uniformity of the temperature distribution in the core region of the surface.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.3 no.4
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• pp.276-285
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• 1991

The transient heat transfer characteristics in the radiant heating panel were predicted by numerical analysis. Thermal behaviors of panel, such as temperature distributions in panel and convective and radiative heat fluxes in panel surface with respect to time were obtained. Heating hours per day, rate of energy supplied and maximum temperature differences at panel surface were also compared for several important parameters. The performance and thermal comfort of heating panel were studied and compared for various operating and design conditions such as pipe pitch, pipe location, pipe diameter and flow rate of hot water for the purpose of producing useful data, which can be used for the test and decision of efficient operating condition of the conventional heating systems or the optimal design of the new panel heating systems.

• Applied Biological Chemistry
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• v.42 no.1
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• pp.58-62
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• 1999

Method to access qualities of brown sauce and optimize its cooking conditions was studied by sensory evaluation and response surface methodology. Cooks of an hotel, sauce experts, were selected as sensory panelists, and the brown sauce cooking conditions practically used in an hotel were adopted to prepare sauce samples for the sensory test. The cooking conditions were designed with two factors, i.e., one factor of roux contents with three levels and the other factor of cooking times with three levels, which were known as most important in sauce cooking. Sensory acceptance evaluation with intensity 7 grades was applied for several sauce attributes such as color, flavour, viscosity, taste and overall. Ability of each panel to perceive the differences between the brown sauces prepared under different cooking conditions was judged, and only data of the 9 panelists proved as reliable among the 12 panelists were reflected. The acceptances by different cooking conditions were found to be in the order of 11 > 9 > 13% roux contents and 8 > 9 > 7 hr cooking times. Response surface methodology was treated with second-order model on the sensory data and the optimum cooking conditions with the highest acceptances were $10.3{\sim}10.8%$ roux content and 8 hr cooking time.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.17.1-17.1
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• 2009

발포금속은 1948년에 Sosnik에 의해 알루미늄에 수은을 증발시키는 방법으로 발포 알루미늄을 제조한 이래, 1951년 Elliot에 의해 진보된 방식인 발포 매개체를 용탕에혼입하는 방법으로 발포금속을 제조하기 시작하였다. 현재 이들 선진국가의 생산방법 및 현황은 균질 기공의 조절, 연속주조 방식과 원가절감, 그리고 제조기술의 진보를 통하여 다양한 분야에 적용되고 있다. 그러나 실용화를 위해서는 요구특성을 만족하고 동시에 가격 경쟁력을 가진 제조기술의 보유 및 개발과 독특한 특성을활용한 새로운 적용 분야의 개척이 필요하다고 생각되며, 이를 위해 Harvard, MIT, Aachen, HMI 등 구미 유수 대학과 NASA, 미국방성등의 연구기관, ERG, 신강(新鋼) wire등 산업체를 중심으로제조 및 특성평가에 관한 기초연구와 활용방안이 활발히 모색중에 있다. 그리고 일부 자동차 생산 업체를중심으로 발포금속을 적용한 초경량, 에너지 절감형의 자동차 부품 소재,항공기 방열판 등에 대한 연구가 활발하게 진행되고 있다. 특히 금속 기체의 GASAR 공법은 Lotus 공법으로 Osaka 대학에서 개발되어 열교환기, 항공기, 방열기 등으로 응용이 확대되고 있다 국내에서 완제품생산은 실내장식용 복합패널로서 한소 프라임이 운영상의 문제로 생산을 중단하였으며, 유닉슨(주), 금강(주)에서 Batch식, 금성산업에서 Pot식이 일부 생산 및 연구가 진행되었으나 현재는 본연구실의 협조로 (주) 폼텍에서 발포패널을 주로 생산하고 있고 (주)드림메탈과 (주)아크로폼텍에서일부 생산되고, (주)동일알루미늄에서는 폐 scrap을 이용한 발포 Al 제조가 연구단계에 있다. 생기원에서는 분말 가열 흡음패널이 개발되었으나 강도와 내열성이 낮아 이들 특성을 향상시크는 연구가 진행중이다. 이들 제품은 성능상으로는 동양강판의 흡음패널과 KIMM의 필터용은연구개발이 낮은 수준이며, 본 연구팀과 공동 개발한 (주)폼텍의 복합패널은 10여 가지의 실용특허로 건축마감재로서 오히려 선진국수준을능가한 상태이다, 한편, 발포금속 기능성 개발은, 이들이 가지고 있는 우수한 특성 때문에 군수용으로부터 민수 산업용까지 전분야에 적용이 가능한 소재이므로 수요처를확장하고 있으므로 제품의 균질성, 안정성과 기능성 개발 향상을 위해 지속적이고 체계적인 연구가 필요하다고 생각된다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.449-449
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• 2012

플라즈마 디스플레이 패널(PDP)은 가격 경쟁력이 뛰어나고 빠른 반응 속도를 기반으로 한 생생한 화질이 구현 가능한 장점에 힘입어 대형 평판 디스플레이 시장에서 주도적인 위치를 점하여 왔다. 이러한 특징을 갖고 있는 PDP는 최근 성장세를 보이고 있는 PID (Public Information Display) 시장에서도 그 효력을 발휘할 것으로 보인다. 따라서 기존의 HD급이나 Full HD급 미소 방전셀이 아닌 대면적 방전셀을 적용한 PDP 의 방전 특성에 대한 연구가 중요할 것으로 생각된다. 본 논문에서는 ITO 전극 간격 및 전극 폭, 격벽의 폭 및 높이 등 PDP 의 방전 특성에 영향을 미치는 요소들의 수치를 변화시켜 가며 대면적 방전셀을 적용한 PDP의 기본적인 방전 특성을 살펴보고자 하였다. 이를 바탕으로 대면적 방전셀 PDP에서 고효율을 달성하기 위해 필요한 인자의 설계 방향을 제시해보고자 하였다. 본 논문에서 연구된 PDP는 0.862.58 mm의 셀의 크기를 갖도록 설계하였다. 앞서 제시한 바와 같이 구조 변수의 최적화를 위하여 ITO 전극 간격은 80~1, 전극의 폭은 250~750로 다양하게 주어 상판을 제작하였고 격벽의 폭은 100~200, 높이는 150~300까지 다양한 크기를 가지는 하판을 제작하여 박막 증착, 합착, 가열 배기 등의 과정을 통하여 최종적으로 2인치 크기의 테스트 패널을 제작하여 각 패널별 전압 변화, 휘도, 효율 특성 등이 분석되었다. 실험 결과 격벽 폭 150, 높이는 300일 때 negative glow 방전이 안정적으로 형성될 수 있었음을 확인하였고 최적화된 격벽 수치를 기반으로 다양한 ITO 전극 간격 및 전극 폭을 적용한 패널의 방전 특성을 분석할 수 있었다. 이러한 일련의 실험 결과들을 기반으로 향후 대면적 방전셀의 방전 전압을 낮추고 발광 효율을 개선하는데에 있어서 3전극의 면방전 구조를 가지는 PDP 의 셀을 설계하는데에 있어서 올바른 방향을 마련할 수 있을 것이라 생각된다.