• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
• /
• pp.338-341
• /
• 2002

$(Ba_{1-x}Sr_{0.4}Ca_x)TiO_{3}$ (x=0.10, 0.15, 0.20) powders were prepared by the sol-gel method and BSCT thick films were fabricated by the screen-printing method. Their structural and dielectric properties were investigated with variation of composition ratio and $Al_{2}O_{3}$ doping contents. As results of the X-ray diffraction and microstructure analysis, the grain size of BSCT thick films was decreased with increasing $Al_{2}O_{3}$ amount. The thickness of BSCT thick films by 4-coating/drying is about $110{\sim}120{\mu}m$. The tunability increased with decreasing Ca content, and the BSCT(50/40/10) specimen doped with 1.0wt% $Al_{2}O_{3}$ showed the highest value of 12.94% at 5kV /cm.

• 한국진공학회지
• /
• 제11권3호
• /
• pp.135-140
• /
• 2002

본 논문에서는 p-type (100)Si, (100)MgO 그리고 MgO/si 기판 위에 RF Magnetron sputtering 법으로 $Ba_{0.5}Sr_{0.5}TiO_3$(BST)박막을 증착하였다. BST 박막 증착 후 RTA(Rapid Thermal Annealing)를 이용하여 $600^{\circ}C$에서 산소분위기로 1분간 고온 급속 열처리를 하였다. 증착된 BST박막의 결정화를 조사하기 위해 XRD(X-Ray Diffraction)측정을 한 결과 모든 기판에서 (110) $Ba_{0.5}Sr_{0.5}TiO_3$(의 주피크가 관찰되어졌고, 열처리 후 재결정화에 기인하여 피크 세기가 증가함을 관찰할 수 있었다. Al 전극을 이용한 커패시터 제작 후 측정한 C-V(Capacitance-Voltage) 특성에서 각각의 기판에서 측정된 커패시턴스 값으로 계산된 유전율은 120(bare Si), 305(Mgo/Si) 그리고 310(MgO)이었다. 누설 전류 특성에서는 0.3 MV/cm이내의 인가전계에서 1 $\mu\textrm{A/cm}^2$ 이하의 안정된 값을 보여주었다. 결론적으로 MgO 버퍼층을 이용한 기판이 BST 박막의 증착을 위한 기판으로써 효과적임을 알 수 있었다.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
• /
• pp.157.1-157.1
• /
• 2016

In this work, we experimentally investigated the solar absorption performance of Cu-based scalable nanostructured surfaces and compared their performance with the conventional TiNOX. We fabricated Cu-based nanostructured surfaces with a controlled chemical oxidation process applicable to a large area or complex geometry. We optimized the process parameters including the chemical compounds, dipping time and process temperature. We conducted both lab-scale and outdoor experiments to characterize the conversion efficiency of each absorber surfaces with single and double glazing setup. Lab-scale experiment was conducted with $50mm{\times}50mm$ absorber sample with 1-sun condition (1kW/m2) using a solar simulator (PEC-L01) with measuring the temperature at the absorber plate, cover glass, air gap and ambient. From the lab-scale experiment, we obtained ${\sim}91^{\circ}C$ and $94^{\circ}C$ for CuO and TiNOX surfaces after 1 hr of solar illumination at single glazing, respectively. To measure the absorber performance at actual operating condition, outdoor experiment was also conducted using $110mm{\times}110mm$ absorber sample. We measured the solar flux with thermopile detector (919P-040-50). From outdoor experiment, we observed ${\sim}123^{\circ}C$ and $131^{\circ}C$ for CuO and TiNOX with 0.6 kW/m2 insolation at double glazing, respectively. We showed that the suggested nanostructured CuO solar absorber has near-equivalent collection efficiency compared with the state-of-the-art TiNOX surfaces even with much simpler manufacturing process that does not require an expensive equipment.

• 한국전기전자재료학회논문지
• /
• 제11권6호
• /
• pp.436-441
• /
• 1998

$Pt/SrTiO_3/Pb_x(Zr_{0.52}, Ti_{0.48})O_3/SrTiO_3/Si$ structure was prepared by rf-magnetron sputtering method for use in nondestructive read out ferroelectric RAM(NDRO-FEAM). PBx(Zr_{0.52}Ti_{0.48})O_3}$(PZT) and $SrTiO_3$(STO) films were deposited respectively at the temperatures of $300^{\circ}C and 500^{\circ}C$on p-Si(100) substrate. The role of the STO film as a buffer layer between the PZT film and the Si substrate was studied using X-ray diffraction (XRD), Auger electron spectroscopy (ASE), and scanning electron microscope(SEM). Structural analysis on the interfaces was carried out using a cross sectional transmission electron microscope(TEM). For PZT/Si structure, mostly Pb deficient pyrochlore phase was formed due to the serious diffusion of Pb into the Si substrate. On the other hand, for STO/PZT/STO/Si structure, the PZT film had perovskite phase and larger grain size with a little Pb interdiffusion. the interfaces of the PZT and the STO film, of the STO film and the interface layer and $SiO_2$, and of the $SiO_2$ and the Si substate had a good flatness. Across sectional TEM image showed the existence of an amorphous layer and $SiO_2$ with 7nm thickness between the STO film and the Si substrate. The electrical properties of MIFIS structure was characterized by C-V and I-V measurements. By 1MHz C-V characteristics Pt/STO(25nm)/PZT(160nm)/STO(25nm)/Si structure, memory window was about 1.2 V for and applied voltage of 5 V. Memory window increased by increasing the applied voltage and maximum voltage of memory window was 2 V for V applied. Memory window decreased by decreasing PZT film thickness to 110nm. Typical leakage current was abour $10{-8}$ A/cm for an applied voltage of 5 V.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 추계학술대회 논문집
• /
• pp.463-466
• /
• 2001

In recent year, Ferroelectric BLT($Bi_{4-x}$La$_{x}$Ti$_3$O$_{12}$) is a promising candidate materials. This study was Practiced to make good conditions of BLT targets. In this study, calcination and sintering temperature were kept at 75$0^{\circ}C$, 110$0^{\circ}C$ for 2 hour respectively. the density obtained 7.612, 7.98, 7.877 g/㎤ as La$_2$O$_3$ contents were 0.0mol%, 0.25mo1%, 0.5mol%. Especially, the lanthanum content of 0.5 mol% measured C-axis (117) preferred orientation more than the others targets in the XRD. In $\varepsilon$$_{r}$-f relationship using by HP 4194 A impedance analyzer, the 0.5 mol% observed above 200 relative dielectric constant. but the dissipation factor was higher than others targets at 100Hz~13MHz range. SEM photograph with the content of La$_2$O$_3$ was observed like rod and plate types.types.s.

• 한국재료학회지
• /
• 제27권11호
• /
• pp.577-582
• /
• 2017

Self-cleaning and photocatalytic $TiO_2$ thin films were prepared by a facile sol-gel method followed by spin coating using peroxo titanic acid as a precursor. The as-prepared thin films were heated at low temperature($110^{\circ}C$) and high temperature ($400^{\circ}C$). Thin films were characterized by X-ray diffraction(XRD), Field-emission scanning electron microscopy(FESEM), UV-Visible spectroscopy and water contact angle measurement. XRD analysis confirms the low crystallinity of thin films prepared at low temperature, while crystalline anatase phase was found the for high temperature thin film. The photocatalytic activity of thin films was studied by the photocatalytic degradation of methylene blue dye solution. Self-cleaning and photocatalytic performance of both low and high temperature thin films were compared.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2004년도 제27회 학술발표회 초록집
• /
• pp.198-198
• /
• 2004

• 한국구조물진단유지관리공학회 논문집
• /
• 제2권2호
• /
• pp.170-176
• /
• 1998

The team mixed PbO, $ZrO_2$, $TiO_2$, $Nb_2O_5$ and $MnCO_3$, to make $Pb[(Zr_{0.54}\;Ti_{0.46})\;Nb_{0.005}]O_3+4%MnCO_3$. The electroded PZT ceramics were poled by 3 kV/mm at $110^{\circ}C$ for 600 s. We assembled the 0.4mm thick PZT slices into ultrasonic transducers. Central frequency of the probe is 5 MHz, which is proper to the thickness gauge for steel pipes and for flaw detector. The probe can detect a disk shape defect of 1mm diameter at 15cm deep in steel block. The new probe's Fresnel zone that the ultrasonic beam do not broaden is 13mm. Over the Fresnel zone, the ultrasonic beam spreads. Half of the beam spread angle of the probe is $4.3^{\circ}-4.6^{\circ}$. This probe can be used for the ultrasonic transducers for non-destructive testing of steel bridges.

• 마이크로전자및패키징학회지
• /
• 제30권2호
• /
• pp.60-64
• /
• 2023

본 연구에서는 그래핀 기반 소자의 성능에 영향을 미치는 그래핀과 금속 사이의 전기적 접촉저항 특성을 비교 분석하였다. 화학기상증착법을 이용하여 고품질의 그래핀을 합성하였으며, 전극 물질로 Al, Cu, Ni 및 Ti를 동일한 두께로 그래핀 표면 위에 증착하였다. TLM (transfer length method) 방법을 통해 SiO₂/Si 기판에 전사된 그래핀과 금속의 접촉저항을 측정한 결과, Al, Cu, Ni, Ti의 평균 접촉저항은 각각 345 Ω, 553 Ω, 110 Ω, 174 Ω으로 측정되었다. 그래핀과 물리적 흡착 특성을 갖는 Al와 Cu에 비해 화학적 결합을 형성하는 Ni과 Ti의 경우, 상대적으로 더 낮은 접촉저항을 갖는 것을 확인하였다. 본 연구의 그래핀과 금속의 전기적 특성에 대한 연구 결과는 전극과의 낮은 접촉저항 형성을 통해 고성능 그래핀 기반 전자, 광전자소자 및 센서 등의 구현에 기여할 수 있을 것으로 기대한다.

• 한국세라믹학회지
• /
• 제30권8호
• /
• pp.657-663
• /
• 1993

BaTiO3 sputtering targets of 3 inch diameter were prepared by sintering the CIP (Cold Isotatic Pressing) compacts at 136$0^{\circ}C$ for 3hrs. The apparent density and grain size were 97% and 30${\mu}{\textrm}{m}$, respectively. After BaTiO3 films were deposited on Si and Pt/Ti/SiO2/Si substrates using these targets, films were annealed at various conditions and the crystallization behavior, reaction with the substrate and the electrical properties were investigated. The films on both substrates required 5~20hrs furnace annealing for crystallization at the temperatures from $600^{\circ}C$ to 80$0^{\circ}C$. For the films on Si substrate, interaction between the film and the substrate was suppressed upt o $700^{\circ}C$ for 10 hrs and the relative dielectric constant was 30. As the annelaing temperature and time were increased, the relative dielectric constants of the films decreased due to the formation of silicate phases through the reaction with the substrate. For the BaTiO3 films on Pt/Ti/SiO2/Si substrate, the reaction with the substrate was further reduced when the annealing condition was identical to that for Si substrate, but the reaction between the layers in Pt electrode took place above $700^{\circ}C$. When the films were annealed at $600^{\circ}C$ where the stability of Pt electrode was sustained, relative dielectric constant was increased to 110 since the reaction with substrate was effectively reduced even for a longer annealing time and the crystallization was enhanced.