• 한국세라믹학회지
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• 제31권12호
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• pp.1577-1587
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• 1994

TiO2 thin films with the substitution of oxygen with nitrogen were deposited on silicon substrate by metalorganic chemical vapor deposition (MOCVD) using Ti(OCH(CH3)2)4 (titanium tetraisopropoxide, TTIP) and N2O as source materials. X-ray diffraction (XRD) results indicated that the crystal structure of the deposited thin films was anatase TiO2 with only (101) plane observed at the deposition temperatures of 36$0^{\circ}C$ and 38$0^{\circ}C$, and with (101) and (200) plane at above 40$0^{\circ}C$. Raman spectroscopic results indicated that the crystal structure was anatase TiO2 in accordance with the XRD results without any rutile, fcc TiN, or hcp TiN structure. No fundamental difference was observed with temperature increase, but the peak intensity at 194.5 cm-1 increased with strong intensity at 143.0 cm-1 for all samples. The crystalline size of the films varied from 49.2 nm to 63.9 nm with increasing temperature as determined by slow-scan XRD experiments. The refractive index of the films increased from 2.40 to 2.55 as temperature increased. X-ray photoelectron spectroscopy (XPS) study showed only Ti 2s, Ti 2p, C 1s, O 1s and O 2s peaks at the surface of the film. The composition of the surface was estimated to be TiO1.98 from the quatitative analysis. In the bulk of the film Ti 2s, Ti 2p, O 1s, O 2s, N 1s and N 2s were detected, and Ti-N bonding was observed due to the substitution of oxygen with nitrogen. A satellite structure was observed in the Ti 2p due to the Ti-N bonding, and the composition of titanium nitride was determined to be about TiN1.0 from the position of the binding energy of Ti-N 2p3/2 and the quatitative analysis. The spectrum of Ti 2p energy level could be the sum of a 4, 5, or 6 Gaussian curve reconstruction, and the case of the sum of the 6 Gaussian curve reconstruction was physically most meaningful. From the results of Auger electron spectroscopy (AES), it was known that the composition was not varied significantly throughout the whole thickness of the film, and silicon oxide was not observed at the interface between the film and the substrate. The composition of the film was possible (TiO2)1-x.(TiN)x or TiO2-2xNx and in this experimental condition x was found to be about 0.21-0.16.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2012년도 춘계학술발표대회
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• pp.110.1-110.1
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• 2012

Recently, advances in ZnO based oxide semiconductor materials have accelerated the development of thin-film transistors (TFTs), which are the building blocks for active matrix flat-panel displays including liquid crystal displays (LCD) and organic light-emitting diodes (OLED). However, the electrical performances of oxide semiconductors are significantly affected by interactions with the ambient atmosphere. Jeong et al. reported that the channel of the IGZO-TFT is very sensitive to water vapor adsorption. Thus, water vapor passivation layers are necessary for long-term current stability in the operation of the oxide-based TFTs. In the present work, $Al_2O_3$ and $TiO_2$ thin films were deposited on poly ether sulfon (PES) and $SnO_x$-based TFTs by electron cyclotron resonance atomic layer deposition (ECR-ALD). And enhancing the WVTR (water vapor transmission rate) characteristics, barrier layer structure was modified to $Al_2O_3/TiO_2$ layered structure. For example, $Al_2O_3$, $TiO_2$ single layer, $Al_2O_3/TiO_2$ double layer and $Al_2O_3/TiO_2/Al_2O_3/TiO_2$ multilayer were studied for enhancement of water vapor barrier properties. After thin film water vapor barrier deposited on PES substrate and $SnO_x$-based TFT, thin film permeation characteristics were three orders of magnitude smaller than that without water vapor barrier layer of PES substrate, stability of $SnO_x$-based TFT devices were significantly improved. Therefore, the results indicate that $Al_2O_3/TiO_2$ water vapor barrier layers are highly proper for use as a passivation layer in $SnO_x$-based TFT devices.

• 산업기술연구
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• 제25권A호
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• pp.157-162
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• 2005

In this study, the fabrication of PZT films was performed from a multilayer structure comprising $TiO_2$, $ZrO_2$ and PbO thin films prepared by rapid themal chemical vapor deposition(RTMOCVD). $TiO_2$, $ZrO_2$ and PbO are the component layers of oxide multilayer system for a single phase PZT thin film. The composition control of PZT thin film was done by the thickness control of individual component layer. The composition ratio of Pb:Ti:Zr with thickness were 1:0.94:0.55. Occurrence of a single-phase of PZT was initiated at around $550^{\circ}C$ and almost completed at $750^{\circ}C$ under the fixed time of 1hr. As the concentration of Pb increased, the roughness and crystallization in the film increased. From the as result of using XPS and TEM, the single phase formation through annealing is evident. The electrical properites of the prepared PZT thin film(Zr/Ti=40/60, 300 nm) on a Pt-coated substrate were as follow: dielectric constant ${\varepsilon}_r=475$, coercive field Ec=320 kV/cm, and remanant polarization $P_r=11{\mu}C/cm^2$ at an applied voltage of 18 V.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2002년도 학술대회논문집
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• pp.329-334
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• 2002

This study evaporates TiO$_2$ layer thickness differently with RF sputtering method on Si Wafer(n-100). Thin film is made with the structure of Si+TiO$_2$ and Si+TiO$_2$+Al by evaporating TiN which is used as Antireflection of superintegrated semiconductor integrated circuit with Photo Catalyst. The research is performed to increase the characteristics of photon energy according to TiO$_2$ thickness and the reliability and reproducibility of TiO$_2$ thin film. Reversal of electric Permittivity values is induced by dipole polarization shown in the dielectric of thin film. Complex electric constant ($\varepsilon$$_1$, $\varepsilon$$_2$) has larger peak values as it's thickness is thinner and then it is larger according to the increase of frequency. Electric Permittivity by photon energy has large value in imaginary number and is reduced exponentially by the increase of carrier density according to that of photon energy.

• 한국전기전자재료학회논문지
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• 제11권6호
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• pp.436-441
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• 1998

$Pt/SrTiO_3/Pb_x(Zr_{0.52}, Ti_{0.48})O_3/SrTiO_3/Si$ structure was prepared by rf-magnetron sputtering method for use in nondestructive read out ferroelectric RAM(NDRO-FEAM). PBx(Zr_{0.52}Ti_{0.48})O_3}$(PZT) and $SrTiO_3$(STO) films were deposited respectively at the temperatures of $300^{\circ}C and 500^{\circ}C$on p-Si(100) substrate. The role of the STO film as a buffer layer between the PZT film and the Si substrate was studied using X-ray diffraction (XRD), Auger electron spectroscopy (ASE), and scanning electron microscope(SEM). Structural analysis on the interfaces was carried out using a cross sectional transmission electron microscope(TEM). For PZT/Si structure, mostly Pb deficient pyrochlore phase was formed due to the serious diffusion of Pb into the Si substrate. On the other hand, for STO/PZT/STO/Si structure, the PZT film had perovskite phase and larger grain size with a little Pb interdiffusion. the interfaces of the PZT and the STO film, of the STO film and the interface layer and $SiO_2$, and of the $SiO_2$ and the Si substate had a good flatness. Across sectional TEM image showed the existence of an amorphous layer and $SiO_2$ with 7nm thickness between the STO film and the Si substrate. The electrical properties of MIFIS structure was characterized by C-V and I-V measurements. By 1MHz C-V characteristics Pt/STO(25nm)/PZT(160nm)/STO(25nm)/Si structure, memory window was about 1.2 V for and applied voltage of 5 V. Memory window increased by increasing the applied voltage and maximum voltage of memory window was 2 V for V applied. Memory window decreased by decreasing PZT film thickness to 110nm. Typical leakage current was abour $10{-8}$ A/cm for an applied voltage of 5 V.

• 공업화학
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• 제34권1호
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• pp.30-35
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• 2023

TiO₂ 졸을 사용하여 유리알 표면에 TiO₂ 코팅한 후 건조 처리한 시료(TB)와 소성한 시료(TBc)를 제조하였다. 이들 시료에 대한 TiO₂ 박막의 특성분석과 메틸렌블루 및 톨루엔의 광분해 실험을 수행하였다. FE-SEM, XPS 및 FTIR 분석 결과, TB 시료의 TiO₂ 박막은 스펀지 폼과 같은 형태이며 무정형 TiO₂와 일부 결정형 TiO₂가 존재하였다. TBc 시료의 TiO₂ 박막에는 결정형 TiO₂가 주로 존재하며 침상형 입자와 미세 입자들이 혼재하였다. TBc 시료(46 mg/g)의 톨루엔 흡착량은 같은 코팅량의 TB 시료 대비 적었으나 톨루엔 분해율은 비슷했다. TB 시료의 경우, TiO₂ 코팅량이 증가함에 따라 톨루엔 분해능이 흡착능에 비해 적게 감소하였다. 이러한 결과는 소성하지 않은 TB 시료는 TiO₂ 코팅량이 증가하면 무정형 텍스처의 비표면적은 감소하는 반면 결정성 입자들의 활성점 감소는 적게 일어나기 때문으로 판단된다.

• 한국세라믹학회지
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• 제30권9호
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• pp.775-783
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• 1993

TiO2-SiO2 system anti-reflective(AR) film was prepared to decrease reflectance on the glass surface. The experiments were carried out as fellow, 1) preparation & hydrolysis of TiO2-SiO2 system sols. 2) glass dipping, and 3) drying & heat treatment. We investigated the refractive index and thickness of film with viscosity, zeta-potential of sol, sol concentration, withdrawal speed, drying and heat treatment condition. As a result, we prepared good qualitative Quarter-Half-Quarter type anti-reflective film that had minimum, 0.02% and average reflectance, 0.087% in the visible region.

• 한국세라믹학회지
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• 제28권9호
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• pp.721-729
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• 1991

SnO2-TiO2(Pt or Pd), as raw material for hydrocarbon gas sensors, was prepared by a coprecipitation method. The SnO2-TiO2-based thick film gas sensors were made by screen printing technique. The titanium dioxide synthesized was shown to be anatase structure from XRD peaks and was transformed to rutile structure between 700$^{\circ}C$ and 1000$^{\circ}C$. Titanium dioxide in SnO2-TiO2 thick films devices plays a very important role in the enhancement of the sensitivity to CH4 and C4H10. In the case of SnO2-TiO2(Pt) sensors, titanium dioxide that was rutile structure enhanced the sensitivity of the thick film to CH4. Platinum added to the raw powder at coprecipitation (as chloroplatinic acid VI hydrate) improved the gas sensitivity to hydrocarbon gases. Therefore, it is expected that the SnO2-TiO2(Pt) thick film sensors fabricated in this experiment could be put into practical use as LPG (primary component : C4H10 and C3H8) and LNG (primary component : CH4) sensors.

• 한국재료학회지
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• 제2권3호
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• pp.163-171
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• 1992

$TiO_2$가 5-50wt%첨가된 $SnO_2/TiO_2$ 후막형 감습소자를 스크린 프린팅 법을 이용하여 제조 하였다. 소자의 표면결정구조를 XRD, SEM 그리고 FTIR로 조사하였으며, 전기적 특성에 의한 후막소자의 감습특성을 측정하였다. $SnO_2/TiO_2$ 후막은 $TiO_2$ 결정상 보다 주로$(SnO^2){\cdot}6T$ 결정상으로 나타났으며, $1300^{\circ}C$에서 소결된 후막소자의 평균입경은 $2.0{\mu}m$이었다. 또한 $1300^{\circ}C$에서 소결된 10wt% $TiO_2$가 첨가된 $SnO_2/TiO_2$ 후막소자는 상대습도 20-90%에서 높은 감습특성을 나타내었다.

• 한국진공학회지
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• 제10권2호
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• pp.234-240
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• 2001

본 연구에서는 Mg을 첨가한 Cu-alloy에 의해 TiN의 확산방지능력을 향상시키고자 하였다. Cu(Mg) 박막은 대기노출시킨 TiN박막위에 증착되었으며 열처리시 Cu 박막내의 Mg은 TiN의 표면에 있는 산소와 반응하여 매우 얇은(~100 $\AA$) MgO를 형성하게되고 MgO에 의해 TiN의 확산방지능력은 Cu(4.5 at.%Mg)의 경우 $800^{\circ}C$까지 향상됨을 알 수 있었다. 그러나 Cu(Mg) a]toy는 TiN위에서 접착특성이 좋지 않기 때문에 TiN을 $O_2$plasma 처리하였으며 $O_2$ plasma 처리후 $300^{\circ}C$ 진공열처리를 통해 접착력이 크게 향상되는 것을 알 수 있었다. 이는 $O_2$ plasma 처리에 의해 TiN표면에 Mg과 반응할 수 있는 산소의 양이 증가하는 데 기인하며 이에 따라 Mg의 계면이동이 크게 증가되어 치밀한 MgO가 형성됨을 확인하였다. 그리고 $O_2$ plasma 처리시 RF power를 증가시키면 계면으로 이동하는 Mg의 양이 오히려 감소하였고 이것은 TiN의 표면이 $TiO_2$로 변하여 Mg과 결합할 수 있는 산소의 양이 상대적으로 감소하였기 때문인 것으로 생각된다. 또한 접착층으로서 Si을 50$\AA$ 증착하여 접착력을 크게 향상시켰으며 Si 증착에 의한 TiN의 확산방지능력은 감소되지 않는 것을 알 수 있었다.