• Korean Journal of Materials Research
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• v.11 no.12
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• pp.1035-1041
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• 2001

The refining process and solubility of Ti in Al matrix during mechanical alloying (MA) were investigated by using X-ray diffraction (XRD), transmission electron microscopy (TEM) as functions of alloy composition, milling time and ball to powder ratio (BPR). Mechanical alloyed samples were annealed for investigating their stability and the formation behavior of$Al_3Ti$in the temperature range from$200{\circ}C$to$600{\circ}C$. It is observed from present experimental that disappearance of Ti peaks in mechanically alloyed Al-10wt%Ti is not simply attributable to the dissolution of Ti into Al, but associated mainly with extreme refining and/or heavy straining of Ti particles The annealing of the mechanically alloyed Al-Ti powders show differences in aluminide formation behavior when Ti content in Al is equal to or less than l0wt% and higher than l5wt%Ti. When Ti-content in Al is equal to or less than l0wt%, the MA powders transform directly to a global equilibrium state forming $DO_{22}- type\;Al_3$Ti above$400{\circ}C$. In the Al-Ti samples with equal to or higher than l5wt%Ti, transitional phases of cubic$Al_3Ti$and tetragonal $Al_{24}Ti_8$ are formed above$400{\circ}C$. They are stable only below$500{\circ}C$, and, $DO_{22}-type\;Al_3Ti$ becomes dominant aluminide at temperature higher than$ 600{\circ}C$.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.7
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• pp.47-59
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• 1993

The thermal stability of "stuffed" TiN/Ti barrier matals with different annealing history has been studied to improve the contact reliability of Al/Si contacts in 16M DRAM. The annealing conditions before the Al deposition such as film thickness, the annealing temperature and the annealing ambient have been varied. For TiN(900A)/Ti(300A) annealed at 450 in nitrogen ambient to form a "stuffed barrier" by inducing oxygen atoms into grain boundaries, there is no observation of Al penetrations into Si substrates after the post heat treatment of up to 700 even though there are massive amounts of Al found in TiN film after the post heat treatment of 600 indicating that TiN has a "sponge-like" function due to its ability to absorb several amounts of aluminum at elevated temperature. The TiN/Ti diffusion barrier annealed at 550 has, however, failed after the post heat treatment at 600. The thinner diffusion barriers with TiN(300A)/Ti(100A) failed after the post heat treatment at 600.he post heat treatment at 600.

• Journal of Powder Materials
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• v.12 no.4 s.51
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• pp.273-278
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• 2005

Nanostructured TiN/$TiB_2$/$TiSi_2$ and TiN/$TiB_2$/$Ti_5Si_2$ composite powders have been prepared by mechanochemical reaction from mixtures of Ti, BN, and $Si_3N_4$ powders. The raw materials have reacted to form a uniform mixture of TiN, $TiB_2$ and $TiSi_2$ or $Ti_5Si_3$ depending on the amount of $Si_3N_4$ used in the starting mixtures, and the reaction proceeded through so-called mechanically activated self-sustaining reaction (MSR). Fine TiN and $TiB_2$ crystallites less than a few tens of nanometer were homogeneously dispersed in the amorphous $TiSi_2$ or $Ti_5Si_3$ matrix after milling for 12 hours. These amorphous matrices became crystalline phases after annealing at high temperatures as expected, but the original microstructure did not change significantly.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.396-400
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• 2003

A new synthesis process for nano laminating Ti$_3$SiC$_2$ has been developed using TiCx (x=0.67) and Si powder as starting materials by a reaction hot pressing. Bulk Ti$_3$SiC$_2$ was fabricated using a green body consisting of TiCx and Si by a hot pressing under the pressures of 25 MPa at 1420-1550 $^{\circ}C$ for 90 min. The synthesized Ti$_3$SiC$_2$ was consisting of only TiCx and Ti$_3$SiC$_2$. The relative density of sintered bulk Ti$_3$SiC$_2$ was increased as the hot pressing temperature was increased, which was mainly due to the increase in TiCx contents in synthesized Ti$_3$SiC$_2$. The synthesized Ti$_3$SiC$_2$ bulk was consisted of nano sized lamella structure of 20-100 nm in thickness. It was found that TiCx particles in Ti$_3$SiC$_2$ would increase the 3-point bending strength of synthesized Ti$_3$SiC$_2$ bulk. The maximum 3-P. bending strength of synthesized Ti$_3$SiC$_2$ bulk was more than 800 MPa. The Vickers hardness of synthesized Ti$_3$SiC$_2$bulk was as low as 5 Gpa, which was decreased with the indentation load. The quasi-plastic deformation behaviors were observed around indentation mark on Ti$_3$SiC$_2$.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.106-115
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• 1995

To know the bonding phenomena of Ti/Cu brazed joint, a characteristic of microstructures in bonding interlayer of vacuum brazed pure Ti to Cu has been studied in the temperature range from 1088 to 1133K for various bonding times using Ag-28wt%Cu filler metal. Also intermediate phases formed in bonded interlayer and behavior of layer growth have been investigated. The obtained results in this study are as follows: 1) Liquid insert metal width at the each brazing temperature was proportional to the square root of brazing time, and it was considered that the liquid insert metal width was controlled by the diffusion rate process of primary .alpha.-Cu formed at the Ti side. 2) Intermediate phases formed near the Ti interface were .betha.-Ti and intermetallic compounds TiCu, Ti$_{2}$Cu, Ti$_{3}$Cu, and TiCu. 3) .betha.-Ti formed in Ti base metal durig brazing transformed to lamellar structure, .alpha.-Ti + Ti$_{2}$Cu. The structure came from the eutectoil decomposition reaction in cooling. And the width of .betha.-Ti layer was proportional to the square root of brazing time, and it was considered that the growth of .betha.-Ti layer was controlled by interdiffusion rate process in .betha.-Ti. 4) The layer growth of TiCu, Ti$_{3}$Cu$_{4}$ and TiCu, phases formed near the Ti interface was linerface was linearly proportional to the brazing time, and it was considered that the layer growth of these phases was controlled by the chemical reaction rate at the interface.

• Proceedings of the Korea Crystallographic Association Conference
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• 2003.05a
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• pp.25-25
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• 2003

BaTi₄O/sub 9/계 세라믹스에 저온 소결 조제로 첨가된 lithium-borosilicate계 유리 프리트의 첨가에 따른 상분해 현상을 XRD, TEM에 의하여 분석하였다. 유리 프리트의 첨가가 없는 BaTi₄O/sub 9/계 세라믹스는 첨가량과 열처리 온도에 관계없이 BaTi₄O/sub 9/상과 소량의 TiO₂상만이 관찰되었으나 저온 소결 조제로 사용된 유리 프리트의 첨가량이 증가할수록 BaTi₄O/sub 9/계 세라믹스는 BaTi₄O/sub 9/상 보다 Ti-rich상인 Ba₂Ti/sub 9/O/sub 20/상, BaTi/sub 5/O/sub 11/상, 또는 BaTi/sub 5/O/sub 11/상과 Ba₄Ti₃O/sub 30/상으로 공존하며 분해되는 것을 관찰하였다. 공존하며 분해되는 것을 관찰하였다. 유리 프리트가 10 wt% 첨가시 600℃ 까지는 BaTi₄O/sub 9/상과 TiO₂상으로 존재하였으나 700℃ 전후에서 BaTi/sub 5/O/sub 11/상과 Ba₄Ti/sub 13/O/sub 30/상으로 분해되기 시작하여 875℃에서는 BaTi₄O/sub 9/상이 완전히 분해되어 BaTi/sub 5/O/sub 11/상이 주상으로 Ba₄Ti/sub 13/O/sub 30/상은 이차상으로 존재하는 것을 확인하였다. 또한, 열처리 온도가 증가할수록 Ba₄Ti/sub 13/O/sub 30/상이 상대적으로 감소하고 있는 것도 관찰할 수 있었다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.05a
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• pp.5-5
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• 1999

A novel process is proposed to improve oxidation resistance of Ti-Al intermetallic compounds at elevated temperatures by both Cr addition and pre-sulfidation, where TiAl alloys withlor without Cr addition were sulfidized at 1173K for 86.4ks at a 1.3 Pa sulfur partial pressure in a $H_2-H_2S$ gas mixture. The pre-sulfidation treatment formed a thin Cr-Al alloy layer as well as 7~10 micrometer $TiAl_3$ and $TiAl_2$ layer, due to selective sulfidation of Ti. Oxidation resistance of the pre-sulfidation processed TiAl 4Cr alloy was examined under isothermal and heat cycle conditions between room temperature and 1173K in air. Changes in $TiAl_3$ into $TiAl_2$ and then TiAl phases as well as their effect on oxidation behavior were investigated and compared with the oxidation behavior of the TiAl-4Cr alloy as TiAl and pre-sulfidation processed TiAl aHoys. After oxidation for up to 2.7Ms a protective $Al_2O_3$ scale was formed, and the pre-formed $TiAl_3$ changed into $TiAl_2$ and the $Al_2Cr$ phase changed into a CrAlTi phase between the $Al_2O_3$ scale and $TiAl_2$ layer. The pre-sulfidation processed TiAl-4Cr alloy had very good oxidation resistance for longer times, up to 2.7 Ms, in contrast to those observed for the pre-sulfidation processed TiAl alloy where localized oxidation occurred after 81 Oks and both the TiAl and TiAl-4Cr alloys themselves corroded rapidly from the initial stage of oxidation

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.143-143
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• 1999

Co/Ti 다층 박막을 제조하기 위해 직류원 마그네트론 스퍼터링 시스템을 이용하여 (100)실리콘 단결정 기판위에 Co와 Ti층을 각각 2/2, 5/5, 10/10 nm 정도의 두께로 조절하여 세가지 조성의 Co/Ti 다층 박막을 제조하였다. 이러한 Co/Ti 다층 박막의 후속 열처리는 Ar 가스분위기 하에서 Tube furnace를 이용하여 20$0^{\circ}C$와 30$0^{\circ}C$, 40$0^{\circ}C$의 온도에서 진행하였다. 증착초기에서부터 후속 열처리 공정을 진행하는 동안, Co/Ti 다층 박막에서의 계면반응을 미세 구조 변화 및 전기, 자기적 특성변화와 연관지어 관찰하였다. Co/Ti 다층 박막의 결정 구조와 미세 구조 변화를 관찰하기 위해 각각 X-선 회절기와 투과 전자 현미경을 사용하였고, 다층 박막의 전기적, 자기적 특성 변화를 관찰하기 위해 각각 4점 탐침기, 진동 시료형 자속계를 이용하였다. Co/Ti 다층 박막을 20$0^{\circ}C$의 저온에서 열처리를 한 경우에는 증착 초기의 계면반응에 의해 형성된 비정질 층이 성장하였고, 30$0^{\circ}C$와 40$0^{\circ}C$의 고온에서 열처리를 하는 경우에는 비정질 측의 성장보다는 새로운 화합물 CoTi 결정상이 형성되면서 비정질상은 오히려 감소하였다. 즉, Co/Ti 다층 박막의 계면 반응은 결정질 Co와 Ti을 계면 반응물로 소모시키면서 비정질 층을 성장시키는 비정질화 반응이 활발히 일어났다. 특히, 소모된 계면 반응물로 소모시키면서 비정질 층을 성장시키는 비정질화 반응일 활발히 일어났다. 특히, 계면 반응물로 소모시키면서 비정질 층을 성장시키는 비정질화 반응일 활발히 일어났다. 특히, 소모된 계면 반응물 Co와 Ti 중에서 Ti의 소모속도가 더 빠르게 관찰되었다. 이로부터 Ti 이 증착초기에서 저온 열처리 과정동안 Co/Ti 다층 박막의 계면에서 일어나는 비정질화 반응의 주 확산자로 작용했다는 것을 알 수 있다. 한편, 30$0^{\circ}C$와 40$0^{\circ}C$의 고온에서 열처리한 Co/Ti 다층 박막의 계면 반응은, 비정질 반응에 의한 비정질층의 형성보다는 새로운 화합물 결정질 CoTi상을 형성시키는 결정화 반응이 우세했다. Co/Ti 다층 박막의 전기적 저항은, 열처리에 의한 비정질 층의 생성 및 성장으로 인해 증가하였고 새로운 저저항 CoTi 결정상의 형성으로 인해 감소하는 것을 알 수 있었다. 또한 Co/Ti 다층 박막의 포화 자화값은, 열처리에 의한 계면에서의 비정질화 반응과 CoTi 결정화 반응으로 인해 강자성체인 Co 결정상이 감소됨에 따라 감소하는 경향을 나타냈다.

• Applied Chemistry for Engineering
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• v.26 no.2
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• pp.193-198
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• 2015

Ceria supported on various commercial $TiO_2$ catalysts were prepared by wet-impregnation method. We confirmed that the correlation between physicochemical properties of $TiO_2$ supports and SCR activities. Physicochemical properties of the various $TiO_2$ were evaluated using X-ray diffraction (XRD), Brunauer-Emmett-Teller (BET) surface area, X-ray photoelectron spectroscopy (XPS), and pH analysis. Ce/Ti catalyst exhibited different SCR activities with respect to physicochemical properties of $TiO_2$. An excellent activity was obtained as the surface area of $TiO_2$ increased. In the case of CeOx surface density, the excellent activity in a range of $2.5{\sim}14.5CeOx/nm^2$ was achieved and the activity tended to decrease above $14.5CeOx/nm^2$. The O/Ti mole ratio of $TiO_2$ in the range of 1.32 to 1.79 showed an excellent SCR activity. It was also confirmed that the pH of the $TiO_2$ has no effects on the SCR activity. In order to achieve excellent SCR activities, ceria oxide should be supported on $TiO_2$ possessing a high specific surface area and certain O/Ti mole ratio. In addition, the catalyst with the low CeOx surface density resulted from the high dispersed ceria oxide should be prepared.

• Applied Chemistry for Engineering
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• v.23 no.3
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• pp.293-296
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• 2012

Nanocomposites were fabricated as titanium dioxide ($TiO_2$) doped with nanometals (Au, Ag) by sonochemical reduction method and sol-gel method in order to investigate their antimicrobial activities. Then, the antimicrobial activity of the resulting samples was compared by the measurement of colony numbers survived on the agar plate incubated for 24 h after the loading E. coli on the solid-state media with the nanocomposites. The initial antimicrobial activity of the metal (Au, Ag)-doped $TiO_2$ was higher than that of the pristine $TiO_2$. Afterwards the nanocomposite samples were kept at $4^{\circ}C$ for a long time and the aged samples exhibited the different antimicrobial activity. With the elapse of aging times, Ag-doped $TiO_2$ with $TiO_2$ coating ($Ag-TiO_2$@$TiO_x$) exhibited the higher antimicrobial activity than those of $Ag-TiO_2$and $Au-TiO_2$. The $TiO_2$ coating on the $Ag-TiO_2$ may prevent the oxidation of Ag nanometals and stabilize colloidal nanocomposites.