• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.52 no.10
• /
• pp.464-468
• /
• 2003

The double layers of $SiO_2$/$Si_3$$N_4$ have superior charge storage stability than a single layer of $SiO_2$. Many researchers are very interested in the charge storage mechanism of $SiO_2$/$Si_3$$N_4$ [1,2]. In this paper, the electrical characteristics of thermal oxide and atmospheric pressure chemical vapor deposition (APCVD) of $Si_4$$N_4$ have been investigated and explained using high frequency capacitance-voltage measurements. Additionally, this paper will describe capacitance-voltage characteristics for double layers of $SiO_2$/$Si_4$$N_4$ by "Athena", a semiconductor device simulation tool created by Silvaco, Inc.vaco, Inc.

• Journal of the Korean institute of surface engineering
• /
• v.40 no.6
• /
• pp.279-282
• /
• 2007

Cr-Mo-Si-C-N coatings were deposited on steel and Si wafer by a hybrid system of AIP and sputtering techniques using Cr, Mo and Si target in $Ar/N_2/CH_4$ gaseous mixture. Instrumental analyses of XRD and XPS revealed that the Cr-Mo-Si-C-N coatings must be a composite consisting of fine(Cr, Mo and Si)(C and N) crystallites and amorphous $Si_3N_4$ and SiC. The hardness value of Cr-Mo-Si-C-N coatings significantly increased from 41 GPa of Cr-Mo-C-N coatings to about 53 GPa with Si content of 9.3 at.% due to the refinement of (Cr, Mo and Si)(C and N) crystallites and the composite microstructure characteristics. A systematic investigation of the microstructures and mechanical properties of Cr-Mo-Si-C-N coatings prepared with various Si contents is reported in this paper.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.53 no.10
• /
• pp.495-499
• /
• 2004

Characteristics of ohmic Ni/Si/Ni contacts to n-type 4H-SiC are investigated systematically. The ohmic contacts were formed by annealing Ni/Si/Ni sputtered sequentially The annealings were performed at 950℃ using RTP in vacuum ambient and N₂ ambient, respectively. The specific contact resistivity(p/sub c/), sheet resistance(R/sub s/), contact resistance (R/sub c/) transfer length(L/sub T/) were calculated from resistance(R/sub T/) versus contact spacing(d) measurements obtained from TLM(transmission line method) structure. While the resulting measurement values of sample annealed at vacuum ambient were p/sub c/ = 3.8×10/sup -5/Ω㎠, R/sub c/ = 4.9 Ω and R/sub T/ = 9.8 Ω, those of sample annealed at N₂ ambient were p/sub c/ = 2.29×10/sup -4/Ω㎠, R/sub c/ = 12.9 Ω and R/sub T/ = 25.8 Ω. The physical properties of contacts were examined using XRD 3nd AES. The results showed that nickel silicide was formed on SiC and Ni was migrated into SiC. This result indicates that Ni/Si/Ni ohmic contact would be useful in high performance electronic devices.

• Tribology and Lubricants
• /
• v.4 no.2
• /
• pp.44-51
• /
• 1988

Titanium carbide(TiC), Titanium nitride(TiN), and Titanium carbonnitride(Ti(C,N)) films were deposited on $Si_3N_4$-TiC composite cutting tools by chemical vapor deposition(CVD) using $TiCl_4-CH_4-H_2$, $TiCl_4-N_2-H_2$, and $TiCl_4-CH_4-N_2-H_2$ gas mixtures, respectively. The experimental results indicate that TiC coatings compared with TiN coatings on $Si_3N_4$ -TiC ceramic have an improved microstructural property, good thermal shock resistance, and good interfacial bonding. However TiN coatings compared with TiC coatings have a low friction coefficient with steel and good chemical stability. It is found by cutting test that coated insert compared with $Si_3N_4$-TiC ceramic have a superior flank and crater wear resistance. And multilayer coating compared with monolayer coating shows a improved wear resistance.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.9 no.2
• /
• pp.260-265
• /
• 1999

$SiC/Si_3N_4$ composites were prepared by mixing ${\alpha}-Si_3N_4$ powder to $\alpha$-SiC powder in the range of 10 to 30 vol% with 10 vol% interval. 6 wt% of $Al_2O_3$ and $Y_2O_3$ were also added respectively as sintering aids. Then, pressureless sintering was performed at 1,78$0^{\circ}C$ for 2 hours in $N_2$ gas. In the case of adding 20 vol% of ${\alpha}-Si_3N_4$ powder, the relative desity to theoretical value and the flexutal strength were 92 % and 3,560 MPa, respectively. The smallest relative worn amount thereof was $2.68{\times}10^{-3}\;mm^2$ for 20 vol% ${\alpha}-Si_3N_4$. The composite containing 30 vol % of ${\alpha}-Si_3N_4$ powder showed the highest fracture toughness $(K_{1c})$ of $4.9\;MN/m^{3/2}$, although the reduction of the wear resistance due to the effect of the pores was observed.

• Journal of the Korean Ceramic Society
• /
• v.36 no.10
• /
• pp.1102-1107
• /
• 1999

SiC-Si3N4 composites were prepared by mixing $\alpha$-Si3N4 powder to $\alpha$-SiC powder in the range of 10 to 30 vol% with 10vol% interval. 6wg% Al2O3 and 6wt% Y2O3 were respectively added as sintering aids. Hot pressing was performed at 1,80$0^{\circ}C$ for 1 hour with 25 MPa pressure. In the case of adding 20vol% of $\alpha$-Si3N4 powder the relative density to theoretical value and the flexural strength were 99.1% and 34,420 MPa respectively and the worn amount was 2.09$\times$10-3 mm2 which were the highest values in the all range of he composition. Although the composite containig 10 vol% of $\alpha$-Si3N4 powder showed the highest fracture toughness(KIC) of 4.65MN/m3/2 the reduction of the wear resistance in this composite is likely to be affected by the homogeneity and the uniformity of the grain coalescence and growth during the sintering process.

• Corrosion Science and Technology
• /
• v.6 no.1
• /
• pp.24-28
• /
• 2007

Alumina coated SiC whiskers were prepared by homogeneous precipitation of aluminum sulfate. The Si3N4 composites reinforced with coated SiC whiskers were fabricated by hot-pressing at $1800^{\circ}C$ for 2 h under an $N_{2}$ atmosphere of 0.1 MPa to examine the effects of coated whiskers on the mechanical properties of SiC whisker reinforced $Si_{3}N_{4}$ composite. By the addition of alumina coated SiC whiskers instead of as received ones, the fracture toughness of composite was about 6.7 $MPam^{1/2}$ which was slightly lower than as received SiC whisker reinforced composite. This result seems to be caused by the fact that the crack deflection and whisker pull-out were decreased. Thus, alumina coated SiC whiskers were considered to form relatively strong interface bond with $Si_{3}N_{4}$ matrix.

• Korean Journal of Materials Research
• /
• v.9 no.6
• /
• pp.577-582
• /
• 1999

In order to make the electroconductive $Si_3N_4$-TiN composities, the Si-Ti(N) compacts were nitrided at $1450^{\circ}C$ for 20hours, and then they were post-sintered by a gas-pressure-sintering technique at 1TEX>$1950^{\circ}C$ for 3.5 hours. As starting powders, commercial si powder of about $10\mu\textrm{m}$, two types of Ti powders of 100 and 325 mesh, and fine-sized TiN of $2.5\mu\textrm{m}$ powders were used. In the $Si_3N_4$-TiN sintered bodies used Ti powders, the relative density and fracture strength and electrical conductivity are low due to the existence of large amounts of coarse pores. However, in the $Si_3N_4$-TiN composite used TiN powder, the fracture toughness, fracture strength and electrical resistivity were $5.0MPa{\cdot}m^{1/2}$, 624MPa and $1400{\omega}cm$, respectively. The dispersion of TiN particles in the composite inhibited the growth of $Si_3N_4$ in the shape of rod and made strong strain field contrasts at the $Si_3N_4$-TiNinterfaces. It was recognized that microstructural control is required to improve the electrical conductivity and mechanical properties of $Si_3N_4$-TiN composites by dispersing TiN particles homogeneously.

• Korean Journal of Materials Research
• /
• v.5 no.7
• /
• pp.835-841
• /
• 1995

The deposition properties of Si$_3$N$_4$ deposited by low pressure chemical vapor deposition were studied to evaluate Si$_3$N$_4$as part of multi-layer coatings for anti-oxidation and anti-wear coating of graphite in the propellant-burning environment. Si$_3$N$_4$was deposited on the pack-SiC coated graphite and the tendencies of deposition rate and surface morphology changes with temperatures and reaction gas ratios were investigated. In low deposition temperatures the deposition rate increased tilth increasing temperature but in high temperatures the deposition rate decreased with increasing temperature. The grain size of Si$_3$N$_4$decreased with increasing temperature. In condition that the range of reaction gas ratios is 20$\leq$NH$_3$/SiH$_4$$\leq$40, the deposition rate and surface morphology did not change. The Si$_3$N$_4$deposited at 800~130$0^{\circ}C$ was amorphous, and by post-annealing at 130$0^{\circ}C$ in a $N_2$ambient, the Si$_3$N$_4$crystalized.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1997.05a
• /
• pp.72-72
• /
• 1997