• 자원리싸이클링
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• 제12권2호
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• pp.54-61
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• 2003

In this paper a system of plasma ignition(SPI) which is applied for the ignition and stabilization of coal-dust fuel burning for decreasing fuel black oil consumption is described. The advantages of SPI are demonstrated, and the positive results of SPI which is operated at the thermal-clamping boilers installed in production and heating plants are described. The similar system was tested in demonstration and industrial installations to confirm the results. The improvement of economical, operating and ecological performances of the boiler are shown.

• 한국연소학회:학술대회논문집
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• 한국연소학회 2014년도 제49회 KOSCO SYMPOSIUM 초록집
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• pp.195-198
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• 2014

$Fuel/N_2$ and fuel/air mixtures were treated with non-thermal DBD plasma and the changes in characteristics of laminar diffusion flame have been observed. Flame of $Fuel/N_2$ mixture generated more soot under plasma condition while less amount of soot was formed from fuel/air mixture flame. Luminescence spectrum and gas chromatography results confirmed that plasma energy converts a fraction of fuel molecules into radicals, which then form $C_2$, $C_3$, $C_4$ and higher hydrocarbon under no oxygen condition or turn into CO, $CO_2$ and $H_2O$ when oxygen is present.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.326-329
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• 2002

In this paper, we investigated a feasibility of cerium oxide(CeO$_2$) films as a buffer layer of MFIS(metal ferroelectric insulator semiconductor) type capacitor. CeO$_2$ layer were Prepared by two step process of a low temperature film growth and subsequent RTA (rapid thermal annealing) treatment. By app1ying an ultra thin Ce metal seed layer and N$_2$ Plasma treatment, dielectric and interface properties were improved. It means that unwanted SiO$_2$ layer generation was successfully suppressed at the interface between He buffer layer and Si substrate. The lowest lattice mismatch of CeO$_2$ film was as low as 1.76% and average surface roughness was less than 0.7 m. The Al/CeO$_2$/Si structure shows breakdown electric field of 1.2 MV/cm, dielectric constant of more than 15.1 and interface state densities as low as 1.84${\times}$10$\^$11/ cm$\^$-1/eV$\^$-1/. After N$_2$ plasma treatment, the leakage current was reduced with about 2-order.

• 전자공학회논문지D
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• 제35D권12호
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• pp.68-74
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• 1998

본 논문에서는 electron cyclotron resonance (ECR) N₂O-플라즈마 산화막을 게이트 산화막으로 사용한 다결정 실리콘 박막 트랜지스터 (TFT)의 성능과 단채널 특성에 대하여 연구하였다. ECR NE₂O-플라즈마 게이트 산화막을 사용한 소자는 열산화막을 이용한 경우에 비해 우수한 성능과 억제된 단채널 효과를 나타낸다. 얇은 ECR N2O-플라즈마 산화막을 사용하여 n채널 TFT의 경우 3 ㎛, p채널 TFT의 경우 1㎛ 게이트 길이까지 문턱 전압 감소가 없는 소자를 얻었다. 이러한 특성 향상은 부드러운 계면, passivation 효과, 그리고 계면과 박막 내부에 존재하는 강한 Si ≡ N 결합 등에 기인한다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.215-219
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• 2004

This paper is investigated about the effect of carrier gas and humidity for generating hydrogen gas. In the experimental result of generating hydrogen gas by non-thermal plasma reactor, the rate of generating hydrogen gas is different with what kind of carrier gas is. We used two types of carrier gas, such as $N_2$ and He. $N_2$ as carrier gas is more efficient to generate hydrogen gas than He because $N_2$ is reacted with $O_2$, which is made from water dissociation. In comparison with no humidity and humidity 45[%], the generation of hydrogen gas is decreased with increasing the humidity. That is the result that the energy for water dissociation is reduced on water surface because a part of plasma energy is absorbed at the small particle produced from humidifier.

• 치위생과학회지
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• 제14권1호
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• pp.1-6
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• 2014

본 연구는 저온 상압 플라즈마 장치를 이용하여 구강점막질환을 일으키는 C. albicans 균을 효과적으로 사멸하기 위해 시행하였다. 조직에 적합하게 처리될 수 있도록 저온 상압 플라즈마 장치를 고안하고, 먼저 agar plate에 C. albicans 균을 처리하여 플라즈마를 조사한 결과 agar plate표면에 C. albicans 균을 처리 후 저온 상압 플라즈마 장치를 적용한 결과 60초 처리시 1.2 cm, 180초 처리시 1.4 cm, 300초 처리시 1.7 cm의 박테리아 생장 억제 구간이 나타나는 것을 확인하였다. 또한, 조직에서의 구강병원균 사멸 효과를 확인하기 위해 HRM-2 마우스 조직에 C. albicans 균을 처리하여 저온 상압 플라즈마를 조사 시 마우스 조직 표면에 C. albicans 균을 오염시켜 저온 상압 플라즈마 처리 후 CFU 방법으로 측정한 결과 300초간 1회 처리시 2 log CFU/ml, 300초간 2회 처리시 3 log CFU/ml, 300초간 3 회 처리시 6 log CFU/ml의 균 수 감소 효과가 나타나는 것을 확인하였다(p<0.05). 따라서, 저온의 저온 상압 플라즈마 장치는 효과적으로 구강 병원균을 사멸시킬 수 있으며, 구강점막질환 치료 장비로서 사용될 수 있을 것으로 생각된다.

• Composites Research
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• 제36권2호
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• pp.101-107
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• 2023

본 연구에서는 질화알루미늄을 강화재로 갖는 알루미늄기지 복합재료를 질소 분위기에서의 아크용해 공정을 통해 제조하였다. 알루미늄과 질소 원자의 화학반응을 1분간 유지시켰을 때, 중간층과 라멜라층으로 구분되는 질화알루미늄 강화상이 자발적으로 알루미늄 용탕 내부에 형성되어 기지 전반에 분포되었다. 복합재료는 약 10 vol.%의 AlN을 가지며, 이 강화재는 계면에서 낮은 열저항과 강한 결합을 보였다. 제조된 복합재료는 열전도도가 높고 열팽창계수는 낮은 열적 특성 조합을 보였다. 또한, 본 연구의 복합재료는 이종원소인 실리콘을 기지에 첨가함으로써 열팽창계수를 추가적으로 감소시키는 것이 가능했다. 이는 아크 용해법으로 제조된 알루미늄기지 복합재료가 낮은 열팽창계수를 요구하는 방열소재로 적용될 수 있는 가능성을 시사한다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.912-916
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• 2002

In this paper, the $CF_4$ decomposition rate and by-product were investigated for a simulated two plasma reactors which are metal particle reactor and spiral wire reactor as function of mixed gases. The $CF_4$ decomposition rate by plasma reactor with metal particle electrode had a gain of 20~25[%] over that by plasma reactor with spiral wire electrode. The $CF_4$ decomposition efficiency increases with increasing applied voltage up to the critical voltage for spark formation. The $CF_4$ decomposition efficiency of metal particle reactor was about 80[%] at AC 24[kV]. The $CF_4$ decomposition rate used $Ar-N_2$ as base gas was the highest among three base gases of $N_2$, $Ar-N_2$, air. The by-products of the $N_2$, $Ar-N_2$ base as were similar, but in case of air base they were different.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2002년도 추계학술대회 발표 논문집
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• pp.14-19
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• 2002

In this study, as Cu diffusion barrier, tantalum nitrides were successfully deposited on Si(100) substrate and SiO2 by plasma assisted atomic layer deposition(PAALD) and thermal ALD, using pentakis (ethylmethlyamino) tantalum (PEMAT) and $NH_3$ as precursors. The TaN films were deposited on $250^{\circ}$C by both method. The growth rates of TaN films were $0.8{\AA}$/cycle for PAALD and $0.75{\AA}$/cycle for thermal ALD. TaN films by PAALD showed good surface morphology and excellent step coverage for the trench with an aspect ratio of h/w - $1.8 : 0.12 \mu\textrm{m}$ but TaN films by thermal ALD showed bad step coverage for the same trench. The density for PAALD TaN was $11g/\textrm{cm}^3$ and one for thermal ALD TaN was $8.3g/\textrm{cm}^3$. TaN films had 3 atomic % carbon impurity and 4 atomic % oxygen impurity for PAALD and 12 atomic % carbon impurity and 9 atomic % oxygen impurity for thermal ALD. The barrier failure for Cu(200nm)/TaN(l0nm)/$SiO_2(85nm)$/Si structure was shown at temperature above $700^{\circ}$C by XRD, Cu etch pit analysis.

• Applied Science and Convergence Technology
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• 제26권4호
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• pp.62-65
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• 2017

Passivation of surface defects by the formation of chemically inert structure at the surface of $TiO_2$ nanocrystals can be potentially useful in enhancing their photocatalytic activity. In this regard, we have studied the surface chemical states of $TiO_2$ surfaces prepared by a treatment in the afterglow of $N_2$ microwave plasma using X-ray photoemission spectroscopy (XPS). We find that nitrogen is incorporated into the surface after the treatment up to a few atomic percent. Interestingly, the surface oxynitride layer is found to be chemically stable when it's in contact with water at room temperature (RT). The surface nitrogen species were also found to be thermally stable upon annealing up to $150^{\circ}C$ in the atmospheric pressure. Thus, we conclude that the treatment of oxide materials such as $TiO_2$ in the afterglow of $N_2$ plasma can be effective way to passivate the surface with nitrogen species.