• 한국결정성장학회지
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• 제14권6호
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• pp.244-252
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• 2004

$CuISe_2$ 단결정 박막은 수평 전기로에서 합성한 $CuInSe_2$ 다결정을 증발원으로하여, hot wall epitaxy(HWE) 방법으로 증발원과 기판(반절연성-GaAs(100))의 온도를 각각 $620^{\circ}C$, $410^{\circ}C$로 고정하여 단결정 박막을 성장하였다. 이때 단결정 박막의 결정성은 광발광 스펙트럼과 이중결정 선 요동곡선(DCRC) 으로 부터 구하였다. Hall 효과는 van der Pauw 방법에 의해 측정되었으며, 293K에서 운반자 농도와 이동도는 각각 $9.62\times10^{16}/\textrm{cm}^3$, 296 $\textrm{cm}^2$/Vㆍs 였다. $CuAlSe_2$/Si(Semi-Insulated) GaAs(100) 단결정 박막의 광흡수와 광전류 spectra를 293k에서 10K까지 측정하였다. 광흡수 스펙트럼으로부터 band gap $E_g$(T)는 Varshni 공식에 따라 계산한 결과 1.1851 eV-($8.99\times10^{-4} eV/K)T^2$/(T+153k)였다. 광전류 스펙트럼으로 부터 Hamilton matrix(Hopfield quasicubic mode)법으로 계산한 결과 crystal field splitting Δcr값이 0.0087eV이며 spin-orbit Δso값은 0.2329 eV임을 확인하였다. 10K일 때 광전류 봉우리들은 n = 1일때 $A_1-, B_1$-와 $C_1$-exciton봉우리임을 알았다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.226-229
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• 2000

We fabricated thin film superconducting fault current limiters based on YBa$_2$Cu$_3$O$_{7}$ thin films and investigated the distribution of quench progress in the limiters. The limiters were tested with simulated fault currents. Quench progress depended significantly on the position in the limiter with respect to electrodes as well as the fault current magnitude. The heat transfer from limiter meander lines to electrodes explains these results.s.

• 한국재료학회지
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• 제34권3호
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• pp.163-169
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• 2024

As the limitations of Moore's Law become evident, there has been growing interest in advanced packaging technologies. Among various 3D packaging techniques, Cu-SiO₂ hybrid bonding has gained attention in heterogeneous devices. However, certain issues, such as its high-temperature processing conditions and copper oxidation, can affect electrical properties and mechanical reliability. Therefore, we studied depositing only a heterometal on top of the Cu in Cu-SiO₂ composite substrates to prevent copper surface oxidation and to lower bonding process temperature. The heterometal needs to be deposited as an ultra-thin layer of less than 10 nm, for copper diffusion. We established the process conditions for depositing a Co film using a Co(EtCp)₂ precursor and utilizing plasma-enhanced atomic layer deposition (PEALD), which allows for precise atomic level thickness control. In addition, we attempted to use a growth inhibitor by growing a self-assembled monolayer (SAM) material, octadecyltrichlorosilane (ODTS), on a SiO₂ substrate to selectively suppress the growth of Co film. We compared the growth behavior of the Co film under various PEALD process conditions and examined their selectivity based on the ODTS growth time.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2014년도 추계학술대회 논문집
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• pp.250-251
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• 2014

This study introduces a simple deposition of $Cu_2O$ thin films with surface morphologies composed of columns, submicron-rods and submicron-branches on glass substrate from metallic Cu targets by tailoring the $Ar/O_2$ ratios during the sputtering. The obtained samples were used to fabricate gas sensor. The $H_2S$ sensing properties of the sensors at working temperatures from $100^{\circ}C$ to $300^{\circ}C$ were studied, in which $Cu_2O$ submicron-branches performed the best sensing property comparing with the rest morphologies. A transformation of $Cu_2O$ to $Cu_2S$ and CuS was consider as a main factor to the sensing mechanism of the sensors.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.188-188
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Meta Oxide Semiconductor) based electronic devices, the electronic devices, become much faster and smaller size that are promising property of semiconductor market. However, very narrow interconnect line width has some disadvantages. Deposition of conformal and thin barrier is not easy. And metallization process needs deposition of diffusion barrier and glue layer for EP/ELP deposition. Thus, there is not enough space for copper filling process. In order to get over these negative effects, simple process of copper metallization is important. In this study, Cu-V alloy layer was deposited using of DC/RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane SiO2/Si bi-layer substrate with smooth surface. Cu-V film's thickness was about 50 nm. Cu-V alloy film deposited at $150^{\circ}C$. XRD, AFM, Hall measurement system, and AES were used to analyze this work. For the barrier formation, annealing temperature was 300, 400, $500^{\circ}C$ (1 hour). Barrier thermal stability was tested by I-V(leakage current) and XRD analysis after 300, 500, $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However vanadium-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Therefore thermal stability of vanadium-based diffusion barrier is desirable for copper interconnection.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1991년도 추계학술대회 논문집
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• pp.56-59
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• 1991

The polyervstalline $Cu_{0.28}Ag_{0.72}InSe_{4.4}S_{0.6}$ thin films are prepared by vacuum heat treatment of laver, which is deposited by direct resisting vacuum evaporation. From optical absorption spetra, the optical hand gap energy is determined to be 1.5[eV] at room temerature. From electrical method. hole concentration, resistivity and mobility are 9.3*$10^{18}$[$cm^{-3}$], 6*$10^{-2}$[$\Omega$$.$cm], 11.2[$\textrm{cm}^2$/V$.$sec] respectively at room temperature.

• 전기화학회지
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• 제13권2호
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• pp.89-95
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• 2010

Cu(In, Ga)$Se_2$ (CIGS) 박막은 다원화합물이기 때문에 제조공정이 매우 까다롭다. 진공장치를 사용하는 제조 방법으로 동시증착법, 스퍼터링법 +셀렌화가 있고, 비진공 제조 방법으로 전기화학적인 전착법이 있다. 각 방법에 있어서도 출발 물질의 종류에 따라 다양한 제조 방법이 동원 될 수 있다. 진공증착에 의한 방법은 고품질의 박막을 얻는데 사용 되고 있으나 고가의 진공장비가 사용되므로 대면적화에 따른 제조비용 측면에서 문제가 있다. 이에 비하여, 전착법은 간단하면서도 저가로 대면적화를 이룰 수 있다는 장점 때문에, 많은 관심이 기울여지고 있다. 본 연구에서는 Mo/Glass전극위에 Ga/(In + Ga) = 0.3의 성분비를 만족시키는 CIGS 박막을 전기화학적으로 제조하기 위하여, $Cu^{2+}$, $In^{3+}$, $Ga^{3+}$, $Se^{4+}$ 4성분을 모두 포함하는 전해질 수용액 내에서, 4성분의 이온들이 동시에 환원되는 전위를 조절하여 CIGS 박막을 전착 하였다. SEM을 이용하여 얻어진 CIGS 박막의 전착된 시료의 표면을 관찰하였고, EDS로 그 조성을 분석하였다. 또한, XRD를 이용하여 전착시료의 열처리 전후의 결정성변화를 조사하였다.

• Current Photovoltaic Research
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• 제1권1호
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• pp.38-43
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• 2013

$Cu(In,Ga)_3Se_5$ is a candidate material for the top cell of $Cu(In,Ga)Se_2$ tandem cells. This phase is often found at the surface of the $Cu(In,Ga)Se_2$ film during $Cu(In,Ga)Se_2$ cell fabrication, and plays a positive role in $Cu(In,Ga)Se_2$ cell performance. However, the exact properties of the $Cu(In,Ga)_3Se_5$ film have not been extensively studied yet. In this work, $Cu(In,Ga)_3Se_5$ films were fabricated on Mo-coated soda-lime glass substrates by a three-stage co-evaporation process. The Cu content in the film was controlled by varying the deposition time of each stage. X-ray diffraction and Raman spectroscopy analyses showed that, even though the stoichiometric Cu/(In+Ga) ratio is 0.25, $Cu(In,Ga)_3Se_5$ is easily formed in a wide range of Cu content as long as the Cu/(In+Ga) ratio is held below 0.5. The optical band gap of $Cu_{0.3}(In_{0.65}Ga_{0.35})_3Se_5$ composition was found to be 1.35eV. As the Cu/(In+Ga) ratio was decreased further below 0.5, the grain size became smaller and the band gap increased. Unlike the $Cu(In,Ga)Se_2$ solar cell, an external supply of Na with $Na_2S$ deposition further increased the cell efficiency of the $Cu(In,Ga)_3Se_5$ solar cell, indicating that more Na is necessary, in addition to the Na supply from the soda lime glass, to suppress deep level defects in the $Cu(In,Ga)_3Se_5$ film. The cell efficiency of $CdS/Cu(In,Ga)_3Se_5$ was improved from 8.8 to 11.2% by incorporating Na with $Na_2S$ deposition on the CIGS film. The fill factor was significantly improved by the Na incorporation, due to a decrease of deep-level defects.

• Progress in Superconductivity
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• 제9권2호
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• pp.188-192
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• 2008

We investigated the size effect on quench development in $Au/YBa_2Cu_3O_7$ (YBCO) thin film meander lines on sapphire substrates. The meander lines were fabricated by patterning YBCO films coated with gold layers. The lines were subjected to simulated AC fault current, and immersed in liquid nitrogen during the experiment. After the initial rapid rise, the resistance increased moderately and then slowly. In 4 inch-diameter meander lines, the period during which the resistance increased moderately was considerably longer than in 2 inch-diameter line. Moderate increase of resistance was originated from quench propagation. The film temperature was about 180 K at the point when the propagation was completed. The rate of resistance increase after the quench completion was not affected by the film size.

• 한국자기학회지
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• 제10권5호
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• pp.203-209
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• 2000

Synthetic antiferromagnet CoFe/Ru/CoFe/FeMn을 사용하고 자유층으로 NiFe/CoFe 이중 층을 사용한 top스핀밸브 구조를 dc magnetron 방식으로 제조하여, 자유층과 구속층의 두께변화에 따른 자기적 특성과 interlayer coupling field티 변화를 조사하였다 Si/Ta(50 $\AA$)/NiFe(x $\AA$)/CoFe(y $\AA$)/Cu(26 $\AA$)/CoFe(30 $\AA$)/Ri(7 $\AA$)/CoFe(15 $\AA$)/FeMn(100 $\AA$)/Ta(50 $\AA$) top synthetic 스핀밸브 시료에서 자유층의 두께 감소에 따른 interlayer coupling field를 조사한 결과 interlayer coupling field가 증가하였으며, 이것은 Neel 모델에 의한 정자기 교환결합에 기인하는 것으로 설명하였다. Top synthetic 스핀 밸브에서 Cu에 인접한 자성층(Pl)과 FeMn에 인접한 자성층(P2) 두께 차이에 따른 interlayer coupling field 의 의존성을 조사한 결과 $t_{P1}$> $t^{P2}$ 일 경우 interlayer coupling field(층간 교환 결합력 세기)는 기존 스핀 밸브에서 적용한 Kools이 제시한 modified Nel 모델에 잘 부합되나, $t_{P1}$ $\leq$ $t_{P2}$ 인 경우 모델과 부합되지 않음으로 새로운 모델이 필요함을 확인하였다 Cu 두께에 변화에 따른 층간 교환 결합력 세기 의존성을 조사한 결과 Cu 두께를 32 $\AA$으로 증가시 층간 교환결합력 세기는 10 Oe 이하로 감소하였다.감소하였다.다.