• 제목/요약/키워드: $Ar^+$ laser

검색결과 328건 처리시간 0.029초

펄스 레이저 증착법으로 제작한 ZnO 박막의 발광 특성 (Light emission properties of ZnO thin films grown by pulsed laser deposition)

  • 배상혁;이상렬
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 추계학술대회 논문집
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    • pp.539-542
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    • 2000
  • ZnO thin films for light emission device have been deposited on sapphire and silicon substrates by pulsed laser deposition technique(PLD). A Nd:YAG laser was used with the wavelength of 355 nm. In order to investigate the emission properties of ZnO thin films, PL measurements with an Ar ion laser as a light source using an excitation wavelength of 351 nm and a power of 100 mW are used. All spectra were taken at room temperature by using a grating spectrometer and a photomultiplier detector. ZnO exhibited PL bands centered around 390, 510 and 640 nm, labeled near ultra-violet (UV), green and orange bands. Structural properties of ZnO thin films are analized with X-ray diffraction (XRD).

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Mn-Zn 페라이트의 레이저 유도 열화학 습식식각 (Laser-Induced Thermochemical Wet Etching of Mn-Zn Ferrite)

  • 이경철;이천
    • E2M - 전기 전자와 첨단 소재
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    • 제10권7호
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    • pp.668-673
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    • 1997
  • A Single-crystalline Mn-Zn Ferrite (110 orientation) was masklessly etched by focused Ar laser irradiation in an H$_3$PO$_4$ solution. The depth of the etched grooves increases with increasing a laser power, decreasing a scan speed, and increasing the H$_3$PO$_4$concentration. The width of the etched grooves increases with a increasing laser power, but was relatively insensitive to the scan speed and H$_3$PO$_4$concentration. High etching rate of up to 714 ${\mu}{\textrm}{m}$/s and an aspect ratio of 6 for vertical slab structure have been obtained by the light-guiding effect of the laser bean in the H$_3$PO$_4$ solution.

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LIF를 이용한 Hg-Ar(1Torr)의 플라즈마 밀도 측정 (Plasma Density Measurement of the Hg-Ar(1Torr) by LIF Method)

  • 이종찬;박대희;양종경
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제54권5호
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    • pp.213-217
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    • 2005
  • In this paper, we introduced a LIF measurement method and summarized the theoretical side. When an altered wavelength of laser and electric power, lamp applied electric power, we measured the relative density of the metastable state in mercury after observing a laser induced fluorescence signal of 404.8nm and 546.2nm, and confirmed the horizontal distribution of plasma density in the discharge lamp. Due to this generation, the extinction of atoms in a metastable state occurred through collision, ionization, and excitation between plasma particles. The density and distribution of the metastable state depended on the energy and density of plasma particles, intensely This highlights the importance of measuring density distribution in plasma electric discharge mechanism study The results confirmed the resonance phenomenon regarding the energy level of atoms along a wavelength change, and also confirmed that the largest fluorescent signal in 436nm, and that the density of atoms in 546.2nm ($6^3S_1 {\to} 6^3P_2$ ) were larger than 404.8nm ($6^3S_1 {\to} 6^3P_1$). According to the increase of lamp applied electric power, plasma density increased, too. When increased with laser electric power, the LIF signal reached a saturation state in more than 2.6mJ. When partial plasma density distribution along a horizontal axis was measured using the laser induced fluorescence method, the density decreased by recombination away from the center.

반도체 패키징용 에폭시 기반 접합 소재 및 공정 기술 동향 (Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging)

  • 엄용성;최광성;최광문;장기석;주지호;이찬미;문석환;문종태
    • 전자통신동향분석
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    • 제35권4호
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    • pp.1-10
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    • 2020
  • Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

횡방향 전자빔여기 XeCl 엑시머 레이저의 출력특성 (Output Ccharacteristics of XeCl Excimer Laser Excited by Transeverse-Electron-Beam)

  • 류한용;이주희;김용평
    • 한국광학회지
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    • 제5권3호
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    • pp.386-393
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    • 1994
  • XeCl 엑시머 레이저를 횡방향의 전자빔으로 여기하여 이의 출력특성을 조사하였다. 전자빔의 출력은 880kV, 21kA(70ns, FWHM)이며 전자빔의 전류밀도는 다이오드(A-K) 간격과 공진기 외부에 설치한 펄스자계코일(4.7kG)로 제어하였다. 레이저 매질에 주입되는 전자빔의 축적에너지는 35J(4기압)이다. 축적에너지는 Radcolor film의 감광면적과 압력상승법에 의해 측정한 가스매질의 상승압력으로부터 환산된 수치이며, 이 때의 여기체적은 $320cm^{3}$이었다. 레이저 가스의 혼합비율은 HCl/Xe/Ar=0.2/6.3/93.5%이고 총압력이 3기압일 때, 최대효율 1.7%를 얻었다. 이 때의 출력에너지, 특성에너지는 각각 0.52J, 1.7J/l이었다. 실험결과의 분석을 위해 컴퓨터 시뮬레이션코드를 완성하였다. 시뮬레이션 결과는 실험결과와 잘 부합하고 있음을 확인하였고 그 결과를 이용하여 XeCl의 형성채널, 완화채널, 308nm의 흡수채널을 이론적으로 설명하였다.

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LIF를 이용한 Hg-Ar의 플라즈마 밀도 측정 (Plasma Density Measurement of Hg-Ar by LIF Method)

  • 최용성;황종선;박계춘;송민종;김형곤;이경섭
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 광주전남지부
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    • pp.27-32
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    • 2006
  • In this paper, we introduced a LIF measurement method and summarized the theoretical side. When an altered wavelength of laser and electric power, lamp applied electric power, we measured the relative density of the metastable state in mercury after observing a laser induced fluorescence signal of 404.8nm and 546.2nm, and confirmed the horizontal distribution of plasma density in the discharge lamp. Due to this generation, the extinction of atoms in a metastable state occurred through collision, ionization, and excitation between plasma particles. The density and distribution of the metastable state depended on the energy and density of plasma particles, intensely. This highlights the importance of measuring density distribution in plasma electric discharge mechanism study. The results confirmed the resonance phenomenon regarding the energy level of atoms along a wavelength change, and also confirmed that the largest fluorcscent signal in 436nm, and that the density of atoms in 546.2nm ($6^3S_1{\rightarrow}6^3P_2$) were larger than 404.8nm ($6^3S_1{\rightarrow}6^3P_2$). According to the increase of lamp applied electric power, plasma density increased, too. When increased with laser electric power, the LIF signal reached a saturation state in more than 2.6mJ. When partial plasma density distribution along a horizontal axis was measured using the laser induced fluorescence method, the density decreased by recombination away from the center.

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그라비아 인쇄물의 망점 형성을 위한 포토레지스터 코팅층의 레이저 직접 페터닝 (Laser Direct Patterning of Photoresist Layer for Halftone Dots of Gravure Printing Roll)

  • 서정;이제훈;한유희
    • 한국레이저가공학회지
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    • 제3권2호
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    • pp.35-43
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    • 2000
  • Laser direct patterning of the coated photoresit (PMER-NSG31B) layer was studied to make halftone dots on gravure printing roll. The selective laser hardening of photoresist by Ar-ion laser(wavelength : 333.6nm∼363.8nm) was controlled by the A/O modulator. The coating thickness in the range of 5㎛∼11㎛ could be obtained by using the up-down directional moving device along the vertically located roll. The width, thickness and hardness of the hardened lines formed under laser power of 200∼260㎽ and irradiation time of 4.4∼6.6$\mu$ sec/point were investigated after developing. The hardened width increased according to the increase of coating thickness. Though the hardened thickness was changed due to the effect of the developing solution, the hardened layer showed good resistance to the scratching of 2H pencil. Also, the hardened minimum line widths of 10㎛ could be obtained. The change of line width was also found after etching, and the minimum line widths of 6㎛ could be obtained. The hardened lines showed the good resistance to the etching solution. Finally, the experimental data could be applied to make gravure halftone dots using the developed imaging process, successfully.

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Gravure Halftone Dots by Laser Direct Patterning

  • Jeong Suh;Lee, Jae-Hoon
    • International Journal of Precision Engineering and Manufacturing
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    • 제3권1호
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    • pp.26-32
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    • 2002
  • Laser direct patterning of the coated photoresist (PMER-NSG31B) layer was studied to make halftone dots on the gravure printing roll. The selective laser hardening of the photoresist by Ar-ion laser(wavelength: 333.6∼363.8 nm) was controlled by the A/O modulator. The coating thickness in the range of 5∼11㎛ could be obtained by using the up-down directional moving device along the vertically located roll. The width, thickness and hardness of the hardened lines farmed under the laser power of 200∼260mW and irradiation time of 4.4∼6.6 $\mu$ sec/point were investigated after developing. The hardened width increased as the coating thickness increased. Though the hardened thickness was changed due to the effect of the developing solution, the hardened layer showed good resistance to the scratching of 2H pencil. Also, the hardened minimum line width of 10㎛ could be obtained. The change of line width was also found after etching, and the minimum line widths of 6㎛ could be obtained. The hardened lines showed the good resistance to the etching solution. Finally, the experimental data could be applied to make gravure halftone dots using the developed imaging process, successfully.

레이져 CVD에 의한 $SiO_2$막의 형성기구 모델링에 관한 연구 (A Study on the mechanism of $SiO_2$ film deposition by Laser CVD)

  • 류지호;소황영;김영훈;성영권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1995년도 하계학술대회 논문집 C
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    • pp.1149-1151
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    • 1995
  • In order to examine the deposition mechanism for $SiO_2$ by ArF(193nm) excimer Laser using $Si_2H_6$ and $N_2O$ gas mixture, deposition rate and refractive index were measured and creative modeling on film deposition was established by suggesting now precursor and film growing mechanism.

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광음향 효과를 이용한 2층 무반사 코팅막의 열확산도 측정 (Thermal diffusivity measurement of two-layer ar-coating systems using photoacoustic effects)

  • 권경업;최문호;김석원;한성홍;김종태
    • 한국광학회지
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    • 제9권6호
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    • pp.380-384
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    • 1998
  • 최근 고출력 에너지를 가진 레이저가 개발됨에 따라 레이저에 사용되는 반사경은 높은 열충격에도 견디며 효율적으로 냉각되어야 하므로 열확산도가 큰 광학박막의 연구가 중요하다. 본 연구에서는 굴절률이 다른 두 물질 MgFz와 ZnS의 증착 속도를 10$\AA$/s, 20$\AA$/s로 하고, 증착시 기판온도를 5$0^{\circ}C$, 10$0^{\circ}C$, 15$0^{\circ}C$, 20$0^{\circ}C$로 각각 다르게 하여 2층의 무반사막을 증착한 후 광음향효과를 이용하여 박막면에 수직한 방향의열확산도를 측정하였다. 시편 설계시 각 물질의 광학적 두께는 광원인 Ar+ 레이저(λ=514.5 nm)광에 대하여 MgFz 는 5/4λ이고, ZnS 는 λ가 되도록 하였고, 제작된 시료에 입사하는 광의주파수를 변화시키며 시료에서 발생되는 광음향신호의 크기를 측정하여 증착조건이 다를 때의 열확산도를 구하였다. 그 결과 증착속도가 10$\AA$/s 일 때와 기판온도가 15$0^{\circ}C$일 경우에 열확산도가 가장 큰 값을 나타내었다.

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