• Journal of Industrial Technology
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• v.29 no.A
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• pp.27-36
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• 2009

Reliability plays a pivotal role in products safety and quality. DoD RIAC recently developed a new reliability prediction methodology, $217Plus^{TM}$, for electronic systems. It officially replaces the well-known MIL-HDBK-217 and is expected to be widely used. Although theoretic study about $217Plus^{TM}$ and its application towards field systems seem to be attractive, it is also desirable to understand the general background of its development. In this paper, we performed a historical review of the arenas related to reliability prediction. Due to the vast of materials, our scope was limited to the development of $217Plus^{TM}$. We first reviewed Rome Laboratory and RIAC. We then explained the development course of reliability methods, MIL-HDBK-217, PRISM, and 217-Plus. This review will form not only a good understanding of the methodology but a basis for future study. We conclude this study with provision of future research areas.

• Journal of Applied Reliability
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• v.11 no.4
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• pp.387-398
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• 2011

$217Plus^{TM}$, a newly developed as a surrogate of the MIL-HDBK-217, may be widely applied for reliability predictions of electronic systems. In this study, we performed sensitivity study of the $217Plus^{TM}$ system model to various parameters. Specific attention was put to logistics model and its behavior has been examined in terms of non-component failure causes. We first briefly explained the $217Plus^{TM}$ methodology with system level failure rate evaluation. We then applied experimental designs with several failure causes as factors. We used an orthogonal array with three levels of each parameter. Our results indicate that cannot duplicate, induced, and wear-out causes have dominant effects on the system failures and design, parts, and system management have much less but a little strong effects. The results in this study not only figure out the behavior of the predicted failure rate as functions of failure causes but provide meaningful guidelines for practical applications.

• Journal of Korean Society for Quality Management
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• v.39 no.4
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• pp.507-515
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• 2011

MIL-HDBK-217 has played a pivotal role in reliability prediction of electronic equipments for more than 30 years. Recently, RIAC developed a new methodology $217Plus^{TM}$which officially replaces MIL-HDBK-217. Sensitivity analysis of the 217Plus component models to various parameters has been performed and meaningful observations have been drawn in this study. We first briefly reviewed the $217Plus^{TM}$ methodolog and compared it with the conventional model, MIL-HDBK-217. We then performed sensitivity analysis $217Plus^{TM}$ component models to various parameters. Based on the six parameters and an orthogonal array selected, we have performed indepth analyses concerning parameter effects on the model. Our result indicates that, among various parameters, operating temperature and temperature rise during operation have the most significant impacts on the life of a component, and thus a design robust to high temperature is the most importantly required. Next, year of manufacture, duty cycle, and voltage stress are weaker but may be significant when they are in heavy load conditions. Although our study is restricted to a specific type of diodes, the results are still valid to other cases. The results in this study not only figure out the behavior of the predicted failure rate as a function of parameters but provide meaningful guidelines for practical applications.

• Journal of Industrial Technology
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• v.28 no.B
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• pp.215-226
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• 2008

MIL-HDBK-217 has widely been used for electronics reliability predictions. Recently, the $217Plus^{TM}$ has been developed by DoD RIAC and may replace MIL-HDBK-217. A overview of the $217Plus^{TM}$ has been performed in this paper. We first reviewed the overall concepts and reliability prediction procedures. We then explained the component models and the system level model with process grading concepts. Bayesian approach incorporating field data into the predicted failure rate is another feature of this methodology.

• Journal of Industrial Technology
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• v.28 no.B
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• pp.227-234
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• 2008

Reliability predictions for selected electronic parts using 217-Plus have been performed in this study. 217-Plus has recently developed and may be applied for electronics failure prediction as a surrogate of MIL-HDBK-217. We first briefly reviewed 217-Plus component models. Based on three selected components, predictions using both MIL-HDBK-217 and 217-Plus have been made and the results were compared. Even though the comprehensive conclusion may be drawn from extensive component and system level analyses, the results in this study may provide general insights towards reliability through two specifications.

• Proceedings of the Korean Reliability Society Conference
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• 2011.06a
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• pp.257-264
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• 2011

In this study, we performed sensitivity study of the $217Plus^{TM}$ system model to various parameters. Specific attention was put to logistics model and its behavior has been examined in terms of non-component failure causes. We first briefly explained the $217Plus^{TM}$ methodology with system level failure rate evaluation. We then applied experimental designs with several failure causes as factors. We used an orthogonal array with three levels of each parameter. Our results indicate that cannot duplicate, induced, and wear-out causes have dominant effects on the system failures and design, parts, and system management have much less but a little strong effects. The results in this study not only figure out the behavior of the predicted failure rate as functions of failure causes but provide meaningful guidelines for practical applications.