• Journal of the Korea Furniture Society
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• v.15 no.2
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• pp.1-17
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• 2004

This paper attempted to review measuring methods of formaldehyde emission from wood-based panel products. Methods included for the discussion were desiccator methods, extraction method, and various chamber methods. First, the procedures and testing conditions of 24-hour desiccator method was critically reviewed, and an improvement of this method was proposed to meet international standards. Two different small chamber methods ($20\ell$ and $1m^3$ chamber methods) were also compared in terms of their advantages and disadvantages. In addition, the regulation levels of formaldehyde emission of wood-based composite panels were compared for different countries. The selection of a reference method of measuring formaldehyde emission of wood panel products should consider the ease of conducting test and cost required. Results should be exchangeable for different methods.

• Journal of the Korean Wood Science and Technology
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• v.35 no.5
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• pp.24-37
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• 2007

The Korean Ministry of Environment started controlling indoor air quality (IAQ) in 2004 through the introduction of a law regulating the use of pollutant emitting building materials. The use of materials with formaldehyde emission levels above $1.25 mg/m^2{\cdot}h$ (JIS A 1901, small chamber method) has been prohibited. This level is equivalent to the $E_2$ grade ($>5.0mg/{\ell}$) of the desiccator method (JIS A 1460). However, the $20{\ell}$ small chamber method requires a 7-day test time to obtain the formaldehyde and volatile organic compound (VOC) emission results from solid building interior materials. As a approach to significantly reduce the test time, the field and laboratory emission cell (FLEC) has been proposed in Europe with a total test time less than one hour. This paper assesses the reproducibility of testing formaldehyde and TVOC emissions from wood-based composites such as medium density fiberboard (MDF), laminate flooring, and engineered flooring using three methods: desiccator, perforator and FLEC. According to the desiccator and perforator standards, the formaldehyde emission level of each flooring was ${\le}E_1$ grade. The formaldehyde emission of MDF was $3.48 mg/{\ell}$ by the desiccator method and 8.57 g/100 g by the perforator method. To determine the formaldehyde emission, the peak areas of each wood-based composite were calculated from aldehyde chromatograms obtained using the FLEC method. Formaldehyde, acetaldehyde, propionaldehyde, butyraldehyde and benzaldehyde were detected as aldehyde compounds. The experimental results indicated that MDF emitted chloroform, benzene, trichloroethylene, toluene, ethylbenzene, m,p-xy-lene, styrene, and o-xylene. MDF emitted significantly greater amounts of VOCs than the floorings did.

• Journal of the Korean Wood Science and Technology
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• v.34 no.5
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• pp.29-41
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• 2006

This study was to investigate the effect of adding additive as tannin, rice husk and charcoal, for reducing the formaldehyde emission level, on the adhesion properties of urea-formaldehyde (UF) resin for particleboard. We controlled the hot-pressing time, temperature and pressure to determine the bonding strength and formaldehyde emission. Blends of various UF resin/additives (tannin, rice husk and charcoal) compositions were prepared. To determine and compare the effect of additives (tannin, rice husk and charcoal) content, 0, 5, 10 and 15%, by weight of UF resin, were used. $NH_4Cl$ as hardener added. To determine the level of formaldehyde emission, we used the desiccator, perforator and 20 L-small chamber method. The formaldehyde emission level decreased with increased additions of additive (except rice husk). Also, increased hot-pressing time decreased formaldehyde emission level. At a charcoal replacement ratio of only 15%, the formaldehyde emission level is under F ✩ ✩ ✩ ✩ grade (emit < $0.3mg/{\ell}$). Curing of the high tannin additive content in this adhesive system indicated that the bonding strength increased. But, in the case of rice husk and charcoal, the bonding strength was much lower due to the inorganic substance. Furthermore, rice husk was poor in bonding strength as well as formaldehyde emission than tannin and charcoal.

• Journal of the Korean Wood Science and Technology
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• v.45 no.5
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• pp.580-587
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• 2017

Woodfiber insulation board can be considered as a one of the key material for low energy consumption, comfortable and safety construction of residential space because of its eco-friendly and high thermal insulation performance. This study was carried out to investigate the formaldehyde (HCHO) total volatile organic compounds (TVOC) emission properties and combustion shapes by flame test of low density fiberboards (LDFs) prepared with different adhesives. HCHO TVOC emission and combustion properties of LDFs prepared by melamine urea formaldehyde (MUF), phenol formaldehyde (PF), emulsified methylene diphenyl diisocyanate (eMDI) and latex resin adhesives were measured by desiccator method, 20 L chamber method, and flame test, respectively. As results, LDFs manufactured by MUF, eMDI and latex resin adhesives satisfied the Super $E_0$ grade of HCHO emission performance except PF resin. Furthermore, TVOC emission of all LDFs were satisfied the Korean indoor air quality standard (below $400{\mu}g/m^2{\cdot}h$). Especially, LDF with eMDI resin adhesive showed the lowest HCHO and TVOC emissivity, that $0.14mg/{\ell}$, $12{\mu}g/m^2{\cdot}h$, respectively. However, eMDI emitted the small amount ($3{\mu}g/m^2{\cdot}h$) of toluene in VOC components. In the flame test, LDF with MUF resin adhesives showed the most favorable shape after flame test compare to LDFs prepared other adhesives. Based on HCHO and TVOC emission, and combustion shapes, MUF resin adhesive may be recommended to prepare LDF for insulation purpose.