• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.19-24
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• 2009

Formation of an adhesion/barrier layer and a seed layer by sputtering techniques followed by electroplating has been one of the most widely used methods for the filling of through-Si via (TSV) with high aspect ratio for 3-D packaging. In this research, the adhesion and diffusion-barrier properties of the $TaN_x$ film deposited by reactive sputtering were investigated. The adhesion strength between Cu film and $SiO_2$/Si substrate was quantitatively measured by $180^{\circ}$ peel test and topple test as a function of the composition of the adhesive $TaN_x$ film. As the nitrogen content increased in the adhesive $TaN_x$ film, the adhesion strength between Cu and $SiO_2$/Si substrate increased, which was attributed to the increased formation of interfacial compound layer with the nitrogen flow rate. We also examined the diffusion-barrier properties of the $TaN_x$ films against Cu diffusion and found that it was improved with increasing nitrogen content in the $TaN_x$ film up to N/Ta ratio of 1.4.

• Journal of the Korean Applied Science and Technology
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• v.21 no.3
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• pp.259-266
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• 2004

Film properties of monodispersed model composite latexes with particle size of 190 nm, which consist of n-butyl acrylate as a soft phase monomer and methyl methacrylate as a hard phase monomer with different morphology was examined. Five different types of model latexes were used in this study such as random copolymer particle, soft-core/hard-shell particle, hard-core/soft-shell particle, gradient type particle, and mixed type particle. Tensile strength and tensile elongation at break of final films were evaluated. Those properties can be interpreted in terms of PBA/PMMA phase ratio and their morphology. The interfacial adhesion strength was also evaluated using $180^{\circ}$ peel strength measurement and cross hatch cutting test.