• 반도체디스플레이기술학회지
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• 제18권1호
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• pp.92-96
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• 2019

In the presence of ${\mu}-tip$ embedded in a slot-die head for stripe coatings, there arises the capillary flow that limits an increase of the stripe density, which is required for the potential applications in organic light-emitting diode displays. With an attempt to suppress it, we have employed a computational fluid dynamics software and performed simulations by varying the ${\mu}-tip$ length and the contact angles of the head lip and ${\mu}-tip$. We have first demonstrated that such a capillary flow phenomenon (a spread of solution along the head lip) observed experimentally can be reproduced by the computational fluid dynamics software. Through simulations, we have found that stronger capillary flow is observed in the hydrophilic head lip with a smaller contact angle and it is suppressed effectively as the contact angle increases. When the contact angle of the head lip increases from $16^{\circ}$ to $130^{\circ}$, the distance a solution can reach decreases sharply from $256{\mu}m$ to $44{\mu}m$. With increasing contact angle of the ${\mu}-tip$, however, the solution flow along the ${\mu}-tip$ is disturbed and thus the capillary flow phenomenon becomes more severe. If the ${\mu}-tip$ is long, the capillary flow also appears strong due to an increase of flow resistance (electronic-hydraulic analogy). It can be suppressed by reducing the ${\mu}-tip$ length, but not as effectively as reducing the contact angle of the head lip.

• KIEE International Transactions on Electrophysics and Applications
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• 제4C권4호
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• pp.149-154
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• 2004

This paper presents a silicon probe tip for vertical probe card application. The silicon probe tip was fabricated using MEMS technology such as porous silicon micromachining and deep- RIE (reactive ion etching). The thickness of the silicon epitaxial layers was 5 ${\mu}{\textrm}{m}$ and 7 ${\mu}{\textrm}{m}$, respectively. The width and length were 40 ${\mu}{\textrm}{m}$ and 600 ${\mu}{\textrm}{m}$, respectively. The probe structure was a multilayered structure and was composed of Au/Ni-Cr/Si$_3$N$_4$/n-epi layers. The height of the curled probe tip was measured as a function of the annealing temperature and time. Resistance characteristics of the probe tip were measured using a touchdown test.

• 한국재료학회지
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• 제10권2호
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• pp.124-127
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• 2000

Si FEA로부터 tip의 표면을 Ti 금속으로 silicidation한 새로운 3극형 Ti-silicided Si FEA를 제작하고 이의 전계 방출특성을 조사하였다. 제작된 소자에서 단위 pixel(pixel area : $1000{\mu\textrm{m}}{\times}1000{$\mu\textrm{m}}$, tip array : $200{\mu\textrm{m}}{\times}200{$\mu\textrm{m}}$)을 통해 측정된 전계 방출 특성은 $10^8Torr$의 고진공 상태에서 turn-on 전압이 약 70V로, 아노드 방출전류의 크기와 current degradation이 $V_A=500V,\;V_G=150V$ 바이어스 아래에서 각각 2nA/tip와 0.3%/min로 나타났다. 3극형 Ti-silicided Si FEA의 낮은 turn-on 전압과 높은 전류안정성은 Si tip 표면에 형성된 실리사이드 박막의 열화학적 안정성과 낮은 일함수에 기인하는 것으로 판단된다.

• 한국재료학회지
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• 제10권4호
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• pp.301-304
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• 2000

Si FEA로 부터 tip의 표면을 Co 금속으로 silicidation한 새로운 3극형 Co-silicided Si FEA를 제작하고 이의 전계 방출특성을 조사하였다. $10^{-8}Torr$의 고진공상태에서 제작된 소자의 단위 pixel(pixel 면적 : $250{\mu\textrm{m}}{\times}250{\mu\textrm{m}}$, tip 어레이 : $45{\times}45$)를 통해 측정된 turn-on 전압은 약 35V로, 아노드 전류는 $V_A=500V,\;V_G=55V$ 바이어스 아래에서 약 $1.2{\mu\textrm{A}}(0.6nA/tip)$로 나타났다. 제작된 소자는 초기 과도상태를 제외하면 장시간의 동작을 통해 전계방출 전류의 감소없이 매우 안정된 전기적 특성을 나타내었다. Co-silicided Si FFA 의 낮은 turn-on 전압과 높은 전류안전성은 Si tip 표면에 형성된 실리사이드 박막의 열화학적 안전성과 낮은 일함수에 기인하는 것으로 판단된다.

• 전자공학회논문지 IE
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• 제44권3호
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• pp.1-5
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• 2007

Si 팁 기술의 장점을 살리면서 팁을 실리사이드화하여 팁표면의 열화학적 내구성을 증가시키고 전계방출 전류밀도를 금속 팁에 가깝게 끌어올릴 수 있는 새로운 3극관 형태의 전계방출 팁 구조를 제작하였다. 제작된 소자의 전계방출 특성을 $10^{-8}Torr$의 초고진공 상태에서 캐소드-애노드 간격을 $100{\mu}m$로 하여 측정한 결과, turn-on 전압이 약 40V로, 방출전류가 인가 전압 150V에서 약 $69{\mu}A$로 나타났다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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• pp.1160-1163
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• 1999

In this study, we developed FE-tip lithography system that could apply to multi-tip system and did lithography using FE-tip. The software that control FE-tip lithography system, was proposed for acquiring more adaptive data to compensate the effect of fluctuation. We found that the fluctuation effect was reduced. The minimum line width was related to applied voltage and we observed a movement of Z-axis piezo stage to correct the error of this system. When FE current was 5nA, scanning speed was $3{\mu}m/sec$ and applied voltage was 200V, we made a line pattern which had minimum line width of 614 nm. If we reduce applied voltage to several decades and increase scanning speed to $20{\mu}m/sec$, it is possible to set the minimum line width of 100 nm. The proposed system can be easily applied to multi FE-tip lithography system.

• 대한기계학회논문집
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• 제14권6호
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• pp.1495-1508
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• 1990

본 연구에서는 전류밀도와 가공시간을 변화시켰을 때의 가공량, 가공상태를 검토해 보았으며, 촉침홀더의 가공각도를 달리하거나 재부착문제를 해결하기 위한 마 스크의 사용여부에 따른 촉침의 가공상태를 알아보기 위해 초기선단반경 2$\mu\textrm{m}$, 선단각 90˚의 다이아몬드 촉침을 이온스파터 가공기를 사용하고, 가공조건을 변화시켜서 초 정밀 가공품의 표면거칠기 측정에 적합한 0.5$\mu\textrm{m}$ 이하의 미세한 선단반경을 갖는 촉침 을 가공하기 위한 가공조건에 대한 실험을 하였다.

• 대한전자공학회논문지SD
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• 제38권9호
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• pp.605-610
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• 2001

본 연구에서는 저전압 구동형 정전방식을 이용하여 마이크론 이하 간격(sub-micron gap)을 갖는 마이크로액추에이터를 제작하였다. 사각 팁과 삼각 팁의 두 가지 방식으로 마이크로액추에이터를 제작하여 비교하였다. 삼각 팁으로 제작된 마이크로액추에이터의 gap은 0.55㎛∼l.35㎛었다. 0.55㎛ gap을 갖는 제작된 마이크로액추에이터의 경우에 13V의 낮은 전압에서 1㎛의 변위와 2.3μN의 발생력을 나타내었다. 이 마이크로액추에이터의 1차 공진주파수의 측정값의 23kHz이었다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.256-259
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• 2008

An micro-probe tip must be manufactured using thin film to evaluate integrity of the semiconductor with narrow distance between pads. In this study, fatigue tests were performed for BeCu thin film which is used in micro-probe tip of semiconductor test machine. The thin film was manufactured by electro plating process, and the specimens were fabricated by wire-cut electric discharge method to make hour glass type specimen of $5000{\mu}m$ width, $29200{\mu}m$ length and $30{\mu}m$ thickness. The fatigue test of load control with 10Hz frequency was performed, in ambient environment. The fatigue cycles were tension-tension with mean stress, at stress ratio, R=0.1.

• 반도체디스플레이기술학회지
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• 제18권2호
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• pp.6-10
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• 2019

In the presence of $\mu-tip$ for narrow stripe coating, there appears lateral capillary flow along the hydrophilic head lip because the $\mu-tip$ has some resistance to flow. It was known to be suppressed by increasing the contact angle of the head lip. In this paper, we have demonstrated by computational fluid dynamics(CFD) simulations that it can also be suppressed by the formation of micro-patterns on the shim and meniscus guide embedded into the slot-die head. To optimize the micro-patterned structure, we have performed simulations by varying the groove width, depth, and clearance. In the absence of micro-patterns, it is shown by experiment and simulation that the solution spreads to a distance of $1,300{\mu}m$ from the ${\mu}-tip$. In the presence of micro-patterns with the groove width and clearance of $50{\mu}m$, the distance the solution spreads is reduced to $260{\mu}m$. However, no further suppression in the capillary flow is observed with micro-patterns with the groove width of $40{\mu}m$ or less. It is also observed that the capillary flow is not affected by the groove depth if it is larger than $10{\mu}m$. We have shown that the distance the solution spreads can be reduced further to $204{\mu}m$ by coating a hydrophobic material (contact angle of $104^{\circ}$) on the surface of micro-patterns having the groove width and clearance of $50{\mu}m$.