• Title/Summary/Keyword: $^{64}Cu$

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산란계 사료내 Cu-Methionine chelate 첨가가 생산성과 난황 cholesterol에 미치는 영향

  • 임희석;백인기
    • Proceedings of the Korea Society of Poultry Science Conference
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    • 2001.11a
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    • pp.64-65
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    • 2001
  • Seven hundred twenty 56 wks old ISA brown layers were assigned to five dietary treatments for 12 weeks. Each treatment was consisted of 6 replications with 24 birds. Control diet was formulated to have 15% CP, 2800kcal/kg ME, 3.8% Ca and Cu-methionine chelate(Cu-Met) were added to control diet at the level of 25, 50, 75, 100ppm in Cu. Supplementation of 25, 75, 100ppm Cu in from of Cu-Met s increased egg productions by 2.11, 3.84, 3.66%, compare with control. Egg weight also increased by supplementation of Cu at 50, 75, 100ppm in Cu-Met. Gizzard erosion tened to increase by supplementary Cu-Met but were not significantly different. Supplementation of Cu at the level of 75, 100ppm Cu-Met treatments decreased crude fat level in liver. It concludes that supplementation of Cu at level in the form of 75 or 100ppm methionine chelate improves egg production with heavier egg weight and decreases crude fat content in the liver.

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Electrochemical Behaviors of Copper-1-(2-pyridylazo)-2-naphthol Complex in Acetonitrile (아세토니트릴 용매 중에서 Copper-1-(2-pyridylazo)-2-naphthol 착물의 전기화학적 성질)

  • Zun-Ung Bae;Sang-O Oh;Hee-Bong Song;Tae-Myung Park
    • Journal of the Korean Chemical Society
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    • v.37 no.10
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    • pp.888-894
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    • 1993
  • The electrochemical behaviors of copper-1-(2-pyridylazo)-2-naphthol(Cu-PAN) complex in acetonitrile (AN) solution have been investigated by the use of cyclic voltammetry, DC-polarography, controlled potential coulometry and UV-Vis spectroscopy. Cu-PAN complex in acetonitrile exhibit three reduction waves at -1.27 V, -1.64 V and -2.08 V vs. Ag/AgNO$_3$(AN). The numbers of electron involved in each reduction step was calculated with controlled potential coulometry, and reduction product was identified with UV-Vis spectrum. As the result, we proposed the reduction mechanism of the Cu-PAN complex in acetonitrile.

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Permeability Aftereffect in FeCuNbSiB Alloy (FeCuNbSiB 합금의 투자율 여효)

  • Lee, Yong-Ho;Sin, Yong-Dol;No, Tae-Hwan;Gang, Il-Gu
    • Journal of the Korean Magnetics Society
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    • v.2 no.3
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    • pp.216-221
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    • 1992
  • Annealing effects on the permeability aftereffect(disaccommodation) of liquid quenched single strip $Fe_{73.5}Cu_1Nb_3Si_{16}B_{6.5}$ alloys were investigated with pulse method. The initial susceptibility X, $B_{10},$ (the flux density at 10 Oe) and disaccommodation intensity D (D = [X(1 s)-X(64 s)]/X(1 s), where X(1 s) and X(64 s) are the susceptibility of 1 and 64 s of rest time after A. C. demagnetization) were about 800, 0.8 T and 16 %, respectively. The soft magnetic properties were improved with isothermal annealing for 1 hour at $300{\sim}600^{\circ}C.$ X, $B_{10},$ and D at $570^{\circ}C$ of optimum annealing temperature were 15000, 1.2 T and 1.1 %, respectively. The origin of the change of characteristics were examined with fine crystalline structure and magnetostriction.

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Fabricated Tunable Capacitor of Air-gap Variations Using Cu Electroplating (구리 전해도금을 이용한 Air-gap 변화 방식의 Tunable capacitor 제조)

  • Lee, Jae-Ho;Seo, Chang-Taeg;Lee, Myoung-Bok;Lee, Jong-Hyun
    • Proceedings of the KIEE Conference
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    • 2001.11a
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    • pp.62-64
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    • 2001
  • In this paper, we present the fabrication and performance of tunable capacitors with various structural geometry of plates. Experimental devices have been fabricated using Cu-electroplating techniques and standard MEMS techniques. In particular, the thickness of electroplated Cu is designed below $0.5{\mu}m$ for lower actuation voltage. The fabricated tunable capacitors has been tested from $OV{\sim}42V$ and achieves a tuning ratio of $46%{\sim}64.2%$.

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Enhancement of Skin Permeation of Wrinkle Improvement Peptides GHKs Using Liposomes Containing Skin Penetrating Peptides (피부 투과 펩티드가 함유된 리포좀을 이용한 주름 개선 펩티드 GHKs의 피부 흡수 증진)

  • Park, Su In;An, Gyu Min;Kim, Min Gi;Heo, Soo Hyeon;Shin, Moon Sam
    • Journal of the Korean Applied Science and Technology
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    • v.36 no.3
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    • pp.853-865
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    • 2019
  • In this study, the skin permeability was measured by adding skin penetrating peptides, arginine oligomers R4(tetra-D-arginine), R6(hexa-D-arginine) to little skin-permeable wrinkle improvement peptides GHK, GHK-Cu, and Pal-GHK liposomes, and the results were analyzed by the following six cases. (1) In cases where only wrinkle improvement peptides GHK, GHK-Cu, and Pal-GHK were contained liposomes; the final cumulative permeations in 24 hours were 6.05%, 7.4%, and 8.83% respectively. (2) In cases where arginine oligomers R4, R6 were added to GHK liposomes; the final cumulative permeations in 24 hours were 13.63% and 7.68%. (3) In cases where R4, R6 were added to GHK-Cu liposomes; the final cumulative permeations in 24 hours were 15.46% and 8.64%. (4) In cases where R4, R6 were added to Pal-GHK liposomes; the final cumulative permeations in 24 hours were 16.9% and 10.67%. (5) In cases where R4 were added to GHK, GHK-Cu, and Pal-GHK liposomes; the final cumulative permeations in 24 hours were 13.63%, 15.46%, and 16.9% respectively. (6) In cases where R6 were added to GHK, GHK-Cu, and Pal-GHK liposomes; the final cumulative permeations in 24 hours were 7.68%, 8.64%, and 10.67% respectively. This experiment showed that skin absorption of GHK was increased by copper ion (Cu2+) and palmitic acid and skin absorption of wrinkle improvement peptides was enhanced by cell penetrating peptides, and R4 showed higher effect than R6 in GHK, GHK-Cu and Pal-GHK. Through this process, we propose broad use and application in wrinkle improvement functional cosmetics by presenting the optimal conditions for increasing skin absorption of GHK, GHK-Cu, thus maximizing its efficacy.

Effects of Cu Wire's Shape on the Plating Property of Sn-Pb Solder for Photovoltaic Ribbons

  • Cho, Tae-Sik;Chae, Mun-Seok;Cho, Chul-Sik
    • Transactions on Electrical and Electronic Materials
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    • v.15 no.4
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    • pp.217-220
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    • 2014
  • We studied the plating properties of Sn-Pb solder according to the shape of the Cu wire's cross-section for photovoltaic ribbon. The thickness of the Sn-Pb layer largely decreased to 29% on a curved Cu surface, compared to a flat Cu surface. This phenomenon is caused by the geometrical decrease in the contact angle of the liquid Sn-Pb solder and an increase in the surface energy of the solid/vapor on the curved Cu surface. We suggest a new ribbon's design where the Cu wire's cross-section is a semi-ellipse. These semi-ellipse ribbons can decrease the use of Sn-Pb solder to 64% and increase the photovoltaic efficiency, by reducing the contact area between the ribbon and cell, to 84%. We also see an improvement of reflectivity in the curved surface.