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http://dx.doi.org/10.4191/KCERS.2009.46.5.510

The Microstructure and Mechanical Behavior of Deformed Silicon  

Kim, Seong-Won (Engineering Ceramic Center, Korea Institute of Ceramic Engineering and Technology)
Kim, Hyung-Tae (Engineering Ceramic Center, Korea Institute of Ceramic Engineering and Technology)
Zuo, Jian-Min (Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign)
Pacaud, Jerome (Lab de Metallurgie Physique, University of Poitiers)
Publication Information
Journal of the Korean Ceramic Society / v.46, no.5, 2009 , pp. 510-514 More about this Journal
Abstract
The microstructure and mechanical behavior of deformed silicon were characterized using transmission electron microscopy and nanoindentation. Structural defects such as stacking faults and dislocations were observed through the diffraction contrast in transmission electron microscopy. The mechanical properties of deformed Si and 111 Si wafer and mechanical behaviors during contact loading were also characterized using nanoindentation. The hardness values of silicon samples were ${\sim}10$ GPa and the elastic modulus were varied with indentation conditions. Elbow or pop-out behaviors were found in load-displacement curves of silicon samples during nanoindentation. Deformed silicon showed 'pop-out' behavior more frequently under the load of 10 mN, which is attributed to the structural defects in deformed silicon.
Keywords
Deformed silicon; Microstructure; Mechanical behavior; Nanoindentation;
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