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http://dx.doi.org/10.5140/JASS.2002.19.4.283

THERMAL ANALYSIS OF FIMS TDC AND LVPS ELECTRONIC BOARDS  

Seon, K.I. (Space Science Research Division, Korea Astronomy Observatory)
Yuk, I.S. (Space Science Research Division, Korea Astronomy Observatory)
Nam, U.W. (Space Science Research Division, Korea Astronomy Observatory)
Jin, H. (Space Science Research Division, Korea Astronomy Observatory)
Park, J.H. (Space Science Research Division, Korea Astronomy Observatory)
Rhee, J.G. (Space Science Research Division, Korea Astronomy Observatory)
Ryu, K.S. (Satellite Technology Research Center, KAIST)
Lee, D.H. (Satellite Technology Research Center, KAIST)
Oh, H.S. (Satellite Technology Research Center, KAIST)
Kong, K.K. (Space Science Research Division, Korea Astronomy Observatory)
Han, W. (Space Science Research Division, Korea Astronomy Observatory)
Min, K.W. (Satellite Technology Research Center, KAIST)
Edelstein, J. (Space Sciences Lab., Uni. of California, Berkeley)
Korpela, E. (Space Sciences Lab., Uni. of California, Berkeley)
Publication Information
Journal of Astronomy and Space Sciences / v.19, no.4, 2002 , pp. 283-292 More about this Journal
Abstract
Electronic boards of Far-ultraviolet IMaging Spectrograph (FIMS) should be designed to maintain their performances, and their temperatures should be remained within the allowed temperatures in operational environments. Thermal analysis at the electronic board level has been performed, and it is confirmed the electronics parts could be kept within their allowed temperature ranges.
Keywords
finite-elements methods; electronic boards; heat transfer;
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