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http://dx.doi.org/10.5757/JKVS.2011.20.4.266

Physical Property of W-C-N Diffusion Barrier through Stress-Strain curve  

Lee, Kyu-Young (Department of Nano & Electronic Physics, Kookmin University)
Kim, Soo-In (Department of Nano & Electronic Physics, Kookmin University)
Park, Sang-Jae (Korea Science Academy)
Lee, Dong-Kwan (Korea Science Academy)
Jeong, Yong-Rok (Korea Science Academy)
Jung, Jun (Korea Science Academy)
Lee, Jong-Rim (Korea Science Academy)
Lee, Chang-Woo (Department of Nano & Electronic Physics, Kookmin University)
Publication Information
Journal of the Korean Vacuum Society / v.20, no.4, 2011 , pp. 266-270 More about this Journal
Abstract
This paper suggest tungsten (W)-carbon (C)-nitrogen (N) thin films for diffusion barrier that W is main material and C and N are additives. W-C-N thin films are deposited with fixed rates of W and C but with a variation of $N_2$ gas flow and W-C-N thin films are heated at $600^{\circ}C$. From the experimental results, the variation of elastoplastic region for W-C-N thin film measured by tribological property is larger than that of elastic region with a variation of $N_2$ gas flow. These results show that the $N_2$ gas flow is more directly related with the elastoplastic region of W-C-N thin film. Nanoindenting test executed 16 times consecutively and we got the stress-strain curve graphs and hardness datas at each sample. Through the stress-strain curve graphs, the standard diviation of stress-strain curve for $N_2$ gas flow rate of 2.0 sccm is smaller than that of 0, 0.5, 1.5 sccm. Consequently, the physical stability of W-C-N thin film depends on the flow rate of $N_2$ gas.
Keywords
Diffusion barrier; W-C-N thin film; Nano-indenter; Stress-strain curve;
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Times Cited By KSCI : 4  (Citation Analysis)
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