1 |
K. lida, J. S. Kim, S. Nakamura, and G. Sawa, IEEE Trans. Electr. Insul., 27, 301 (1992).
|
2 |
S. S. Bamji, A. T. Bulinski, and R. J. Densley, IEEE Trans. on Electrical Insulation, EI-21 (1986).
|
3 |
R. M. Hill and A. K. Jonscher, Comtemp. Poly., 24, 77 (1983).
|
4 |
M. R. Wertheimer, L. Paquin, H. P. Schreiber, and S. A. Boggs, IEEE Conference Record of IEEE Symposium on Electrical Insulation (1976).
|
5 |
K. Yahagi, IEEE Trans. on Elect. Insul., EI-15, 241 (1980).
DOI
|
6 |
F. W. Billneyer, Textbook of Polymer Science (Inter. Sci. Pub., John Wiley and Son, New York, 1980). p. 141.
|
7 |
M. Ieda, G. Sawa, and S. Kato, J. of Appl. Phys., 3737 (1971). [DOI: http://dx.doi.org/10.1063/1.1659678]
DOI
|
8 |
T. Tanaka, G. C. Montanari, and R. Mulhaupt, IEEE Transactions on Dielectric and Electrical Insulation, 11, 763 (2004). [DOI: http://dx.doi.org/10.1109/TDEI.2004.1349782]
DOI
|
9 |
S. Singha and M. J. Thomas, IEEE Transactions on Dielectric and Elecrical Insulation, 15, 12 (2008). [DOI: http://dx.doi.org/10.1109/T-DEI.2008.4446732]
DOI
|
10 |
S. Masuda, S. Okuzumi, R. Kurniant, Y. Murakami, M. Nagao, Y. Murata, and Y. Sekiguchi, IEEE, 2007 Annual Report Conference on Electrical Insulation and Dielectric, 290 (2007).
|
11 |
J. Y. Shin, H. D. Park, J. Y. Lee, and J. W. Hong, Trans. Electr. Electron. Mater., 11, 42 (2010). [DOI: http://dx.doi.org/10.4313/TEEM.2010.11.1.042]
DOI
|