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http://dx.doi.org/10.4313/JKEM.2013.26.1.49

Thermal Properties of Semiconductive Composites for DC Power Cable  

Lee, Ki-Joung (Department of Information & Communication Engineering, Wonkwang University)
Seo, Bum-Sik (Department of Information & Communication Engineering, Wonkwang University)
Yang, Jong-Seok (DYM Co. Ltd.)
Seong, Baeg-Yong (DYM Co. Ltd.)
Park, Dae-Hee (Department of Information & Communication Engineering, Wonkwang University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.26, no.1, 2013 , pp. 49-55 More about this Journal
Abstract
In this paper, semiconducting shield specimens for a DC cable os fabricated and characterized by measurement of volume resistance, tensile strength, and the coefficient of expansion to show the electrical and mechanical characteristics of the semiconducting shield. Due to the PTC phenomenon, the volume resistance at $25^{\circ}C$ increases rapidly in comparison to the volume resistance at $90^{\circ}C$. Since the compounding ration of carbon black is low, the tensile strength and density become lower and the coefficient of expansion is increased. As the general specification of the tensile strength and density is $0.8kgf/mm^2$ and 150%, respectively, the fabricated specimen in this paper has excellent mechanical characteristic.
Keywords
Semiconductive material; Carbon black; Heat capacity; Melting temperature;
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