Effects of Leveler on the Trench Filling during Damascene Copper Plating
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Lee, Yu-Young
(Eco-Nano Research Center, Korea Institute of Science and Technology, School of Metallurgy & Materials Engineering, Kookmin University)
Park, Young-Joon (Nano Device Research Center, Korea Institute of Science and Technology, School of Metallurgy & Materials Engineering, Kookmin University) Lee, Jae-Bong (School of Metallurgy & Materials Engineering, Kookmin University) Cho, Byung-Won (Eco-Nano Research Center, Korea Institute of Science and Technology) |
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4 |
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5 |
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6 |
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DOI |
7 | Yann Ratieuville, Philippe Viers, Jean Alexandrem Cerard Durand, Electrochemical Communications 2, 839(2000). DOI ScienceOn |
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9 |
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DOI ScienceOn |
10 |
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11 |
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DOI ScienceOn |
12 |
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DOI |
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DOI |
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20 |
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DOI ScienceOn |
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