3-Dimensional Thermoforming Computer Simulation Considering Orthotropic Property of Film |
Son, Hyun-Myung
(Dept. of Mechanical Information Engineering, Graduate School of Seoul National University of Science & Technology)
Yoon, Seok-Ho (I-Components Co., Ltd.) Lee, Ki-Ho (I-Components Co., Ltd.) Lyu, Min-Young (Dept. of Mechanical Information Engineering, Graduate School of Seoul National University of Science & Technology) |
1 | Erchiqui, Fouad, Augustin Gakwaya, and Mohamed Rachik, "Dynamic finite element analysis of nonlinear isotropic hyperelastic and viscoelastic materials for thermoforming applications", Polym. Eng. Sci., 45, 125 (2005). DOI |
2 | Chen, Hui-Li, Rean-Der Chien, and Shia-Chung Chen, "Using thermally insulated polymer film for mold temperature control to improve surface quality of microcellular injection molded parts", Int. Commun. Heat Mass Transfer., 35, 991 (2008). DOI |
3 | Gong, Yao, Kyoung Je Cha, and Jang Min Park, "Deformation characteristics and resistance distribution in thermoforming of printed electrical circuits for in-mold electronics application", J. Adv. Manuf. Technol., 108, 749 (2020). DOI |
4 | Atmani, Oualid, et al. "Experimental investigation and constitutive modelling of the deformation behaviour of high impact polystyrene for plug-assisted thermoforming", Mech. Ind., 21, 607 (2020). DOI |
5 | Truckenmuller, Roman, et al. "Thermoforming of film-based biomedical microdevices", Adv. Mater., 23, 1311 (2011). DOI |
6 | Srinivasan, K. P. and T. Muthuramalingam, "In-depth scrutinization of In-Mold Electronics for Automotive applications", J. Phys.: Conf. Ser., (2021). |
7 | Kim, Gugyong, Kwango Lee, and Sungsu Kang, "Prediction of the film thickness distribution and pattern change during film insert thermoforming", Polym. Eng. Sci., 49, 2195 (2009). DOI |
8 | Lee, H. S. and Y. G. Yoo, "Numerical and experimental analysis of laminated-film thickness variation in vacuum-assisted thermoforming", Trans. Mater. Process, 22, 171 (2013). DOI |
9 | Nied, H. F., C. A. Taylor, and H. G. Delorenzi, "Three-dimensional finite element simulation of thermoforming", Polym. Eng. Sci., 30, 1314 (1990). DOI |
10 | Chang, Yao-Wen and Jung-Ho Cheng, "Numerical and experimental investigation of polycarbonate vacuum-forming process", J. Chin. Inst. Eng., 36, 831 (2013). DOI |
11 | Nam, Gi Joon, Jae Wook Lee, and Kyung Hyun Ahn, "Three-dimensional simulation of thermoforming process and its comparison with experiments", Polym. Eng. Sci., 40, 2232 (2000). DOI |
12 | Kang, Dong Jun, et al. "Silica nanoparticle-embedded urethane acrylate nanohybrid thermosets for photo-patternable transparent hard coating", Int. Polym. Sci. Technol., 105, 19 (2016). |
13 | Rudolph Szilard, Theories and Applications of Plate Analysis: Classical, Numerical and Engineering Methods, Wiley, USA, 2004. |
14 | Shin, Yoo Bin, et al. "Modified inverted layer processing of ultrathin touch sensor impregnating Ag nanowires with both enlarged surface coverage of conductive pathways and ultralow roughness", Electron. Mater. Lett., 16, 247 (2020). DOI |
15 | Hwang, Bu-Yeon, et al. "Highly stretchable and transparent electrode film based on SWCNT/Silver nanowire hybrid nanocomposite", Composites, Part B., 151, 1 (2018). DOI |
16 | Li, Junpeng, et al. "Healable capacitive touch screen sensors based on transparent composite electrodes comprising silver nanowires and a furan/maleimide diels-alder cycloaddition polymer", ACS Nano., 8, 12874 (2014). DOI |
17 | Seo, Jiae, et al. "Foldable and extremely scratch-resistant hard coating materials from molecular necklace-like crosslinkers", ACS Appl. Mater. Interfaces, 11, 27306 (2019). DOI |
18 | M.-Y. Lyu, Principles and Applications of Injection Molding, Gyomoon, Seoul, South of Korea, 2022. |