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| 1 |
Electromigration-induced void evolution in upper and lower layer dual-inlaid Copper interconnect structures
Pete, D.J.;Mhaisalkar, S.G.;Helonde, J.B.;Vairagar, A.V.;
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Techno-Press
, v.1, no.2, pp.109-113,
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| 2 |
Structural and electrical properties of perovskite Ba(Sm1/2Nb1/2)O3-BaTiO3 ceramic
Nath, K. Amar;Prasad, K.;
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Techno-Press
, v.1, no.2, pp.115-128,
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| 3 |
Modeling and multiple performance optimization of ultrasonic micro-hole machining of PCD using fuzzy logic and taguchi quality loss function
Kumar, Vinod;kumari, Neelam;
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Techno-Press
, v.1, no.2, pp.129-146,
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| 4 |
Mechanical and metallurgical properties of diffusion bonded AA2024 Al and AZ31B Mg
Mahendran, G.;Balasubramanian, V.;Senthilvelan, T.;
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Techno-Press
, v.1, no.2, pp.147-160,
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| 5 |
Preparation and characterization of nanoflake composite multi core-shell SrFe12O19/Fe3O4/PEG/PPy
Hosseini, Seyed Hossein;Majidpour diz, Mohammad;
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Techno-Press
, v.1, no.2, pp.161-168,
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