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| 1 |
Dependence of Doping on Indium Content in InGaN/GaN Multiple Quantum Wells for Effective Water Splitting
Bae, Hyojung;Bang, Seung Wan;Ju, Jin-Woo;Ha, Jun-Seok;
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The Korean Microelectronics and Packaging Society
, v.25, no.3, pp.1-5,
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| 2 |
Effect of Post-annealing on the Interfacial adhesion Energy of Cu thin Film and ALD Ru Diffusion Barrier Layer
Jeong, Minsu;Lee, Hyeonchul;Bae, Byung-Hyun;Son, Kirak;Kim, Gahui;Lee, Seung-Joon;Kim, Soo-Hyun;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.25, no.3, pp.7-12,
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| 3 |
Optimization of Soldering Process of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Alloys for Solar Combiner Junction Box Module
Lee, Byung-Suk;Oh, Chul-Min;Kwak, Hyun;Kim, Tae-Woo;Yun, Heui-Bog;Yoon, Jeong-Won;
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The Korean Microelectronics and Packaging Society
, v.25, no.3, pp.13-19,
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| 4 |
Improvement in Thermomechanical Reliability of Power Conversion Modules Using SiC Power Semiconductors: A Comparison of SiC and Si via FEM Simulation
Kim, Cheolgyu;Oh, Chulmin;Choi, Yunhwa;Jang, Kyung-Oun;Kim, Taek-Soo;
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The Korean Microelectronics and Packaging Society
, v.25, no.3, pp.21-30,
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| 5 |
A Study of Failure Mechanism through abnormal AlXOY Layer after pressure Cooker Test for DRAM device
Choi, Deuk-Sung;Jeong, Seung-Hyun;Choi, Chae-Hyoung;
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The Korean Microelectronics and Packaging Society
, v.25, no.3, pp.31-36,
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| 6 |
Fabrication of Fluorescent Oxygen Sensor Probe Module Based on Planner Lightwave Circuits using UV Imprint Lithography
Ahn, Ki Do;Oh, Seung hun;
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The Korean Microelectronics and Packaging Society
, v.25, no.3, pp.37-41,
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| 7 |
Wearable Resistive Strain Sensor Networked by Wireless Data Transfer System
Oh, Je-Heon;Lee, Sung-Ju;Shin, Hae-Rin;Kim, Seung-Rok;Yoo, Ju-Hyun;Park, Jin-Woo;
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The Korean Microelectronics and Packaging Society
, v.25, no.3, pp.43-47,
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| 8 |
Durability of Nano-/micro- Pt Line Patterns Formed on Flexible Substrate
Park, Tae Wan;Choi, Young Joong;Park, Woon Ik;
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The Korean Microelectronics and Packaging Society
, v.25, no.3, pp.49-53,
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| 9 |
Analysis of Shear Stress Type Piezoresistive Characteristics in Silicon Diaphragm Structure
Choi, Chae-Hyoung;Choi, Deuk-Sung;Ahn, Chang-Hoi;
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The Korean Microelectronics and Packaging Society
, v.25, no.3, pp.55-59,
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| 10 |
A Study on the Self-annealing Characteristics of Electroplated Copper Thin Film for DRAM Integrated Process
Choi, Deuk-Sung;Jeong, Seung-Hyun;
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The Korean Microelectronics and Packaging Society
, v.25, no.3, pp.61-66,
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| 11 |
Fabrication Process and Power Generation Characteristics of Thermoelectric Thin Film Devices for Micro Energy Harvesting
Oh, Tae Sung;
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The Korean Microelectronics and Packaging Society
, v.25, no.3, pp.67-74,
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