In the manufacture process of refrigerator cabinet, polyurethane(PU) liquid firstly is injected between outer plate and inner case in high temperature about $40^{\circ}C$, and PU foam is generated and solidified to the room temperature. There will be great residual stress in the PU foam, especially at the corners after the whole refrigerator is completely assembled. The stress condition will become more complicated under operating condition because of the large temperature difference between the freezing room and outer plate. And also, there are great differences of properties for plastic and steel which would cause different deformation under temperature gradient. The steel outer plate would expand compared to the PU foam or ABS material under operation condition, which induces a thermally bowing deformation in the refrigerator cabinet. The objective of this paper is to design an optimum bead structure or to use reinforcement in the refrigerator except for improving material properties in order to decrease the deformation.

MCP 기술을 이용한 반도체 칩에서 문제가 되는 방열문제를 해결하기 위한 방법으로 열전 냉각 소자를 이용하여 열을 방출 시키는 방법에 관하여 연구를 수행하였다. 시뮬레이션을 통하여 열전 소자가 작동할 때, 흡수하는 열량을 계산할 수 있었으며, 열전 소자의 냉각 성능도 평가 할 수 있었다. 이러한 열 해석 및 열전 해석을 통하여 적층 구조의 MCP 모듈을 위한 열 설계 및 효율적 냉각을 가능하게 할 수 있을 것이다.