반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

Numerical Analysis of the Thermodynamic Stability of Aqueous Cu-Ni-S-H2O System for the Preparation of Thin Copper-Nickel Multi-nano-Layers by Using Pulse Electro-forming

  • Sang Bum, Lee (Department of Software, Dankook University) ;
  • Yong Choi (Department of Material, Dankook Univerisy )
  • 투고 : 2024.08.07
  • 심사 : 2024.09.12
  • 발행 : 2024.09.30
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초록

Thermodynamic solution stability of aqueous copper-nickel-sulfur system was numerically analyzed to produce thin copper-nickel nano-multi-layers by pulse electro-forming. The main program for numerical analysis was written by C# language, which was composed of the data input, numerical calculation, decision and plotting sub-programs. From the thermodynamic data of 32-feasible phases of the Cu-Ni-S-H2O system, the phase stability diagram of the Cu-Ni-S-H2O system was constructed. It revealed the electro-forming condition of the copper and the nickel was VSHE<0.35 for copper deposition, VSHE<-0.24 for nickel deposition, pH=1.0 and 25℃ in the sulfide bath. The coppernickel multi-layers was well produced by electro-forming in the sulfide bath with two-wave pulse voltages of - 0.2VSHE, -0.5 mA/cm2, and 25 seconds for copper deposition and -1.7 VSHE, -50 mA/cm2 and 80 seconds for nickel deposition, at pH=1.0 and 25℃. From TEM and EDX analysis the Cu-Ni multi-layers with about 5 ㎛ thick had the copper-rich phase of about 20 nm in thick and the nickel rich phase of about 25 nm in thick, respectively.

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참고문헌

  1. J. A. McGeough, M. C. Leu, K. P. Rajurkar, A. K. M. De Silva, Q. Liu, "Electroforming Process and Application to Micro/Macro Manufacturing", CIRP AnnalsManufacturing Technology, vol. 50(2), pp. 499-514, 2001.
  2. Yong Choi and Nam Ik Baik, "Preparation of Nickel Thin Sheets with Nano-sized Ferrites by Combustion Synthesis and Electroforming," Japanese Journal of Applied Physics, vol. 50(1S2), pp. 159, 2011.
  3. Yong Choi, "Ultrasonic Agitation-Floating Classification of Nano-Sized Ba-Mg Ferrites Particles Formed by Using Self-Propagating High Temperature Synthesis and Fabrication of Nickel-Ferrites Thin Sheet by PulseElectroforming," Journal of Nanoscience and Nanotechnology, vol. 13(1), pp. 607-610, (2013)
  4. Man Kim, Joo-Yul Lee, Sik-Chol Kwon, Dongsoo Kim, In-Gon Kim and Yong Choi, "Application of Small Angle Neutron Scattering to Analyze Precision Nickel Mesh for Electro-magnetic Interference Shielding Formed by Continuous Electroforming Technique," Physica B: Condensed Matter, vol. 385 (2), pp. 914-916, (2006).
  5. M.Pourvaix, "Thermodynamique des Solutions Aqueuses Dilutes--Representation Graphique duRSle du pH et du Poteatiel," Meinema, Delft (1945).
  6. P. A. Brook, "Potential-pH Diagrams at Elevated Temperatures," Corrosion Science, vol. 12, pp. 297-306. (1972).
  7. K. Osseo-Asare and K. K. Mishra, "Solution Chemical Constraints in the Chemical-Mechanical Polishing of Copper: Aqueous Stability Diagrams for the Cu-H2O and Cu-NH3-H2O Systems," Journal of Electronic Materials, vol. 25(10), pp. 1599-1607, (1996)
  8. R.M. Lamya and L. Lorenzen, "A Semi-empirical Kinetic Model for the Atmospheric Leaching of a Ni-Cu Converter Matte in Copper Sulphate-sulphuric Acid Solution," The Journal of The Southern African Institute of Mining and Metallurgy, vol. 109, pp. 755-760, (2006)
  9. M W Chase, NIST-JANAF Thermochemical Tables. 4th ed, American Chemical Society, 1998.
  10. Jeng-Kuei Chang, Shih-Hsun Hsu, I-Wen Sun and WenTa Tsai, "Formation of Nanoporous Nickel by Selective Anodic Etching of the Nobler Copper Component from Electrodeposited Nickel-Copper Alloys," J. Phys. Chem., vol. 112(5), 1371-1376, 2008.