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실리콘 고분자 복합소재의 열전도도와 기계적 물성에 관한 연구

A Study on the Thermal Conductivity and Mechanical Properties of Electrical Insulation Polymer Composite Materials

  • 최원일 (나노팀) ;
  • 최계광 (공주대학교 디지털융합금형공학과)
  • Won-il Choil (NanoTIM) ;
  • Kye-Kwang Choi (Department of Digital Convergence Metal Mold Design Engineering, Kongju National University)
  • 투고 : 2024.01.16
  • 심사 : 2024.09.30
  • 발행 : 2024.09.30

초록

With the development of technology in the electrical and electronic field, research on heat dissipation materials that can efficiently emit and control heat to solve the heat generation problem is being actively conducted. Since heat dissipation materials require electrical insulation and thermal conductivity, the polymer composite material was manufactured by mixing chemically stable silicone resins and ceramic fillers, and thermal conductivity and mechanical properties were observed. At the same filling amount, the larger the particle size and the higher the high thermal conductivity filler was added, the higher the thermal conductivity was, mechanical properties were confirmed to have higher tensile strength and elongation as the particles were smaller and the tissue was denser. After selecting materials in consideration of thermal conductivity and mechanical properties, an appropriate mixing ratio is considered important.

키워드

참고문헌

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