Journal of Sensor Science and Technology (센서학회지)

The Korean Sensors Society (한국센서학회)
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Strategy for Enhancing Functional Density of Stretchable Electronics by Self-Sensing Interconnects

  • Dongwuk Jung (School of Mechanical Engineering, Gwangju Institute of Science and Technology Mechanical engineering bldg) ;
  • Hunpyo Ju (Electronics and Telecommunications Research Institute (ETRI))
  • Received : 2024.08.21
  • Accepted : 2024.09.02
  • Published : 2024.09.30
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Abstract

Stretchable electronics are emerging as next-generation devices owing to their unique deformable characteristics, which allow their application on nonplanar and even deformable surfaces. However, to implement advanced functions in stretchable electronics, conventional rigid components must be integrated to reduce the overall stretchability of these systems. Various design strategies have been proposed to address this challenge. One notable approach involves dividing the electronics into nonstretchable regions for component integration and stretchable interconnector regions that absorb strain. However, stretchable interconnectors, which electrically connect nonstretchable circuits, may reduce the functional density of electronics. In this study, we present a design strategy for self-sensing stretchable electronics by embedding strain sensors within stretchable interconnectors. We provide both computational and experimental evidence demonstrating the advantages of this approach and validate the feasibility of the design by developing a stretchable light-emitting diode (LED) matrix with self-sensing capabilities for measuring the stretching ratio. The results presented herein offer valuable strategies for advancing applications that require stretchable electronics with high functional densities. Moreover, the self-sensing design approach has significant potential for application in proprioceptive electronics.

Keywords

Acknowledgement

This work was supported by the Korea Evaluation Institute of Industrial Technology (KEIT) grant funded by the Korean government (MOTIE, Grant No. RS-2022-00154781, Development of large-area wafer-level flexible/stretchable hybrid sensor platform technology for form-factor-free highly integrated convergence sensor).

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