Journal of the Korean Wood Science and Technology

The Korean Society of Wood Science & Technology (한국목재공학회)
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Review on Water Vapor Diffusion through Wood Adhesive Layer

  • Omar Saber ZINAD (Faculty of Wood Engineering and Creative Industries, University of Sopron) ;
  • Csilla CSIHA (Faculty of Wood Engineering and Creative Industries, University of Sopron)
  • Received : 2023.11.04
  • Accepted : 2024.04.08
  • Published : 2024.07.25
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Abstract

Contrary to other materials like metals, glass, etc., wood continuously interacts with the environment, increasing and decreasing its moisture content according to the humidity of the air and changing its dimensions by swelling or shrinking. Water diffusion through laminated solid wood is crucial in wood bonding processes. The adhesive layer might block the diffusion if the water vapor diffusion is perpendicular to the bond line. As a result of this blockage, different proportions of deformation appear on the two sides of the bond line, which causes stresses in the bonded assembly. The question arises of how long the bonded structure will keep its integrity due to moisture diffusion blockage, inevitable tensions appearing in the glue line, and how these stresses could be avoided. With cross laminated timber (CLT) solid wood panel production, this question gains new importance. Despite the relevance, only a limited number of publications are available. Comprehensive research would also be necessary considering both the molecular structure and diffusion properties of the adhesive adjusted to the wood species (covering possible substituting wood species, too). Overall, this review serves as a resource for enhancing our understanding of water vapor diffusion through wood adhesive layers and provides insights that have implications for reducing stresses in bonded wood assemblies and the performance of the bonded group over time. Furthermore, identifying knowledge gaps is necessary to establish the basis for investigating the diffusion property of CLT panels.

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