Acknowledgement
This study was financially supported by the National Research Foundation of Korea (NRF) grant funded by the Korean government (MSIP) (No. NRF-2022R1A5A1030054).
References
- H. Lipson and M Kurman, Indianapolis, Indiana: John Wiley and Sons, Inc, (2013)
- A. Bandyopadhyay, K. D. Traxel, M. Lang, M. Juhasz, N. Eliaz, and S. Bose: Mater. Today., 52 (2022) 207.
- J. Giannatisis and V. Dedoussis: Int. J. Adv. Manuf. Technol., 40 (2009) 116.
- S. C. Altiparmak, V. A. Yardley, Z. Shi, and J. Lin: Int. J. Lightweight Mater. Manuf., 4 (2021) 246.
- S. Wickramasinghe, T. Do, and P. Tran: Polymers., 12 (2020) 1529.
- K. Chatterjee and T. K. Ghosh: Ghosh., 32 (2020) 1902086.
- D. M. Nieto, V. C Lopez, and S. I. Molina: Addit. Manuf., 23 (2018) 79.
- C. L. Cramer, E. Ionescu, M. G. Zajac, A. T. Nelson, Y. Katoh, J. J. Haslam, L. Wondraczek, T. G. Aguirre, S. Leblanc, H. Wang, M. Masoudi, E. Tegeler, R. Riedel, P. Colombo, and M. M. Joladan: J. Eur. Ceram. Soc., 42 (2022) 3049.
- S. Jeon, S Park, Y Song, J Park, H Park, B Lee, and H Choi: J. Powder Mater., 30 (2023) 463.
- S. Park, Y. Song, J. Yeo, S. Han, and H. Choi: J. Powder Mater., 30 (2023) 255.
- Y. Li and Q. Bai: Chin. J. Mech. Eng., 30 (2017) 515. https://doi.org/10.1007/s10033-017-0121-5
- W. S. Cai, H. Z. Lu, H. Z. Li, Z. Liu, H. B. Ke, W. H. Wang, and C. Yang: J. Mater. Sci. Technol., 138 (2023) 80.
- M. P. Behera, T. Dougherty, and S. Singamneni: Procedia Manuf., 30 (2019) 159.
- B. Kianian, Fort Collins, Colorado, USA: Wohlers Associates, Inc, (2016)
- L. Yang, K. Hsu, B. Baughman, D. Godfrey, F. Medina, M. Menon, and S. Wiener, Cham: Springer, (2017) 45.
- ASTM, ASTM International. (2012)
- J. W. Choi and H. C. Kim: J. Kor. Soc. Manuf. Process Eng., 14 (2015) 1.
- I. H. Lee, H. C. Kim, and D. G. Ahn: J. Kor. Soc. Precision Eng., 37 (2015) 929.
- T. DebRoy, H. L. Wei, J. S. Zuback, T. Mukherjee, J. W. Elmer, J. O. Milewski, A.M. Beese, A. Wilson-Heid, A. De, W. Zhang, and W. Zhang: Progress in Mater. Sci., 92 (2018) 112. https://doi.org/10.1016/j.pmatsci.2017.10.001
- V. Manvatkar, A. De, and T. DebRoy: J. Appl. Phys., 116 (2014) 124905. https://doi.org/10.1063/1.4896751
- V. Manvatkar, A. De, and T. DebRoy: Mater. Sci. Technol., 31 (2015) 924.
- T. Mukherjee, H. L. Wei, A. De, and T. DebRoy: Comput. Mater. Sci., 150 (2018) 369.
- C. Korner, E. Attar, and P. Heinl: J. Mater. Process. Technol., 211 (2011) 978.
- B. de La Batut, O. Fergani, V. Brotan, M. Bambach, and M. El Mansouri: J. Manuf. Mater. Process., 1 (2017) 3.
- P. Burgardt and C. R. Heiple: Heiple: Welding J., 71 341.
- R. T. Brown: J. Laser Appl., 20 (2008) 201.
- Y. Javid, M. Ghoreishi, and S. Shamsaei: Lasers in Engineering (Old City Publishing)., 22 (2012) 1.
- P. Farahmand and R. Kovacevic: Opt. Laser Technol., 63 (2014) 154.
- A. J. Pinkerton and L. Li: J. Eng. Manuf., 218 (2004) 363.
- X. Wang, T. Laoi, J. Bonse, J.-P. Kruth, B. Lauwers, and L. Froyen: Int. J. Adv. Manuf. Technol., 19 (2002) 351.
- T. DebToy and S. A. David: Rev. Mod. Phys., 67 (1995) 85.
- J. H. K. Tan, S. L. Sing, and W. Y. Yeong: Virtural and Physical Prototyping., 15 (2020) 87. https://doi.org/10.1080/17452759.2019.1677345
- L. Ming, D. Wenchao, A. Elwany, Z. Pei, and C. Ma: Manuf. Sci. Eng., 142 (2020) 090801.
- J. A. Gonzalez, J. Mireles, Y. Lin, and R. B Wicker: Ceram. Int., 42 (2016) 10559.
- C. Meir, R. Weissbach, J. Winberg, W. A. Wall, and A. J. Hart: J. Mater. Process. Technol., 266 (2019) 484. https://doi.org/10.1016/j.jmatprotec.2018.10.037
- G. Miao, W. Du, Z. Pei, and C. Ma: Int. Manuf. Sci. Eng. Conf., 1 (2019)
- H. Tan: Chem. Eng. Sci., 153 (2016) 93. https://doi.org/10.1016/j.ces.2016.07.015
- M. Uhlmann: J. Comput. Phys., 209 (2005) 448. https://doi.org/10.1016/j.jcp.2005.03.017
- L. R. Madhavrao and R. Rafagopalan: J. Mater. Res., 4 (1989) 1251.
- K. Mori, H. Matsubara, and N. Noguchi: Int. J. Mechanical Sci., 46 (2004) 841.
- W. Boettinger, J. Warren, C. Beckermann, and A. Karma: Annu. Rev. Mater., 32 (2002) 163.