과제정보
이 연구는 2021년도 산업통상자원부 및 산업기술평가관리원(KEIT) 연구비 지원에 의한 연구임 ('20015767').
참고문헌
- P. Zhu, D. Gastol, J. Marshall, R. Sommerville, V. Goodship, and E. Kendrick, "A review of current collectors for lithium-ion batteries", J. Power Sources, 485, 229321 (2021).
- H. Park, S.-J. Kim, Y.-j Song, H.-K. Shin, J.-B. Jeon, S.-D. Kim, J.-H. Kim, and H.-J. Lee, "Microstructure-controlled Electrodeposition of Mechanically Reliable Double-layered Thin Foils for Secondary Batteries", Met. Mater. Int., 30, 1430-1439 (2024). https://doi.org/10.1007/s12540-023-01576-7
- S.-J. Kim, H.-K. Shin, H. Park, and H.-J. Lee, "A Study on The Effect of Current Density on Copper Plating for PCB through Electrochemical Experiments and Calculations", J. Microelectron. Packag. Soc., 29(1), 49-54 (2022).
- F. Liu, A. Kubo, C. Nair, T. Ando, R. Furuya, S. Dwarakanath, V. Sundaram, and R. R. Tummala, "Next Generation Panel-Scale RDL with Ultra Small Photo Vias and Ultra-fine Embedded Trenches for Low Cost 2.5D Interposers and High Density Fan-Out WLPs", IEEE 66th Electronic Components and Technology Conference (ECTC), 1515-1521 (2016).
- C. H. Yu, L. J. Yen, C. Y. Hsieh, J. S. Hsieh, V. C. Y. Chang, C. H. Hsieh, C. S. Liu, C. T. Wang, K.-C. Yee, and D. C. H. Yu, "High Performance, High Density RDL for Advanced Packaging", 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 587-593 (2018).
- K. Son, G. Kim, and Y.-B. Park, "Effects of Dielectric Curing Temperature and T/H Treatment on the Interfacial Adhesion Energies of Ti/PBO for Cu RDL Applications of FOWLP", J. Microelectron. Packag. Soc., 30(2), 52-59 (2023).
- S.-H. Kim, H.-J. Lee, D. Josell, and T. P. Moffat, "Bottom-up Cu filling of annular through silicon vias: Microstructure and texture", Electrochimica Acta, 335, 135612 (2020).
- E.-S. Jang, E.-C. Noh, S.-J. Na, and J.-W. Yoon, "Properties of Cu Pillar Bump Joints during Isothermal Aging", J. Microelectron. Packag. Soc., 31(1), 35-42 (2024).
- Y. Kim, S. W. Park, M. S. Jung, J. H. Kim, and J. K. Park, "A Review on the Bonding Characteristics of SiCN for Low-temperature Cu Hybrid Bonding", J. Microelectron. Packag. Soc., 30(4), 8-16 (2023).
- R. Rosenberg, D. C. Edelstein, C.-K. Hu, and K. P. Rodbell, "Copper Metallization for High Performance Silicon Technology", Annu. Rev. Mater. Sci., 30, 229-262 (2000). https://doi.org/10.1146/annurev.matsci.30.1.229
- E. T. Ogawa, J. McPherson, J. A. Rosal, K. J. Dickerson, T.-C. Chiu, L. Y. Tsung, M. K. Jain, T. Bonifield, J. C. Ondrusek, and W. R. McKee, "Stress-Induced Voiding Under Vias Connected To Wide Ch Metal Leads", 40th Annual IEEE International Reliability Physics Symposium, 312-321 (2002).
- C. S. Hau-Riege, "An introduction to Cu electromigration", Microelectronics Reliability, 44(2), 195-205 (2004). https://doi.org/10.1016/j.microrel.2003.10.020
- J.-M. Paik, H. Park, Y.-C. Joo, and K.-C. Park, "Effect of dielectric materials on stress-induced damage modes in damascene Cu lines", J. Appl. Phys., 97(10), 104513 (2005).
- H. Park, M. Kraatz, J. Im, B. Kastenmeier, and P. S. Ho, "Simulation of Electrical and Mechanical Properties of Air-Bridge Cu Interconnects", 2006 IEEE International Reliability Physics Symposium Proceedings, 677-678 (2006).
- H. Park, S.-J. Hwang, and Y.-C. Joo, "Stress-induced surface damage and grain boundary characteristics of sputtered and electroplated copper thin films", Acta Materialia, 52(8), 2435-2440 (2004). https://doi.org/10.1016/j.actamat.2004.01.035
- H. Park, S.-H. Kim, W.-J. Lee, J.-W. Ha, S.-J. Kim, and H.-J. Lee, "Effect of Wire-Drawing Process Conditions on Secondary Recrystallization Behavior During Annealing in High-Purity Copper Wires", Met. Mater. Int., 27(7), 2220-2229 (2021). https://doi.org/10.1007/s12540-020-00682-0
- H.-K. Shin, S.-H. Kim, H. Park, and H.-J. Lee, "Multilayer Laminated Copper Electrodeposits and Their Mechanical Properties", J. Electrochem. Soc., 169(10), 102502 (2022).
- H. Park, W.-J. Lee, J.-H. Son, H.-K. Shin, S.-K. Hong, and H.-J. Lee, "Effects of Pilger Rolling and Heat Treatment on Microstructure and Corrosion Resistance of Ag-Electroplated 304 Stainless Steel Tubes", Met. Mater. Int., 28(8), 1881-1889 (2022). https://doi.org/10.1007/s12540-021-01089-1
- F. J. Humphreys and M. Hatherly, "Recrystallization and Related Annealing Phenomena", 1-220, Pergamon Press, Elsevier Science Ltd., Oxford, UK (1995).
- C. V. Thompson, "Structure Evolution during Processing of Polycrystalline films", Annu. Rev. Mater. Sci., 30, 159-190 (2000). https://doi.org/10.1146/annurev.matsci.30.1.159
- D. N. Lee, "Texture and Related Phenomena", 2nd edn., 280-484, The Korean Institute of Metals and Materials, Korea (2014).
- S. R. Kalindindi, "Polycrystal Plasticity: Constitutive Modeling and deformation processing", in Ph.D. Thesis, 5-185, Massachusetts Institute of Technology, Cambridge, UK (1992).
- F. Roters, P. Eisenlohr, T. R. Bieler, and D. Raabe, "Crystal Plasticity Finite Element Methods in Materials Science and Engineering", 13-91, WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim, Germany (2010).
- H. Park and D. N. Lee, "Effects of Shear Strain and Drawing Pass on the Texture Development in Copper Wire", Mater. Sci. Forum, 408-412, 637-642 (2002). https://doi.org/10.4028/www.scientific.net/MSF.408-412.637