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Research on Minimizing Output Degradation in HJT Cell Separation Using IR Laser Scribing

IR 레이저 스크라이빙에 의한 HJT 셀 분할 시 출력 감소율 최소화에 대한 연구

  • Eunbi Lee (Energy & Nano Technology R&D Group, Korea Institute of Industrial Technology) ;
  • Sungmin Youn (Energy & Nano Technology R&D Group, Korea Institute of Industrial Technology) ;
  • Minseob Kim (Energy & Nano Technology R&D Group, Korea Institute of Industrial Technology) ;
  • Jinho Shin (Energy & Nano Technology R&D Group, Korea Institute of Industrial Technology) ;
  • Yu Jin Kim (Energy & Nano Technology R&D Group, Korea Institute of Industrial Technology) ;
  • Jeonghun Kim (Energy & Nano Technology R&D Group, Korea Institute of Industrial Technology) ;
  • Min-Joon Park (Energy & Nano Technology R&D Group, Korea Institute of Industrial Technology) ;
  • Chaehwan Jeong (Energy & Nano Technology R&D Group, Korea Institute of Industrial Technology)
  • 이은비 (한국생산기술연구원 에너지나노그룹) ;
  • 윤성민 (한국생산기술연구원 에너지나노그룹) ;
  • 김민섭 (한국생산기술연구원 에너지나노그룹) ;
  • 신진호 (한국생산기술연구원 에너지나노그룹) ;
  • 김유진 (한국생산기술연구원 에너지나노그룹) ;
  • 김정훈 (한국생산기술연구원 에너지나노그룹) ;
  • 박민준 (한국생산기술연구원 에너지나노그룹) ;
  • 정채환 (한국생산기술연구원 에너지나노그룹)
  • Received : 2024.04.16
  • Accepted : 2024.06.17
  • Published : 2024.06.30

Abstract

One of the current innovation trends in the solar industry is the increase in the size of silicon wafers. As the wafer size increases, the series resistance of the module rises, highlighting the need for research on methods for cutting and bonding solar cells. Among these, the Infrared (IR) laser scribing technique has been extensively researched. However, there is still insufficient optimization research regarding the thermal damage caused by lasers on the Transparent Conductive Oxide (TCO) layer of Heterojunction (HJT) solar cells. Therefore, in this study, we systematically varied conditions such as IR laser scribing speed, frequency, power, and the number of scribes to investigate their impact on the performance of cut cells under each condition. Additionally, we conducted a comparative analysis of thermal damage effects on the TCO layer based on varying scribing depths.

Keywords

Acknowledgement

본 연구는 2021년도 산업통산자원부의 재원으로 한국에너지기술평가원(KETEP)의 지원과제인 "대면적 결정질/박막 실리콘 이종접합(HJT) 태양광 모듈 핵심소재 장비 공정 기술 개발"(No.20213030010240) 과제의 일환으로 수행되었습니다.

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