Journal of Sensor Science and Technology (센서학회지)

The Korean Sensors Society (한국센서학회)
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Effect of Adhesion Strength Between Flexible Substrates and Electrodes on the Durability of Electrodes

유연 기판과 전극 사이의 접합력이 전극의 내구성에 미치는 영향

  • Doyeon Im (Department of Mechanical Design Engineering, Andong National University) ;
  • Byoung-Joon Kim (Department of Advanced Materials Engineering, Tech University of Korea) ;
  • Geon Hwee Kim (School of Mechanical Engineering, Chungbuk National University) ;
  • Taechang An (Department of Mechanical Robotics Engineering, Andong National University)
  • 임도연 (안동대학교 기계설계공학과) ;
  • 김병준 (한국공학대학교 신소재공학과) ;
  • 김건휘 (충북대학교 기계공학부) ;
  • 안태창 (안동대학교 기계로봇공학과)
  • Received : 2024.02.29
  • Accepted : 2024.03.12
  • Published : 2024.03.31
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Abstract

Flexible electronic devices are exposed to repeated mechanical deformation; therefore, electrode performance is an important element. Recently, a new technology has been developed to improve the adhesion strength between polymer substrates and metal thin films through the cross-linking reaction of bovine serum albumin (BSA) bioconjugation proteins; however, additional performance evaluation as an electrode is necessary. Therefore, in this study, we investigated the effect of adhesive strength between a flexible substrate and a metal thin film on the performance of a flexible electrode. Cracks and changes in the electrical resistance of the electrode surface were observed through outer bending fatigue tests and tensile tests. As a result of a bending fatigue test of 50,000 cycles and a tensile test at 10% strain, the change in the electrical resistance of the flexible electrode with a high adhesion strength was less than 40%, and only a few microcracks were formed on the surface; thus, the electrical performance did not significantly deteriorate. Through this study, the relationship between the adhesion strength and electrical performance was identified. This study will provide useful information for analyzing the performance of flexible electrodes in the commercialization of flexible electronic devices in the future.

Keywords

Acknowledgement

본 연구는 2023, 2024년도 국립안동대학교 기본 연구지원사업에 의하여 연구되었습니다.

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